Sharp Kabushiki Kaisha Corporation

Naoki Takao

Masaya Yamamoto

Daisuke Fuse

The present invention provides a method of manufacturing an active element substrate aimed at reducing the production costs of an interlayer insulating film made from a spin-on glass material, for example. In the method of manufacturing an active element substrate, an interlayer insulating film is formed using a printing method that employs a plate. The plate includes: a main pattern that overlaps with signal lines that enclose openings; and fine line patterns that reduce, in the widthwise direction of the signal lines, the inclination of the edges of the printed pattern printed by the main pattern.

Production method for active element substrate, active element substrate, and display device

An IC chip mounting FPC board of the present invention is provided with (1) a mounting region in a substantially quadrangular shape for mounting an IC chip, and (2) a plurality of inner-leads provided along each side of the mounting region, for being connected with the bumps of the IC chip so that the IC chip is mounted and bonded in the mounting region, in which the inner-leads is provided so as to have substantial equality between (a) a sum of areas of superimposing regions of the inner-leads provided on one of facing two sides, and (b) a sum of areas of superimposing regions of the inner-leads provided on the other of the facing two sides. Because this substantially equalizes the pressures applied on the respective inner-leads during the mounting of the IC chip, preventing the bonding pressure of the mounting from being unbalance, it is possible to provide an IC chip mounting FPC board having a high bonding reliability.

FLEXIBLE PRINTED CIRCUIT BOARD, INTEGRATED CIRCUIT CHIP MOUNTING FLEXIBLE PRINTED CIRCUIT BOARD, DISPLAY APPARATUS INCORPORATING, INTEGRATED CIRCUIT CHIP MOUNTED STRUCTURE, AND BONDING METHOD OF INTEGRATED CIRCUIT CHIP MOUNTING FLEXIBLE PRINTED CIRCUIT BOARD

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Osaka, Japan

Naoki Takao