Hitachi Chemical Company, Ltd.

Naoki Nara

Takaki Kashihara

Mitsuo Katayose

Shinsuke Hagiwara

Masaki Yoshii

Fumio Furusawa

Tatsuo Kawata

Hiroki Sashima

Ryoichi Ikezawa

Masanobu Fujii

Hiroyuki Sakai

Yoshinori Endou

Terumi Tsukahara

Kazuhiko Miyabayashi

Takahiro Horie

Mitsuo Togawa

Hideyuki Chaki

Yoshihiro Mizukami

An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 &#x3bc;m or less and a specific surface area of 3.0 m/g or more.

Epoxy resin molding material for sealing use and semiconductor device

An LOC structure semiconductor device having a good solder heat resistance without electrical characteristic failures due to damages to the passivation film and the diffusion layer thereunder attributing to the filler can be obtained by encapsulating an LOC structure semiconductor chip with an encapsulating material comprising an epoxy resin, a curing agent, a curing promoter, and an inorganic filler, the filler having a smaller particle size than the distance between a inner lead and a semiconductor chip and being in an amount of 80 to 95% by weight based on the total weight of the encapsulating material.

Encapsulating material and LOC structure semiconductor device using the same

An epoxy resin composition for semiconductor sealing, which comprises an epoxy resin, a curing agent and an inorganic filler, and has a J-value of 10 to 50, which is a maximum jetting flow value determined according to a method of evaluating jetting flow of epoxy resin composition.

Epoxy resin composition for semiconductor sealing and resin molded type

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Tochigi, Japan

Naoki Nara