Murata Manufacturing Co., Ltd.

Ibiden Company Limited

Murata Manufacturingco., Ltd.

Murata Manufactruing Co., Ltd.

Naoki Shimizu

Shinji Otani

Kota Zenzai

Kiyoyasu Sakurada

Seiji Katsuta

Hisayoshi Omori

Takashi Kanayama

Toshiki Furutani

Yasuyuki Shimada

Toyotaka Shimabe

Masahiro Kaneko

Takeshi Tashima

A ceramic electronic component includes a ceramic body, an inner electrode, an outer electrode, and a connecting portion. The inner electrode is disposed inside the ceramic body. The end portion of the inner electrode extends to a surface of the ceramic body. The outer electrode is disposed on the surface of the ceramic body so as to cover the end portion of the inner electrode. The outer electrode includes a resin and a metal. The connecting portion is disposed so as to extend from an inside of the outer electrode to an inside of the ceramic body. In a portion of the surface of the ceramic body on which the outer electrode is disposed, the length of the connecting portion that extends in a direction in which the inner electrode is extends about 2.4 &#x3bc;m or more.

Method for producing a ceramic electronic component

A ceramic body is prepared that includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode is led to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of the inner electrode, the electrode layer containing a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component. A heating step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that contains the first and second metal components and a metal contained in the inner electrode.

Ceramic electronic component and method for producing the same

A substrate with a built-in capacitor includes an insulating base material layer, a build-up layer formed on the insulating base material layer and including a conductor layer and an insulating layer, and a multilayer ceramic capacitor positioned in an opening of the base material layer and including internal electrodes, ceramic dielectric layers and a pair of external electrodes. The ceramic capacitor has a cuboid shape having long sides and short sides, the pair of external electrodes is formed on opposing long-side sides such that the external electrodes are separated by a distance in range of 30 &#x3bc;m to 200 &#x3bc;m and that each external electrode includes a conductive paste layer connected to a respective group of the internal electrodes and a copper plated layer covering the conductive paste layer, and the conductive paste layer includes Ni paste or Cu paste including glass component in range of 5% to 40%.

Substrate with built-in capacitor and method for manufacturing substrate with built-in capacitor

Ceramic electronic component and manufacturing method thereof

A ceramic body includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode extends to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of the inner electrode, the electrode layer including a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component. A step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that includes the first and second metal components and a metal contained in the inner electrode.

A ceramic electronic component includes a ceramic body and an outer electrode. The outer electrode is disposed on the ceramic body. The outer electrode includes a first conductive layer and a second conductive layer. The first conductive layer includes a resin, a first metal component, and a second metal component having a higher melting point than the first metal component. The second conductive layer is disposed on the first conductive layer. The second conductive layer is includes a plating film. An alloy particle containing the first metal component and the second metal component protrudes to the second conductive layer side from a surface of the first conductive layer.

Method of manufacturing ceramic electronic component including heating an electrode layer to form a conductive layer including an alloy particle

A multilayer ceramic capacitor includes first internal electrodes extending to a first end surface of a ceramic element assembly, a plurality of second internal electrodes extending to a second end surface, floating internal electrodes arranged so as to overlap the first and second internal electrodes with ceramic layers disposed therebetween to define first and second effective regions, inner conductors that are elongated from the first end surface beyond a region that overlaps the first effective region in the direction of layering, and a relationship X1&#x3c;Y1&#x3c;(L&#x2212;E) is satisfied where L is the dimension in the longitudinal direction extending from the first end surface to the second end surface, X1 is the longitudinal-direction dimension of each of the first internal electrodes, Y1 is the distance between the first end surface and an end of each of the first internal electrodes, and E is the distance between the second end surface and an end of the second extended section.

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Nagaokakyo, Japan

Naoki Shimizu