Ngk Insulators, Inc.

Tohoku University

Other

Yokohama National University

The University of Electro-communications

Osaka University

Kanazawa University

Tokoku University

Tetsuo Sakai

Hiroshi Utsunomiya

Techno Coat Company, Ltd.

National University Corporation Kanazawa University

National University Corporation Yokohama National University

Miura, Hiromi

Utsunomiya, Hiroshi

Naokuni Muramatsu

Hisamichi Kimura

Takashi Goto

Mahoto Takeda

Ryota Takeuchi

Hirokazu Katsui

Koudai Sasaki

Tao N Zhang

Akihisa Inoue

Takanari Nakajima

Hiromi Miura

Masayuki Tsuchiya

Yoshimasa Kondo

Ken Suzuki

Shoju Aoshima

Taku Sakai

Takaharu Iwadachi

Kenji Kato

Koki Chiba

Eiichi Makabe

Masaaki Akaiwa

Daisuke Kaneko

Masato Yasuda

Junsuke Kiuchi

Hiroaki Ueno

Xin Min Wang

Isamu Takagi

Hiroshi Suzuki

Tatsue Arakawa

Ryoichi Monzen

Nobuyuki Ogawa

Takaya Ueno

Naoki Yamagami

Satoshi Ota

Tadahiro Kawamoto

Kenment Suzuki

A conductive supporting member includes an outer portion that includes a Cu matrix phase and a second phase dispersed in the Cu matrix phase and containing a Cu&#x2014;Zr compound and that has an alloy composition represented by Cu-xZr (x is atomic % of Zr and 0.5&#x2264;x&#x2264;16.7 is satisfied) and an inner portion that is present on an inner side of the outer portion, is formed of a metal containing Cu, and has higher conductivity than the outer portion.

Conductive supporting member and method for producing the same

A forging tool used to forge a workpiece in a cuboidal forging space, wherein (a): the forging space is formed when the bottom surface of the first die and the bottom surface of the second die are brought into contact with the contact surface of the third die, or (b): the forging space is formed when a first die contact surface provided in the first die and a second die contact surface provided in the second die are brought into contact with each other.

Forging tool

An electrically conductive tip member includes: an inner periphery portion including a Cu matrix phase and a second phase that is dispersed in the Cu matrix phase and contains a Cu&#x2014;Zr-based compound, the inner periphery portion having an alloy composition of Cu-xZr (where x is the atomic percentage of Zr and satisfies 0.5&#x2264;x&#x2264;16.7); and an outer periphery portion that is present on an outer circumferential side of the inner periphery portion, made of a metal containing Cu, and has higher electrical conductivity than the inner periphery portion.

Electrically conductive tip member and method for producing the same

A nozzle put into a molten metal in vertical upwards continuous casting for casting a cast product by pulling up the molten metal, the nozzle includes a nozzle body having an intake hole through which the molten metal is taken in and which is formed in a lateral surface of the nozzle body and a flange portion formed on lower side of the intake hole and projecting beyond the nozzle body.

Nozzle, casting apparatus, and cast product manufacturing method

A copper alloy disclosed in the present description has a basic alloy composition represented by CuSnAl(where 8&#x2264;x&#x2264;12 and 8&#x2264;y&#x2264;9 are satisfied), in which a main phase is a &#x3b2;CuSn phase with Al dissolved therein, and the &#x3b2;CuSn phase undergoes martensitic transformation when heat-treated or worked. A method for producing a copper alloy disclosed in the present description is a casting step of melting and casting a raw material containing Cu, Sn, and Al and having a basic alloy composition represented by CuSnAl(where 8&#x2264;x&#x2264;12 and 8&#x2264;y&#x2264;9 are satisfied) so as to obtain a cast material, and a homogenization step of homogenizing the cast material in a temperature range of a &#x3b2;CuSn phase so as to obtain a homogenized material, the method includes at least the casting step.

Copper alloy and method for producing same

A copper alloy disclosed in the present description has a basic alloy composition represented by CuSnMn(where 8&#x2264;x&#x2264;16 and 2&#x2264;y&#x2264;10 are satisfied), in which a main phase is a &#x3b2;CuSn phase with Mn dissolved therein, and the &#x3b2;CuSn phase undergoes martensitic transformation when heat-treated or worked.

A method for manufacturing a copper alloy according to the present invention comprises (a) weighing a copper powder and one of a Cu&#x2014;Zr master alloy and a ZrHpowder such that an alloy composition of Cu-xZr (x is the atomic % of Zr, and 0.5&#x2264;x&#x2264;8.6 is satisfied) is obtained and pulverizing and mixing the copper powder and the one of the Cu&#x2014;Zr master alloy and the ZrHpowder in an inert atmosphere until an average particle diameter D50 falls within the range of from 1 &#x3bc;m to 500 &#x3bc;m to thereby obtain a powder mixture; and (b) subjecting the powder mixture to spark plasma sintering by holding the powder mixture at a prescribed temperature lower than eutectic temperature while the powder mixture is pressurized at a pressure within a prescribed range.

Method for manufacturing copper alloy and copper alloy

A method for manufacturing a copper alloy of the present invention is a method for manufacturing a Cu&#x2014;Ni&#x2014;Sn-based copper alloy and includes: a first aging treatment step of performing an aging treatment in a temperature range of 300&#xb0; C. to 500&#xb0; C. using a solution treated material; an inter-aging processing step of performing cold working after the first aging treatment step; and a second aging treatment step of performing an aging treatment in a temperature range of 300&#xb0; C. to 500&#xb0; C. after the inter-aging processing step. In the first aging treatment step, a peak aging treatment is preferably performed. In addition, in the second aging treatment step, the aging treatment is preferably performed for a short period as compared to that of the aging treatment in the first aging treatment step. In the inter-aging processing step, cold working is preferably performed at a processing rate of more than 60% to 99%.

A Cu&#x2014;Be alloy according to the present invention is a Co-containing Cu&#x2014;Be alloy, in which the Co content is 0.005% to 0.12% by mass, and the number of Cu&#x2014;Co-based compound particles having a particle size of 0.1 &#x3bc;m or more that can be confirmed on a TEM image at a magnification of 20,000 is five or less in a field of view of 10 &#x3bc;m&#xd7;10 &#x3bc;m. Furthermore, a method for producing a Cu&#x2014;Be alloy according to the present invention includes a solution annealing treatment step of subjecting a Cu&#x2014;Be alloy raw material containing 0.005% to 0.12% by mass of Co and 1.60% to 1.95% by mass of Be to solution annealing treatment to obtain a solution-annealed material.

Cu&#x2014;Be alloy and method for producing same

A copper alloy of the present invention contains 5.00 to 8.00 atomic percent of Zr and includes Cu and a Cu&#x2014;Zr compound, and two phases of the Cu and the Cu&#x2014;Zr compound form a mosaic-like structure which includes no eutectic phase and in which when viewed in cross section, crystals having a size of 10 &#x3bc;m or less are dispersed. This copper alloy is formed by a manufacturing method including a sintering step of performing spark plasma sintering on a Cu&#x2014;Zr binary system alloy powder at a temperature of 0.9 Tm &#xb0; C. or less (Tm(&#xb0; C.): melting point of the alloy powder) by supply of direct-currant pulse electricity, the Cu&#x2014;Zr binary system alloy powder having an average grain diameter of 30 &#x3bc;m or less and a hypoeutectic composition which contains 5.00 to 8.00 atomic percent of Zr. The Cu&#x2014;Zr compound may include at least one of CuZr, CuZr, and CuZr.

Copper alloy and method for manufacturing the same

A method of manufacturing a copper alloy is provided, including melting and casting a copper alloy having a composition expressed, in atomic percent, by a formula of CuZrB, wherein 1.0&#x2266;a&#x2266;8.0, 0&#x2266;b&#x2266;4.0, and a+b&#x2266;8.0, by a nonrefractory melting method. A cold working with a reduction of about 50% or more for the copper alloy without a solution treatment is performed to provide the copper alloy a dual phase structure having a layered structure including a Cu matrix phase having a plurality of grain particles having an average diameter of about 10 &#x3bc;m or less, and an eutectic phase around the Cu matrix phase. At least part of each grain particle contacts another grain particle within the eutectic phase, and the eutectic phase includes at least one of a Cu&#x2014;Zr compound and a Cu&#x2014;Zr&#x2014;B compound.

Copper alloy and copper alloy manufacturing method

A copper alloy wire rod includes a copper parent phase and short fiber-shaped composite phases which are dispersed in the copper parent phase and which contain CuZrand Cu, wherein the content of Zr is within the range of 0.2 atomic percent or more and 1.0 atomic percent or less. This copper alloy wire rod can be obtained by including the steps of melting a raw material in such a way that a copper alloy having a Zr content within the above-described range of is produced so as to obtain a molten metal in a melting step, casting the molten metal so as to obtain an ingot in a casting step, and subjecting the ingot to cold wire drawing in a wire drawing step, wherein the wire drawing step and a treatment after the wire drawing step are performed at lower than 500&#xb0; C.

Copper alloy wire rod and method for manufacturing the same

A method for treating a Cu thin sheet is provided. The method comprises the steps of: supplying a slurry in which a diffusion bonding aid (DBA), such as Ni powder, and a reinforcing material (RM), such as a carbide base metal compound, are dispersed in a solvent to a predetermined portion on a Cu or Cu base alloy thin sheet, drying the supplied slurry, and applying a laser to induce melting, solidification, and fixation, so as to form a buildup layer. In the method, the weight ratio of DBA to RM is specified to be 80:20 to 50:50, and the median diameters Dof both DBA and RM employed fall within 0.1 to 100 &#x3bc;m, the median diameter Dof DBA is larger than the median diameter Dof RM, and both the distribution ratio D/Dof DBA and the distribution ratio D/Dof RM are 4.0 or less.

Method for treating Cu thin sheet

A forging method according to the present invention includes the steps of placing a work having a first shape which is a rectangular hexahedron in a work space of a forging die which has a rectangular opening, which is formed by rectangular plane wall portions, and which is provided with the work space to hold the work in a placement step and applying a plastic strain to the work by deforming the placed work into a second shape which is a rectangular hexahedron in a working step, with the placement step and the working step being performed at least two times.

Forging method and forging die

A heat treatment method according to the present invention includes a preliminary-state-generating step of heat-treating an alloy that undergoes multiple-step transformation with temperature by bringing the alloy in contact with a contact-type heating element for 0.01 sec or more and 3.0 sec or less, the contact-type heating element being adjusted to a particular temperature within a preliminary-state-generating temperature region determined on the basis of a first temperature related to a particular first transformation of the alloy and a second temperature, which is higher than the first temperature, related to a particular second transformation of the alloy so as to generate a preliminary state in the alloy.

Heat treatment method and heat treatment apparatus

Growing community of inventors

Nagoya, Japan

Naokuni Muramatsu