Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Naomichi Ohashi

Atsushi Yamaguchi

Arata Kishi

Hidenori Miyakawa

Koso Matsuno

Yasuhiro Suzuki

Hirohisa Hino

Yasuhiro Okawa

Masato Mori

Takayuki Higuchi

Shigeaki Sakatani

Hisahiko Yoshida

Yuki Yoshioka

Ryo Kuwabara

Honami Nawa

Seiji Tokii

Hiroe Kowada

Hideyuki Tsujimura

Masato Udaka

A solder paste including at least two types of solder powders each containing at least two types of metal elements has an average free energy of oxide formation of the at least two types of solder powders on a molar basis of −490 kJ/mol or more, the average free energy of oxide formation being a sum of products (A×B) of a molar ratio (A) of each of the at least two types of metal elements (i) based on all the at least two types of metal elements constituting the at least two types of solder powders included in the solder paste and a free energy (BkJ/mol) of oxide formation of the each of the at least two types of metal elements, and an average melting point of the at least two types of solder powders on a mass basis of 121° C. or lower, the average melting point being a sum of products (C×D) of a mass ratio (C) of each of the at least two types of solder powders (j) based on a total mass of the at least two types of solder powders included in the solder paste and a melting point (D° C.) of the each of the at least two types of solder powders.

Solder paste and bonded structure

A method for mounting an electronic component on a resin base material, the method including:

Mounting method and mounting structure formed by the same

A conductive paste includes: a solder powder having a melting point of less than or equal to 120° C.; a conductive filler; a flux for removing an oxide film of the solder powder; and a solvent, wherein a ratio of a mass of the conductive filler to a mass of the solder powder is 20% to 80%.

Conductive paste and conductive film formed using the same

A solder paste includes a solder powder; and a flux component containing a compound having at least one carboxyl group protected by a trialkylsilyl group.

Solder paste and mounting structure

Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.

Resin fluxed solder paste, and mount structure

Provided is a heat-dissipating resin composition including: a rubber material having an average emissivity of 80% or higher in a wavelength range from 5 &#x3bc;m to 20 &#x3bc;m; and a filler having a grain diameter of 15 &#x3bc;m or smaller and an aspect ratio of 3 to 10, wherein the heat-dissipating resin composition has an emissivity of 90% or higher in the wavelength range from 5 &#x3bc;m to 20 &#x3bc;m.

Heat-dissipating resin composition, and component and electronic device including the same

A mounting structure, including: a first component that has a first bump; a second component that has a second bump; a mounting component that has a primary mounting surface and a secondary mounting surface; a first solder that connects an electrode on the primary mounting surface and the first bump; a second solder that connects an electrode on the secondary mounting surface and the second bump; and a reinforcing resin that covers a part of the first solder and that is not in contact with the primary mounting surface.

Mounting structure and method for producing mounting structure

In a case where a first mounted substrate to which a semiconductor element is bounded by solder is mounted on a second substrate, connection strength becomes low, when the first mounted substrate is bonded to the second substrate by using a solder having a low melting point. A mounted structure, in which a first mounted substrate on which a semiconductor element is bonded by using a first solder having a melting point of 217&#xb0; C. or more, is mounted on a second substrate, includes plural bonding parts bonding the first mounted substrate to the second substrate; and a reinforcing member formed around the bonding part. Each of the bonding parts contains a second solder having a melting point, that is lower than the melting point of the first solder, and a space exists, in which the reinforcing members do not exist, between the bonding parts neighboring each other.

Mounted structure and manufacturing method of mounted structure

A semiconductor package component () is mounted on a substrate () in such a manner that an electrode () of the substrate () and an electrode of the semiconductor package component () are brought into contact with each other through a joining material (). A reinforcing adhesive () is applied between the substrate () and the outer surface of the semiconductor package component (). Then, reflow is performed to melt the joining metal () with the reinforcing adhesive () uncured. After the reinforcing adhesive () is cured, the joining metal () is solidified.

Mounting method and mounting structure for semiconductor package component

A conductive adhesive includes 10 to 90 wt % of Sn&#x2014;Bi system solder powder and the remainder of an adhesive containing organic acid, and the Sn&#x2014;Bi system solder powder is composed of solder particles having a particle size Lof 20 to 30 &#x3bc;m and solder particles having a particle size Lof 8 to 12 &#x3bc;m, and a mixing ratio of the Sn&#x2014;Bi system solder powder is such that the solder particles having a particle size of 20 to 30 &#x3bc;m occupy 40 to 90 wt % with respect to the whole solder powder, and the remainder is occupied by solder particles having a particle size of 8 to 12 &#x3bc;m.

Conductive adhesive, and circuit board and electronic component module using the same

A manufacturing method for a mounting structure of a semiconductor package component, including: applying a first adhesive with viscosity &#x3b7;and a thixotropy index Tat a position on the substrate, which is on an outer side of the mounted semiconductor package component; applying, on the first adhesive, a second adhesive with viscosity &#x3b7;and a thixotropy index Tso that the second adhesive gets in contact with an outer periphery part of the semiconductor package component; and forming, through a subsequent reflow process, a first adhesive part of the hardened first adhesive and a second adhesive part of the hardened second adhesive, wherein the first and second adhesives satisfy 30&#x2266;&#x3b7;&#x2266;300 (Pa&#xb7;s) and 3&#x2266;T&#x2266;T&#x2266;7, and sectional area Sof the first adhesive part and sectional area Sof the second adhesive part with respect to a direction perpendicular to a mounting surface of the substrate satisfy a relation S&#x2266;S

Mounting structure of semiconductor package component and manufacturing method therefor

Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.

Electrically conductive paste, and electrical and electronic device comprising the same

A semiconductor device mounted structure includes a semiconductor device having a plurality of first electrodes, a circuit board having a plurality of second electrodes, a plurality of bumps respectively formed on the plurality of first electrodes, a plurality of bonding members respectively positioned between the bumps and the second electrodes to electrically connect the first electrodes to the second electrodes via the bumps, and a plurality of reinforcing resin members respectively positioned around the bonding members so as to cover at least the bonding members and bonding regions between the bonding members and the bumps. Adjacent reinforcing resin members are spaced away from each other so as not to have contact with each other without being in contact with the semiconductor device. This semiconductor device mounted structure enhances the reliability of joints in impact resistance and makes it easy to repair it.

Semiconductor device mounted structure and its manufacturing method

A conductive paste includes a filler component and a flux component; the filler component including a first conductive filler and a second conductive filler having different melting points, and the melting point of the first conductive filler being higher than the melting point of the second conductive filler by 20&#xb0; C. or more; the flux component including a first flux and a second flux having different melting points, the melting point of the first flux being higher than the melting point of the second flux, and the melting point of the first flux being higher than the melting point of the second conductive filler by 15&#xb0; C. to 45&#xb0; C.; and the melting point of the second flux being equal to or less than the melting point of the second conductive filler.

Growing community of inventors

Hyogo, Japan

Naomichi Ohashi