Nitto-denko Corporation

Naoko Yoshida

Takashi Oda

Shigenori Morita

Kazuhiro Fuke

Ryusuke Naito

Hidenori Onishi

Yuichi Fukamichi

An optical semiconductor device includes a metal lead frame including first and second plate portions, an optical semiconductor element mounted on the metal lead frame, and a reflector provided around the optical semiconductor element. A material for the reflector is an epoxy resin composition containing: (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) at least one of a carboxylic acid and water. Components (C) and (D) are present in a total proportion of 69 to 94 wt % based on the amount of the overall epoxy resin composition, and the component (E) is present in a proportion of 4 to 23 mol % based on the total amount of the components (B) and (E). The resin composition has a higher glass transition temperature, and is excellent in moldability and blocking resistance and substantially free from warpage.

Epoxy resin composition for optical semiconductor device, and lead frame for optical semiconductor device, encapsulation type optical semiconductor element unit and optical semiconductor device each obtainable by using the epoxy resin composition

A wiring circuit layerhaving at least a wiring part and an insulating part, whose top and bottom surfaces (A,B) is adhesive surfaces, is formed on a metal support substratein a way such that the layercan be peeled from the substrate. Exposed in the first adhesive surfaceA of the wiring circuit layeris a first connecting conductor part, which is connectable with an electrodeof a first semiconductor elementin a wafer state. After the wiring circuit layeris laminated on and connected to the element, the metal support substrateis peeled from the wiring circuit layerto yield a semiconductor device. Another element may be connected to the other adhesive surfaceB exposed upon the peeling.

Method of manufacturing a semiconductor device by lamination

A wiring circuit layerhaving a connecting conductor partthat can be connected to an electrodeof a semiconductor elementis formed on a metal support substratein a way such that the wiring circuit layer can be separated from the substrate, and that the connecting conductor partis exposed on the upper face of the wiring circuit layer. The wiring circuit layeris laminated on the elementwhile in a wafer state, and the connecting conductor partand the electrodeare connected. Subsequently, the support substrateis peeled from the wiring circuit layer, and the wafer is diced, whereby individual semiconductor devices are obtained.

Growing community of inventors

Ibaraki, Japan

Naoko Yoshida