Shinkawa Ltd.

Toshiba Tec Kabushiki Kaisha

Naoki Sekine

Motoki Nakazawa

Yasuo Nagashima

Tomonori Ikumi

Masami Takahata

Takashi Koiso

Yoshihito Hagiwara

Koichi Takahashi

Shinichi Akiyama

Shinji Saegusa

Yuu Hasegawa

Yong Du

Shinji Kumamoto

Shogo Watada

A conference server includes a processor configured to acquire a response voice signal according to a command voice signal included in a first input voice signal transmitted from a first communication device that participates in an online conference and output a first output voice signal including a command-excluded voice signal obtained by excluding the command voice signal from the first input voice signal; and a communication interface configured to receive the first input voice signal transmitted from the first communication device, transmit the response voice signal to the first communication device, and transmit the first output voice signal to the other communication device that participates in the online conference.

Conference server and conference system

A wire bonding apparatus connecting a lead of a mounted member with an electrode of a semiconductor die through a wire comprises a capillary through which the wire is inserted, a shape acquisition part which acquires the shape of the lead to which the wire is connected, a calculating part which calculates an extending direction of a wire tail extending from the end of the capillary based on the shape of a lead to which the wire is connected next, and a cutting part which moves the capillary in the extending direction and cuts the wire to form the wire tail after the lead is connected with the electrode through the wire. Thus, in the wire bonding using wedge bonding, joining part tails () formed in continuation to a first bonding point can be prevented from coming into contact with each other.

Wire bonding apparatus

An information processing device includes a network interface and a processor. The processor is configured to: acquire voice data via the network interface, analyze the acquired voice data, based on a result of the analysis, determine a search condition including one or more keywords for searching for one or more items, perform a search using the determined search condition, generate a first text indicating an item found by the search, and controls the network interface to output the generated first text. The processor is further configured to, when two or more items are found by the search, generate a second text suggesting another keyword other than said one or more keywords that have been used for the search, and controls the network interface to output the generated second text.

Information processing device, information processing system, and control method thereof

A voice recognition device includes a memory that stores dictionary data in which likelihoods that each of registered words precedes other registered words are stored, and digital voice data corresponding to a voice signal input through a microphone, and a processor configured to perform voice recognition and acquire a first character string corresponding to the digital voice data, when a first letter of the first character string is a vowel letter, generate a plurality of first words that precede a second word in the first character string according to the dictionary data, each of the first words having a different first letter, and select one of the first words based on the likelihoods and output the second character string that is a combination of the selected first word and the second word.

Voice recognition device and voice recognition method

A voice recognition device includes a memory and a processor. The processor is configured to store in the memory, digital voice data corresponding to a voice signal input from a voice input unit, recognize a spoken voice utterance from the voice data after a voice input start instruction is received, determine whether to correct the recognition result of the spoken voice utterance based on a time interval from a time when the voice input start instruction is received to a time when the voice signal is input via the voice input unit, and correct the recognition result of the voice utterance based on the time interval.

Voice recognition device configured to start voice recognition in response to user instruction

The disclosure includes: a first lifting step for bonding a wire at a first position () with a capillary and for lifting the capillary up to a first height Hwhile feeding the wire; a circular arc lifting step for carrying out a circular arc motion for moving the capillary in a circular arc toward a second position () by a first distance (L), and then carrying out a lifting motion for lifting the capillary while feeding the wire; a circular arc motion step for moving the capillary in a circular arc toward the first position () by a second distance (L+L); a second lifting step for lifting the capillary up to a second height H; and a looping step for looping the capillary to the second position (), thereby forming a wire loop having a predetermined height on a substrate by bonding the wire at the second position ().

Manufacturing method of semiconductor device

A method of manufacturing a semiconductor device includes: a wire tail forming step of forming a wire loopbetween a first bonding point and a second bonding point with a bonding tool, and then cutting a portion of a wireextending from a tip of the bonding toolto thereby form a wire tailat the tip of the bonding tool; and a wire tail bending step of bending the wire tailso as to direct a tipof the wire tailupward by descending the bonding tooltoward the second bonding point with the wire loopformed thereat and pressing the wire tailagainst a portion of the wire looplocated above the second bonding point. Thus, the wire tail can be bent easily and efficiently.

Method of manufacturing semiconductor device and wire bonding apparatus

A wire bonding apparatus includes: a bonding toolinto and through a wirepasses; a control unitthat performs a movement process of the bonding toolfor cutting the wireafter forming a wire loopbetween first and second bonding points of a bonding target; and a monitoring unitthat supplies a predetermined electric signal between the wirethrough the bonding tooland the bonding target, and monitors whether the wireis cut or not based on an output of the supplied electric signal. The control unitcontinues the movement process of the bonding toolwhile the wireis determined not to be cut, and stops the movement process of the bonding toolwhen the wireis determined to be cut, based on a monitoring result from the monitoring unit. This can shorten the operation time of the wire bonding, and improve the process efficiency of the wire bonding.

Wire bonding apparatus and method of manufacturing semiconductor device

A semiconductor device manufacturing method includes: raising and moving a bonding tool, while paying out a wire, in a direction from a second toward a first bonding point to form in the wire a cut portion bent in a vicinity of the second bonding point; lowering and moving a tip of the bonding tool to the cut portion; lowering the bonding tool vertically to thin the cut portion; raising the bonding tool while paying out the wire; and moving the bonding tool in a direction away from the first and second bonding points and along a wire direction connecting the first and second bonding points and then cutting the wire at the cut portion to form a wire tail. This allows the length of the wire tail to be adjusted easily and efficiently to be constant.

Semiconductor device manufacturing method, semiconductor device, and wire bonding apparatus

Provided is a wire-bonding apparatus () including: a capillary () through which a wire () inserted; and a controller (). The controller () is configured to execute operations including: a disconnection operation, after the second bonding operation, of moving the capillary through which the wire is inserted within a horizontal plane vertical to an axial direction of the capillary while the wire is held in the clamped state, and thereby disconnecting the wire from the second bonding point; a preliminary bonding operation of feeding the wire from the second bonding point to a predetermined preliminary bonding point, and performing preliminary bonding at the preliminary bonding point; and a shaping operation, after the preliminary bonding operation, of shaping the wire projecting from a tip of the capillary into a predetermined flexed shape.

Wire-bonding apparatus and method of manufacturing semiconductor device

Provided is a wire-bonding apparatusincluding a capillarythrough which a wireis inserted, a nonsticking determination circuit, and a controller. The nonsticking determination circuitapplies a predetermined alternating-current electrical signal between the wire held by the capillary and the bonding target, obtains a capacitance value between the wire held by the capillary and the bonding target, determines that the wire is disconnected from the bonding target when the capacitance value decreases after the first bonding operation, and determines that the disconnected wire drops down and is brought into contact with the bonding target when the capacitance value returns to an original value before reaching the second bonding point.

Wire-bonding apparatus and method of wire bonding

A semiconductor device includes a common wire that sequentially connects three or more pads; bonding portions at which a side surface of the wire is bonded to the pads; and looping portions looped from the bonding portions onto the other pads adjacent to the pads, the bonding portions and the looping portions are formed alternately. When the pads are recessed from the surface of semiconductor chips, the common wire is crushed to a thickness greater than the recess depth of the pads to be made into a flat shape. Thus, on the semiconductor device, wire connection is performed with a smaller bonding count while reducing damage to the semiconductor chips, and at the same time bonding is performed efficiently to the electrodes recessed from the surface of the semiconductor chips.

Method of manufacturing semiconductor device

Provided is a wire-bonding apparatus () including: a capillary () through which a wire () is inserted; a nonsticking determination circuit () configured to apply a predetermined electrical signal between a bonding target and the wire () in a clamped state and to determine whether or not the wire () and the bonding target is sticking as well as whether or not the wire () is disconnected based on a response of the application of the predetermined electrical signal; an annular projecting length detection ring () disposed coaxially with the capillary (); and a projecting length determination circuit () configured to determine whether or not a projecting length of a wire tail projecting from the tip of the capillary () is appropriate based on detection on whether or not power is conductive when a predetermined inspection voltage is applied between the wire () and the projecting length detection ring () as well as a presence of a discharge spark when a predetermined inspection high voltage is applied between the wire () and the projecting length detection ring ().

Provided is a wire bonding apparatus capable of performing high-speed wedge wire bonding, the apparatus including: a bonding tool having a through hole and a pressing surface for pressing a wire; a clamper for holding the wire; and a control unit. The control unit includes: wire tail extension unit that moves the bonding tool, after wedge bonding of the wire to a first lead, upward and along a second straight line connecting a second pad and a second lead, and causes the wire to extend from the through hole in a direction along the second straight line from the second pad to the second lead; and tail cut unit that, after causing the wire tail to extend, cuts the wire tail by moving the bonding tool in the direction along the second straight line connecting the second pad and the second lead while the clamper is closed.

Wire bonding apparatus and bonding method

According to one embodiment, the flow line recognition system includes a first device, a first recording unit, a second device, a second recording unit and a generation unit. The first device detects a position of a moving object in a monitoring area by laser scanning. The second device detects a position of the moving object in a specific area, which is a part of the monitoring area, more accurately than the first device. The generation unit generates flow line information indicative of a path of the moving object moving in the monitoring area, based on the moving object information for the monitoring area recorded in the first recording unit, and the moving object information for the specific area recorded in the second recording unit.

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Tokyo, Japan

Naoki Sekine