Koito Manufacturing Company, Ltd.

Toyoda Gosei Co., Ltd.

Meijo University

Naoki Sone

Akihiro Matsumoto

Tetsuya Suzuki

Takashi Inoue

Hidetada Tanaka

Takanori Namba

Tomoyuki Nakagawa

Isamu Akasaki

Tetsuya Takeuchi

Yasuaki Tsutsumi

Motoaki Iwaya

Satoshi Kamiyama

Ryo Nakamura

Kazuyoshi Iida

Masaki Oya

Lu Weifang

Provided is a semiconductor light emitting device including a growth substrate; a pillar-shaped semiconductor layer formed on the growth substrate; and a buried semiconductor layer formed to cover the pillar-shaped semiconductor layer, wherein the pillar-shaped semiconductor layer has an n-type nanowire layer formed at a center, an active layer formed on an outermore side than the n-type nanowire layer, a p-type semiconductor layer formed on an outermore side than the active layer and a tunnel junction layer formed on an outermore side than the p-type semiconductor layer, and wherein at least a part of the pillar-shaped semiconductor layer is provided with a removed region formed by removing from the buried semiconductor layer to a part of the tunnel junction layer.

Semiconductor light emitting device and manufacturing method of semiconductor light emitting device

Provided is a light emitting module in which an LED device is mounted and power is supplied to the LED device by a gold wire. The light emitting module includes a first resin (sealing material) that seals the gold wire and a second resin (dam wall) that surrounds at least a portion of the outer peripheral of the first resin. The first resin has a lower viscosity and a lower elastic modulus compared to the second resin, and protects the gold wire mechanically and chemically. The second resin suppresses the first resin from being flowed out toward the peripherals, and, as a result, the sealing state of the gold wire by the first resin may be maintained.

Light emitting module, method for manufacturing light emitting module, and vehicular lamp

A light emitting apparatus includes LED chips and a light condenser condensing the light emitted from the LED chips. The light condenser has a first opening functioning as an incident part through which the light emitted from the LED chips enters, a side surface function as a reflector that reflects the light having entered through the first opening, and a second opening functioning as an emission part that emits the light reflected by the side surface. A phosphor layer, which converts the wavelength of the light emitted from the LED chips and emits the wavelength-converted light, is formed in the first opening. The light condenser is arranged such that the phosphor layer is located on the light emission surfaces of the LED chips.

Light emitting apparatus and automotive lamp

In an automotive headlamp, a light-emitting module is configured such that a light-emitting element and a control circuit unit for controlling the lighting of the light-emitting element are structured integrally with each other. A control circuit unit in a position anterior to the light-emitting element in a lamp unit is located below a shade section so that the control circuit unit can be clear of the path of light used to form a low beam light distribution pattern of the light emitted by the light-emitting element. In this setting, the light-emitting element is so located that a main optical axis Axis perpendicular respect to an optical axis Axof the lamp unit and that a light-emitting portion of the light-emitting element protrudes higher than the control circuit unit in the direction of the main optical axis Ax

Automotive headlamp, heat radiating mechanism, light-emitting apparatus and light source fixing member

A circuit module includes: a lighting control circuit that controls lighting of a semiconductor light emitting element; a first heat radiating member on which the lighting control circuit is mounted; a second heat radiating member that is separated from the first heat radiating member and has a surface on which the semiconductor light emitting element is mounted; and a connecting mechanism having both a housing that connects the first heat radiating member and the second heat radiating member together and a conductive portion that transmits a signal from the lighting control circuit to the semiconductor light emitting element. The housing is formed of a material having a coefficient of thermal conductivity lower than those of the first heat radiating member and the second heat radiating member.

Circuit module, light emitting module, and automotive lamp

Growing community of inventors

Shizuoka, Japan

Naoki Sone