Fuji Electric Co., Ltd.

Fuji Electric Device Technology Co., Ltd.

Mitsubishi Heavy Industries Limited

Mimaki Engineering Company, Ltd.

Japan Aerospace Exploration Agency

Tsukada Medical Research Co., Ltd.

Naoki Takizawa

Hiroyuki Uwazumi

Takahiro Shimizu

Tadaaki Oikawa

Miyabi Nakamura

Akira Iso

Keiji Ohkubo

Noboru Kurata

Osamu Tsukada

Eiji Miyashita

Toyoji Ataka

Kazuo Enomoto

Makoto Ohira

Akihiko Mizusaki

Masaki Kodaira

Dai Shiba

Hiroyasu Mizuno

Atsuko Homma

Masato Shimizu

Hirochika Murase

Kengo Kanai

Akane Yumoto

Masaki Shirakawa

Akihiko Nakasa

Haruna Koike

Nami Hatakeyama

Myabi Nakamura

Kazumi Sakurai

A semiconductor device, including a metal base plate having a front surface on which a disposition area is set apart from a central portion of the metal base plate, and a board placed over the disposition area with a solder therebetween. The solder has two edge portions of which one is closer than the other to the central portion of the metal base plate, said one being thicker than said the other.

Semiconductor device and semiconductor device manufacturing method

An electronic device includes a first part, and a circuit plate including a circuit substrate, a plating film made of a plating material and being disposed on a front surface of the substrate. The plating film includes a first part region on which the first part is disposed via a first solder, and a liquid-repellent region extending along a periphery side of the first part region in a surface layer of the plating film, and having a liquid repellency greater than a liquid repellency of the plating film. The liquid-repellent region includes a resist region. The plating film includes a remaining portion between the liquid-repellent region and the front surface of the circuit substrate in a thickness direction of the plating film orthogonal to the front surface. The remaining portion is made of the plating material and is free of the oxidized plating material.

Electronic apparatus and manufacturing method thereof

A semiconductor device includes an insulating circuit substrate including an insulating plate, a first metal layer formed on a top surface of the insulating plate, and a second metal layer formed on a bottom surface of the insulating plate, a heatsink on whose top surface the insulating circuit substrate is disposed; semiconductor elements disposed on the top surface of the first metal layer through a bonding material, and a case that encloses a perimeter of the insulating circuit substrate and the semiconductor elements. The first metal layer includes circuit patterns electrically connected to the semiconductor elements and an annular pattern formed to enclose the perimeter of the circuit patterns with a gap provided with respect to the circuit patterns. The second metal layer is disposed at a spot that surfaces the annular pattern. The housing is affixed to the annular pattern through an adhesive.

Semiconductor device

There is provided a liquid supply apparatus eliminating the need for a power supply, having relatively light weight and small footprint, and ensuring a stable liquid supply. The liquid supply apparatus includes a first support member, a second support member, a balloon having one end supported by the first support member and the other end supported by the second support member, and a casing having a constant longitudinal length. The balloon is disposed in the casing and is configured so as to be able to hold a liquid therein and discharge the liquid therefrom. When the balloon holds the liquid, the one end and the other end of the balloon are positioned in the case.

Liquid supply apparatus

A nozzle-clogging determining device is provided for detecting nozzle clogging without causing an increase in the cost. A nozzle-clogging determining device is configured to detect pass of droplets ejected from a plurality of nozzles of a head of an inkjet printer, and includes a droplet detector and a determination controller. The droplet detector includes a light emitter configured to emit detection light for detecting pass of droplets in a direction intersecting with a traveling direction of droplets, and a light receiver configured to receive the detection light. The determination controller consecutively ejects a plurality of droplets from each nozzle of the head at equal intervals, and has a threshold for performing determination on nozzle clogging on the basis of a light interception rate of the detection light which the light receiver receives when droplets are positioned inside a spot of the detection light which the light receiver receives.

Nozzle-clogging determining device

In order to restrict cracking or the like in a connection member such as solder, provided is a semiconductor device including a first component; a second component that is arranged on a front surface of the first component; and a connection portion that is provided between the first component and the second component and connects the second component to the first component. A first groove and a second groove having different shapes are formed in the front surface of the first component at positions opposite a first corner and a second corner of the second component, and the connection portion is also formed within the first groove and the second groove.

Semiconductor device having solder groove

A semiconductor device includes an external lead-out terminal having an external terminal and an internal terminal connected to a connecting portion of the external terminal. By forming a resin fixed portion linked to a horizontal resin portion in the vicinity of a leading end of the internal terminal, a gap under the internal terminal when cutting the terminal coupling portion off from the internal terminal can be restricted.

Resin package with a groove for an embedded internal lead

A semiconductor device includes a cooling plate made of metal, one or more laminated substrates each formed by laminating a circuit board, an insulating board, and a metal board, and one or more first semiconductor elements each made of a wide-band-gap semiconductor and disposed over outer peripheral edge portions of the circuit board. The metal board and the cooling plate are joined by the use of a joining material. As a result, even if temperature rises due to the operation of the one or more first semiconductor elements and heat radiation is not performed properly, the one or more first semiconductor elements operate stably.

A semiconductor device includes a laminated substrate having circuit boards, an insulating plate, and a metal plate laminated, and warped convexly to the circuit board side; semiconductor chips fixed to the corresponding circuit boards; a base plate having a predetermined disposition region in which the laminated substrate is disposed, grooves disposed in the outer periphery of the disposition region, and projections disposed in positions in the disposition region adjacent to and inside the grooves. The grooves has on the projection side an inclination corresponding to an inclination caused by the warp of the laminated substrate. A joining material fills the space between the metal plate and the disposition region and covers the grooves and projections.

A magnetic recording medium, and method of manufacturing the same, is provided with excellent recording performance by employing a granular magnetic layer having a specified composition. A magnetic recording medium according to the present invention comprises a nonmagnetic underlayer, a granular magnetic layer, a protective film, and a liquid lubrication layer sequentially laminated on a nonmagnetic substrate. The granular magnetic layer consists of ferromagnetic crystal grains containing cobalt and nonmagnetic grain boundary region surrounding the ferromagnetic crystal grains. The ferromagnetic crystal grains contain platinum in the range of 15 at % to 17 at %.

Magnetic recording medium and method for manufacturing the same

A magnetic recording medium exhibiting low noise and having a sufficiently high coercive force includes a magnetic layer having a granular structure including ferromagnetic crystal grains with a hexagonal closed packed structure and a nonmagnetic grain boundary region of mainly an oxide intervening between the crystal grains. An underlayer has a body-centered cubic lattice structure. A nonmagnetic intermediate layer with the hexagonal closest packed structure includes Ru, Os, and/or Re, which are provided between the magnetic layer and the underlayer. A degree of mismatching &#x394;=|d&#x2212;d|/dis at most 10%, for instance, in a range from 2.5% to 7.0%, where dis a spacing of lattice planes of the crystal grains in the magnetic layer and dis a spacing of the lattice planes of the crystal grains in the intermediate layer. A proportion of the crystal grains with a grain size of equal or greater than 8 nm are at most 10% of the crystal grains included in the intermediate layer and a standard deviation of the grain size is at most 1.4 nm. The layers are deposited without preheating the substrate.

Magnetic recording medium exhibiting low noise and high coercive force

A magnetic recording medium has a non-magnetic under-layer, a magnetic layer, a protective film and a liquid lubricant layer sequentially laminated on a non-magnetic substrate. The magnetic layer has a multi-layer structure laminated with two or more magnetic layer components, each of the magnetic layer components having ferromagnetic grains and non-magnetic grain boundaries surrounding the grain. The resulting magnetic recording medium has a granular magnetic layer exhibiting very high Hc accompanying high density of magnetic recording, while decreasing the amount of platinum needed for attaining the high Hc, and reducing media noise accompanying the high recording density.

Magnetic recording medium and method for manufacturing same

A magnetic recording medium for perpendicular magnetic recording system includes a nonmagnetic substrate and layers sequentially laminated on the substrate. The layers include a seed layer comprised of a metal or an alloy with a face centered cubic crystal structure, a nonmagnetic underlayer of a metal or an alloy with a hexagonal closest packed crystal structure, a magnetic layer having a granular structure including ferromagnetic crystalline grains with a hexagonal closest packed structure and nonmagnetic grain boundary region of mainly oxide surrounding the crystalline grains, a protective layer, and a liquid lubricant layer.

Magnetic recording medium

A nonmagnetic foundation layer is made to have a body-centered cubic crystal structure with a preferred crystal orientation plane being the bcc (110) plane. A nonmagnetic intermediate layer, provided between the foundation layer and a granular magnetic layer, has a hexagonal close-packed structure with the hcp (100) plane or the hcp (200) plane being the preferred orientation plane. Furthermore, the crystal lattice misfit amount between the nonmagnetic intermediate layerand the granular magnetic layer is made to be not more than 10% for each of an a-axis and a c-axis. As a result, epitaxial growth of ferromagnetic crystals in the granular magnetic layer, which has an hcp structure, is promoted, and hence the crystallinity of the magnetic layer is increased, and thus it becomes possible to simultaneously realize an increase in coercivity and a reduction in noise. Depositing the layers on an unheated substrate yields reduces manufacturing costs.

Magnetic recording medium and manufacturing method thereof

A method of manufacturing a magnetic recording medium facilitates preventing a film inflation from occurring in an environmental condition range between &#x2212;40&#xb0; C. and 80&#xb0; C. and an 80% relative humidity. The magnetic recording medium includes a plastic substrate and an undercoating layer on the plastic substrate. The undercoating layer is provided with a columnar structure, which prevents water (moisture) between the plastic substrate and the undercoating layer from aggregating and, therefore, the film inflation from occurring.

Growing community of inventors

Nagano, Japan

Naoki Takizawa