Renesas Electronics Corporation

Renesas Technology Corp.

Naoki Okamoto

Akio Hasebe

Hideyuki Matsumoto

Yasunori Narizuka

Susumu Kasukabe

Yasuhiro Motoyama

Masayoshi Okamoto

Shingo Yorisaki

A probe is contacted to a test pad, without destroying the circuit formed in the chip at the time of a probe test. Therefore, a load jig, a pressing tool, an elastomer, an adhesion ring, and a plunger are made into one by fixation with a nut and a bolt. The elastic force of the spring installed between the spring retaining jig and the load jig acts so that the member used as these one may be depressed toward pad PD. The thrust transmitted from the spring in a plunger to a thin films sheet is used only for the extension of a thin films sheet.

Manufacturing method of semiconductor integrated circuit device

A frame bonded and fixed to a back face of a probe sheet so as to surround a group of pyramid-shaped or truncated pyramid-shaped contact terminals collectively formed at a central region portion of the probe sheet on a probing side thereof is protruded from a multi-layered wiring board, and pressing force is imparted to the frame and a pressing piece at a central portion by a plurality of guide pins having spring property so as to tilt finely.

Probe card, semiconductor inspecting apparatus, and manufacturing method of semiconductor device

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Ome, Japan

Naoki Okamoto