Shin-Etsu Chemical Co., Ltd.

Naoki Yamakawa

Tomoyoshi Furihata

Hiroto Ohwada

Atsuo Ito

Kei Miyoshi

Atsushi Yaginuma

Junichi Tsukada

Noriyuki Meguriya

Syuuichi Azechi

Hyung Bae Kim

Masayuki Ikeno

Yoshitaka Hamada

Toshiyuki Ozai

Sumio Sekiyama

Tomoyuki Goto

Shigeki Shudo

Minoru Igarashi

Yoshinori Ogawa

Yujiro Taira

Makoto Kusama

Masahiro Hinata

A method of manufacturing a solar cell module comprising pressing a first silicone gel sheet provided on a sunlight receiving surface of a solar cell string and a second silicone gel sheet provided on an opposite side sunlight non-receiving surface of the solar cell string in vacuum to encapsulate the solar cell string with the first and second silicone gel sheets; disposing the sunlight receiving surface side of the first silicone gel sheet on one surface of a transparent light receiving panel and disposing butyl rubber in a picture frame-like shape along an outer peripheral portion of a panel where the first silicone gel sheet is not formed and laying the light receiving panel and the light non-receiving panel or back sheet over each other with the silicone gel sheet-encapsulated solar cell string on the inside, and pressing them at 100 to 150&#xb0; C. in vacuum to press bond the light receiving surface panel and the light non-receiving surface panel or back sheet to each other through the butyl rubber.

Method of manufacturing solar cell module

A method of manufacturing a solar cell module comprising adhering a first silicone gel sheet to one surface of a transparent light receiving panel to be a sunlight incidence surface; adhering a second silicone gel sheet to one surface of a light non-receiving panel or back sheet on the side opposite to the sunlight incidence surface; disposing a solar cell string on the first silicone gel sheet of the light receiving panel, and disposing butyl rubber in a picture frame-like shape along an outer peripheral region of a panel where either of the silicone gel sheets are not formed; and laying the light receiving panel and the light non-receiving panel or back sheet over each other with the silicone gel sheets on the inside, and pressing them at 100 to 150&#xb0; C. in vacuum to encapsulate the solar cell string with the silicone gel sheets and press bond the light receiving panel and the light non-receiving panel or back sheet to each other through the butyl rubber.

A solar cell module is manufactured by encapsulating a solar cell matrix comprising a plurality of electrically connected solar cell components between a transparent panel and a backsheet with a resin. The method involves (i) embossing opposite surfaces of a green silicone rubber sheet, (ii) arranging a transparent panel (), silicone rubber sheet (), solar cell matrix (), silicone rubber sheet (), and backsheet () to form a multilayer assembly, and (iii) heating and compressing the assembly for vacuum lamination for establishing a seal around the solar cell matrix.

Manufacture of solar cell module

A solar cell module is manufactured by forming silicone coating films () on panels (), placing a solar cell matrix () on the silicone coating film on panel (), providing a seal member () consisting of a base seal member () of butyl rubber and protrusive seal segments () of butyl rubber on a peripheral region of panel (), mating the two panels together such that the seal member () may abut against a peripheral region of panel (), and the solar cell matrix () may be sandwiched between the silicone coating films (), and compressing and heating the mated panels () in vacuum for establishing a seal around the solar cell matrix ().

A silicone adhesive for a semiconductor element that is suitable as a die bonding material for fixing a light emitting diode chip to a substrate. The adhesive includes (a) an addition reaction-curable silicone resin composition having a viscosity at 25&#xb0; C. of not more than 100 Pa&#xb7;s, and yielding a cured product upon heating at 150&#xb0; C. for 3 hours that has a type D hardness prescribed in JIS K6253 of at least 30, (b) a white pigment powder having an average particle size of less than 1 &#x3bc;m, and (c) a white or colorless and transparent powder having an average particle size of at least 1 &#x3bc;m but less than 10 &#x3bc;m. The adhesive exhibits high levels of concealment, effectively reflects light emitted from the LED chip, and also exhibits favorable chip positioning properties, superior adhesive strength, and excellent durability.

Silicone adhesive for semiconductor element

A silicone resin composition for die bonding is provided. The composition includes (A) a straight-chain organopolysiloxane having silicon-bonded alkenyl groups, and with a viscosity of no more than 1,000 mPa&#xb7;s, (B) a three dimensional network-type organopolysiloxane resin that is either wax-like or solid at 23&#xb0; C., (C) an organohydrogenpolysiloxane having SiH groups, and (D) a platinum-group metal-based catalyst. The composition produces a cured product with a high hardness, and good heat resistance, transparency, and light transmittance in the low wavelength region.

Silicone resin composition for die bonding

A heat conductive silicone composition is provided, which includes (A) an organopolysiloxane having the formula (1):{(CH&#x2550;CH)RSiO}(RSiO)(RSiO){OSiR&#x2014;R&#x2014;SiR(OR)}&#x2003;&#x2003;(1)wherein Rrepresents monovalent hydrocarbon groups, Rrepresents an oxygen atom or a bivalent hydrocarbon group, Rrepresents an alkyl group, alkoxyalkyl group, alkenyl group, or acyl group, L and o represent numbers from 1 to 10, m represents a number from 0 to 10, n represents a number from 5 to 100, a represents an integer from 1 to 3, and when m=0, L+o=2 and Ris a bivalent hydrocarbon group, (B) a heat conductive filler, and (C) an organopolysiloxane other than the component (A). Even upon high-level packing with the heat conductive filler to obtain a highly heat conductivity, the composition still exhibits favorable handling and moldability properties.

Heat conductive silicone composition

An addition curable silicone resin composition for a light emitting diode is provided The composition includes an organopolysiloxane that includes a straight-chain segment represented by a formula:&#x2014;(RSiO)&#x2014;wherein, Ris an unsaturated aliphatic bonding-free monovalent hydrocarbon group, and n is an integer of 1 or greater, and a resin-like segment consisting of RSiOunits wherein, Ris a monovalent hydrocarbon group, an alkoxy group, or a hydroxyl group, SiOunits, and/or RSiOunits wherein, Ris as defined above, in which at least two of all the Rgroups are alkenyl groups. The composition exhibits strong resistance to thermal shock, and is resistant to cracking even under severe temperature cycling.

Addition curable silicon resin composition for light emitting diode

A primer composition comprising a compound containing an epoxy group, a Si&#x2014;H group, and an aromatic ring per molecule, and a solvent is effective for assisting in integral molding or bonding a silicone rubber to an adherend of gold, silver or platinum.

Primer composition

An addition reaction-curable liquid silicone rubber composition includes an organopolysiloxane containing at least one Si-bonded vinyl group only at each end of its backbone and having a viscosity of from 1 to 1,000 Pa&#xb7;s at 25&#xb0; C., an organopolysiloxane containing at least two Si-bonded vinyl groups only in side chains on its backbone and having a viscosity of from 0.1 to 100 Pa&#xb7;s at 25&#xb0; C., the amount of siloxane units bonded to the vinyl groups being from 2 to 20 mole % of its total siloxane units, finely divided silica having a specific surface area of at least 50 m/g, hexamethyldisilazane, water, an organohydrogenpolysiloxane containing at least two Si-bonded hydrogen atoms per molecule, and a hydrosilation catalyst. Another addition reaction-curable liquid silicone rubber composition additionally includes a specific non-functional dimethylpolysiloxane. The silicone rubber compositions are cured into products having a hardness of at least 75 as measured by a type-A durometer and an elongation at break of at least 200%.

Addition reaction-curable liquid silicone rubber compositions and process of preparing same

A release agent comprising a perfluoroalkyl ether silazane polymer or a perfluoroalkyl or perfluoroalkyl ether silazane/alkylsilazane copolymer and an organic solvent is suitable for use in molds for silicone base rubber molding. The agent offers effective, long-lasting release properties and ease of molding.

Release agent for silicone rubber molding molds and molding method

A silicone rubber adhesive composition comprising (A) a heat curable organopolysiloxane composition of the addition curing type or peroxide curing type, (B) reinforcing silica fines, and (C) an organic compound or organosilicon compound having an epoxy equivalent of 100-5,000 g/mol and containing at least one aromatic ring in a molecule is easily moldable within a short time by injection molding, suitable in primerless molding, and bondable with various thermoplastic resins. Integrally molded articles in which the silicone rubber adhesive composition is firmly bonded to the thermoplastic resin are obtainable without a need for modification of the resin.

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Annaka, Japan

Naoki Yamakawa