Toshiba Lighting & Technology Corporation

Tokyo University of Science Foundation

Naoko Matsui

Tsuyoshi Oyaizu

Seiko Kawashima

Haruki Takei

Atsuo Yasumori

Tetsuo Kishi

Provided is a light-emitting glass which is applicable to, e.g., white illuminators including a light-emitting diode as a light source, and which emits light of a warm white color when irradiated with near ultraviolet light and combines long-term weatherability with high heat resistance; a light-emitting device containing same and a process for producing same. The light-emitting glass includes, as the base glass, borosilicate or silicate glass having a separated-phase structure, whereby the base glass is efficiently doped with, for example, transition metal ion clusters which emit light of a warm white color upon irradiation with near ultraviolet light. With this glass, it is possible to attain increases in excitation wavelength and emission wavelength. The glass thus emits, based on a multiple scattering effect, high-intensity light of a warm white color upon irradiation with near ultraviolet light.

Light-emitting glass, light-emitting device equipped with the light-emitting glass, and process for producing light-emitting glass

A light-emitting module includes a substrate, a wiring pattern, and a light-emitting device that generates heat. The substrate includes a metal base and an insulating base that is stacked on the metal base and has a mount surface on the opposite side of the metal base. The insulating base has a plurality of insulating layers stacked on one another. The wiring pattern is provided on the mount surface of the substrate. The light-emitting device is mounted on the mount surface of the substrate and is electrically connected to the wiring pattern.

Light-emitting module and illuminating apparatus having an insulating base having a plurality of insulating layers

The invention provides an electronic component mounting module capable of increasing the adhesion between the board and the heat radiating member, improving the thermal conductivity, and effectively radiating heat generated from the LEDs being an electronic component. The LEDs are mounted on the surface of the ceramics board, and the rear surfaceside of the board is disposed at the heat radiating member. A metallic fine particle layer having high thermal conductivity and flexibility is made to intervene between the board and the heat radiating member.

Growing community of inventors

Izumisano, Japan

Naoko Matsui