Hosiden Corporation

Naosuke Fukada

Kensuke Nakanishi

Ryuji Awamura

Toshiro Izuchi

Hidenori Motonaga

Hiroshi Yamagata

Mayumi Kaneko

Hideki Kozawa

A microphone assembly including a main board and a microphone. The microphone includes a capacitor or a MEMS chip, a case accommodating the capacitor or the MEMS chip, and a microphone board electrically connected to the capacitor or the MEMS chip. The microphone board has a larger outer dimension than the case and includes a fixing portion and a connecting portion. The case is fixed onto the fixing portion. The connecting portion is a portion of the microphone board, the portion being located outside the case and electrically and mechanically connected to the main board.

Microphone assembly

Affixed in intimate contact to the inside surface of a front boardof a conductive capsuleprovided with a receiving sound apertureis a conductive back electrode board provided with air vent apertureswhich are positioned not in alignment with the receiving sound aperture, these aperturesandbeing connected by a slitA polarized FEP filmwhich is an electret film is disposed on the surface of the back electrode boardopposite from the front board 10, and a conductive diaphragmis disposed on the surface of the FEPopposite from the back electrode boardwith a spacerinterposed therebetween which extends around the outer periphery of the opposite surface of the FEPThese component parts are accommodate in the capsuleto constitute an electret condenser microphone which is capable of suppressing sensitivity degradation due to ingress of grit from the outside to the electret film.

Microphone

Growing community of inventors

Kuratemachi, Japan

Naosuke Fukada