Dai Nippon Printing Co., Ltd.

Naonobu Yoshi

Mikiko Hojo

Tomoki Murata

Michihiro Ogura

Yoshinobu Omori

Shigehiro Ueno

Takeshi Sato

Kisei Matsumoto

Masanori Sawada

Shinsuke Nagino

Shinya Yoneda

The present invention is to provide a metal particle dispersion for electroconductive substrates, which has high dispersibility and dispersion stability and which is able to form a film that shows high electroconductivity after baking. Disclosed is a metal particle dispersion for electroconductive substrates, comprising metal particles, a dispersant and a solvent, wherein the dispersant is a graft copolymer having at least a constitutional unit represented by the following chemical formula (I) and a constitutional unit represented by the following chemical formula (II): (Symbols in the formulae are as described in the Description.)

Metal particle dispersion for electroconductive substrates, method for producing the same, and method for producing an electroconductive substrate

The present invention is to provide a dispersant which has excellent dispersibility and which is able to inhibit the oxidation of dispersed particles. Disclosed is a dispersant comprising a graft copolymer having a constitutional unit represented by the following general formula (I) and a constitutional unit represented by the following general formula (II): (Symbols shown in the general formulae (I) and (II) are as described in the Description.)

Dispersant, metal particle dispersion for electroconductive substrates, and method for producing electroconductive substrate

The present invention is to provide a metal particle dispersion which has low viscosity and excellent dispersibility and dispersion stability, and in which the precipitation of the metal particles is inhibited. Disclosed is a metal particle dispersion comprising metal particles, a dispersant and a solvent, wherein the metal particles contain one or more selected from the group consisting of gold, silver, copper, nickel, platinum, palladium, molybdenum, aluminum, antimony, tin, chromium, lanthanum, indium, gallium and germanium, and wherein the dispersant is a graft copolymer having at least one constitutional unit represented by the following general formula (I) and at least one constitutional unit represented by the following general formula (II), and in which at least part of nitrogen sites of the constitutional units represented by the general formula (I) each form a salt with at least one selected from the group consisting of a halogenated hydrocarbon, an acidic phosphorus compound represented by the following general formula (V), and a sulfonic acid compound represented by the following general formula (VI): (symbols shown in the general formulae (I), (II), (V) and (VI) are as described in the Description.)

Metal particle dispersion, article and sintered film using metal particle dispersion, and method for producing sintered film

Provided is a metal microparticle dispersion including metal microparticles, a polymeric dispersant and a dispersion medium, wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.5 &#x3bc;m; the polymeric dispersant has a polyester skeleton in at least one of a principal chain and a side chain thereof; or the polymeric dispersant has a polyether skeleton in at least one of a principal chain and a side chain thereof; and a content of the above polymeric dispersant is 0.1 to 100 parts by mass based on a content of 100 parts by mass of the metal microparticles. Further, provided is a production process for an electrically conductive substrate, and an electrically conductive substrate produced by the above production process is provided.

Metal microparticle dispersion, process for production of electrically conductive substrate, and electrically conductive substrate

Provided is a conductive substrate which is prepared by forming a pattern-shaped metal fine particle sintered film such as a copper wiring and the like on a base material of polyimide and the like and which has a high adhesive property with the base material and is provided with an excellent conductivity. The conductive substrate of the present invention is prepared by printing a coating liquid containing metal or metal oxide fine particles on a base material to form a print layer and subjecting the above print layer to sintering treatment to form a metal fine particle sintered film, wherein a crystallite diameter in the metal fine particle sintered film which is measured by X ray diffraction is 25 nm or more, and a cross section of the metal fine particle sintered film has a void rate of 1% or less.

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Tokyo-to, Japan

Naonobu Yoshi