Renesas Electronics Corporation

Naoko Taniguchi

Yoshiharu Kaneda

A semiconductor device includes a die pad, which includes an upper surface and a lower surface opposite to the upper surface, the upper surface forming a rectangular shape in plain view; a plurality of support pins that support the die pad; a plurality of inner leads arranged around the die pad; a plurality of outer leads connected to each of the inner leads; a semiconductor chip which includes a main surface and a back surface opposite to the main surface and in which a plurality of electrode pads is formed in the main surface. The die pad includes a first side, a second side opposite to the first side, and a third side and a fourth side, which intersect the first and second sides.

Manufacturing method of semiconductor device and semiconductor device

A semiconductor device includes a die pad, which includes an upper surface and a lower surface, the upper surface forming a rectangular shape in plan view; a plurality of support pins that support the die pad; a plurality of inner leads arranged around the die pad; a plurality of outer leads connected to each of the inner leads; a semiconductor chip which includes a main surface and a back surface and in which a plurality of electrode pads is formed in the main surface; a plurality of wires which electrically couple the electrode pads of the semiconductor chip to the inner leads respectively; and a sealing body that seals the support pins, the inner leads, the semiconductor chip, and the wires. A first support pin of the plurality of support pins is integrally formed together with the die pad. The first support pin is terminated inside the sealing body.

To enhance the reliability of a semiconductor device. The semiconductor device includes die pads, over which a first semiconductor chip and a second semiconductor chip are mounted respectively, a plurality of support pins that support each of the die pads, a plurality of inner leads and outer leads arranged around the die pads, a plurality of wires that electrically couple the semiconductor chips to the inner leads, and a sealing body that seals the semiconductor chips, the inner leads, and the wires. Each of the die pads is supported by three support pins integrally formed together with the die pad, and each of second support pins of each pair of the three support pins is arranged between the inner leads adjacent to each other.

Growing community of inventors

Kawasaki, Japan

Naoko Taniguchi