Panasonic Intellectual Property Management Co., Ltd.

Naoshi Yamaguchi

Koichi Nagai

Shingo Hamada

Yasuyuki Takano

Toshiro Kanda

Ichiro Nakayama

Noriyuki Suzuki

Yasushi Taniguchi

Masatoshi Miyasaka

Hiroshi Tanabe

Naoya Miyaji

Shigeru Sankawa, Sr

Kouji Arai

A method and an apparatus for collecting flux are disclosed. A rosin particle contained in an atmosphere gas, and a vapor of a solvent or an atomized solvent particle are mixed in a mixing section upstream of a flux collection unit-side inlet, and a gas containing a mixed particle is cleaned by electrostatic precipitation. The solvent particle adheres to the rosin particle, and forms an aggregate of larger particle size.

Flux collection method and flux collection apparatus

A reflow furnace that can reduce both the flux clinging defect in a circuit board, and the thermal cracking defect in an electronic component has a heat zone in which a circuit board with a mounted electronic component is heated, and a cooling zone in which the heated circuit board is cooled, and includes: a shield disposed between the heat zone and the cooling zone and having an opening for passage of the circuit board; and a tunnel-like cover physically coupled to the opening and extending along a transport direction of the circuit board.

Reflow furnace and soldering method

Provided is a resin determination method including: placing an object on a placement surface with a diffusion reflectance of equal to or greater than 80% in an effective wavelength region of infrared light and with arithmetic mean roughness of equal to or greater than 0.25 &#x3bc;m and equal to or less than 25 &#x3bc;m; irradiating the object with infrared light; receiving reflected light from the object that has been irradiated with the infrared light; and determining a resin type based on a reflection spectrum or an absorption spectrum obtained by the reflected light.

Resin determination method and resin determination apparatus

At a conveyor forefront portion, velocity distribution of an airflow is provided. The velocity distribution is wind velocity distribution in a vertical direction of an airflow from a surface of an upper rectifying plate to a surface of a conveyor at the conveyor forefront portion, and has a maximum value in a range of less than 10 mm downward of the vertical direction from the rectifying plate surface. Moreover, a ratio obtained by dividing the maximum value by a wind velocity in the vicinity of the surface of the conveyor is 4 or more, and 12 or less. In a range other than the range of less than 10 mm, the airflow has a wind velocity equal to the wind velocity in the vicinity of the surface of the conveyor.

Sorting device

The present invention addresses the problem of providing a novel silicon substrate having a textured surface by dry-etching the surface of a silicon substrate having (111) orientation and thereby forming a texture thereon. The present invention provides a silicon substrate having (111) orientation, said silicon substrate having a textured surface that includes multiple protrusions which each comprise three slant faces and have heights of 100 to 8000 nm. This process for producing a silicon substrate includes: a step of preparing a silicon substrate having (111) orientation; and a step of blowing an etching gas onto the surface of the silicon substrate, said etching gas containing one or more gases selected from the group consisting of ClF3, XeF2, BrF3, BrF5 and NF3.

Growing community of inventors

Osaka, Japan

Naoshi Yamaguchi