Nitto-denko Corporation

Naoki Sadayori

Yuji Hotta

Noriaki Harada

Kazuki Uwada

Ichiro Suehiro

Akiko Matsumura

Ichirou Suehiro

Amane Mochizuki

Takahiro Fukuoka

Kazunori Mune

Ryuusuke Naitou

Kazuki Uawada

A semiconductor sintered body comprising a polycrystalline body, wherein the polycrystalline body includes silicon or a silicon alloy, wherein the average grain size of the crystal grains forming the polycrystalline body is 1 &#x3bc;m or less, and wherein nanoparticles including one or more of a carbide of silicon, a nitride of silicon, and an oxide of silicon are present at a grain boundary of the grains.

Method of producing semiconductor sintered body, electrical/electronic member, and semiconductor sintered body

A semiconductor sintered body comprising a polycrystalline body, wherein the polycrystalline body comprises silicon or a silicon alloy, and the average grain size of the crystal grains constituting the polycrystalline body is 1 &#x3bc;m or less, and the electrical conductivity is 10,000 S/m or higher.

Method of producing semiconductor sintered body

A semiconductor sintered body comprising a polycrystalline body, wherein the polycrystalline body comprises magnesium silicide or an alloy containing magnesium silicide, and the average grain size of the crystal grains constituting the polycrystalline body is 1 &#x3bc;m or less, and the electrical conductivity is 10,000 S/m or higher.

The present invention provides A direct-type backlight having: a resin sealing member including at least one resin layer, which has a light reflecting section formed on the outermost surface of the resin sealing member; an optical semiconductor element sealed by the resin sealing member; and plural circular light scattering grooves formed concentrically on at least one surface of the resin layer, wherein an area of a circle in the center and an area among the respective concentric circles are substantially the same.

Direct-type backlight

The invention provides a sheet for optical-semiconductor element encapsulation, which has a multilayer structure including at least two resin layers. The at least two resin layers include: (A) an outermost resin layer (layer A) that is to be brought into contact with one or more optical semiconductor elements; and (B) a resin layer (layer B) disposed on the layer A and having a lower refractive index than that of the layer A. Also disclosed is a process for producing an optical semiconductor device using the sheet.

Sheet for optical-semiconductor element encapsulation and process for producing optical semiconductor device using the sheet

The invention provides a process for producing a light-emitting semiconductor device, which comprises: (1) forming a polycarbodiimide-containing layer on a light takeout side of a light-emitting semiconductor element; and (2) forming irregularities on the surface of the polycarbodiimide-containing layer.

Process for producing light-emitting semiconductor device

A polycarbodiimide copolymer which comprises at least one structural unit selected from rubber residues represented by the following formulae (1) and (2) in a number 'm':and a structural unit represented by the following formula (3) in a number 'n':and which comprises on both termini a terminal structural unit derived from a monoisocyanate, wherein m is an integer of 2 or more, n is an integer of 1 or more, m+n is from 3 to 1,500 and m/(m+n) is from 1/1,500 to &#x2153;. The polycarbodiimide is capable of keeping the inherent heat resistance and also showing excellent flexibility. Films and molding materials having high heat resistance and flexibility can be obtained.

Polycarbodiimide copolymer and production method thereof

An adhesive film for underfill excellent in relaxation effect of the stress generated in the above semiconductor element and the wiring circuit board and in the connecting electrode parts and also excellent in reliability of electrical connection between the semiconductor element and the wiring circuit board.

Adhesive film for underfill and semiconductor device using the same

A microlens array having a resin layer forming convex lenses, wherein the resin layer comprises a cured product of a polycarbodiimide resin represented by formula:wherein R represents a diisocyanate residue; Rrepresents a monoisocyanate residue; and n represents an integer of 1 to 100.

Microlens array

An adhesive film for underfill which relaxes the stress formed in the wiring circuit substrate, semiconductor element and electrode parts for connection. The adhesive film is a quickly hardening type, and forms a highly heat resistant sealing resin layer quickly between the wiring circuit substrate and semiconductor element of a semiconductor device.

A process of producing a polymer optical waveguide, including (a) a step of forming an undercladding layer on a substrate; (b) a step of forming a photosensitive resin composition layer containing a 1,4-dihydropyridine derivative and a resin on the undercladding layer; (c) a step of irradiating a region of the photosensitive resin composition layer corresponding to a core pattern with UV light through a mask to form UV light-exposed areas and UV light-unexposed areas on the photosensitive resin composition layer; (d) a step of heating the UV light-exposed areas and UV light-unexposed areas of the photosensitive resin composition layer; and (e) a step of forming an overcladding layer on the photosensitive resin composition layer after heating.

Growing community of inventors

Osaka, Japan

Naoki Sadayori