Ebara Corporation

Naomitsu Ozawa

Satoshi Sendai

Kenya Tomioka

Junichiro Yoshioka

Atsushi Chono

Kenichi Suzuki

Akihisa Hongo

Mitsuo Tada

Yoshitaka Mukaiyama

Akira Ogata

Katsumi Tsuda

Kenji Nishikiori

A plating apparatus continuously plates a surface of a substrate with metal and performs its supplementary process in one housing unit. The plating apparatus comprises a cassette stage for placing a substrate cassette thereon, a pre-treatment unit for pre-treating a surface of a substrate, and a plating unit for plating a surface of the substrate pre-treated in the pre-treatment unit. The plating apparatus further comprises a first substrate stage disposed between the cassette stage and the pre-treatment unit, a cleaning and drying unit disposed between the cassette stage and the first substrate stage, a first transfer device, and a second transfer device. The first transfer device transfers a substrate between the substrate cassette, the cleaning and drying unit, and the first substrate stage. The second transfer device transfers a substrate between the first substrate stage, the pre-treatment unit, and the plating unit.

Plating apparatus and method

The present invention provides a conductivity sensing device capable of detecting the conductivity (contact state) of the plurality of feeder contacts contacting the conductive area of the substrate, and a plating apparatus capable of forming a plating film of uniform thickness by supplying a uniform plating current through a plurality of feeder contacts.

Plating apparatus for detecting the conductivity between plating contacts on a substrate

The present invention is to provide a wafer plating jig for a plating apparatus having a simple construction and capable of sealing conducting pins from the plating solution completely. The wafer plating jig for gripping a wafer, comprises a main jig body ( ) having a plurality of gripping mechanisms ( ) and a plurality of conducting pins disposed thereon. A seal packing ( ) is provided to surround each of the conducting pins. When the wafer is gripped by the gripping mechanisms ( ), each end of the conducting pins individually contacts conductive film formed on the wafer and being sealed by the seal packing ( ).

Wafer plating jig

An automatic operating system for a pump driven by an internal combustion engine is disclosed in which the engine is kept in operation at a low and economical speed automatically disconnecting the pump from the engine when delivery pressure from the pump is not required and connecting the pump automatically when delivery pressure from the pump is required. Such automatic control is effected by a valve block in which a safety valve is incorporated, the movement of the valve body of which is utilized to control the connection and disconnection of the pump, the movement of the valve body being dependent on the pressure in the discharge line of the pump.

Automatic operating system for pump driven by internal combustion engine

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Kanagawa, Japan

Naomitsu Ozawa