Sumitomo Bakelite Company Limited

Naoki Mogi

Takashi Aihara

Shigehisa Ueda

Kenichi Yanagisawa

Hironori Ohsuga

Hiroshi Yasuda

Hiroshi Shimawaki

Hiroshi Fujita

Disclosed is an epoxy resin composition for sealing semiconductors which comprises as essential components: (A) an epoxy resin containing a biphenyl type epoxy resin represented by the following formula (1) in an amount of 30-100% by weight on the basis of the total amount of the epoxy resin, ##STR1## wherein R.sub.1 -R.sub.8 are the same or different atoms or groups selected from hydrogen, halogens and alkyl groups, (B) a hardener containing a phenolic resin hardener represented by the following formula (2a) or a naphthol resin hardener represented by the following formula (2b) in an amount of 30-100% by weight on the basis of the total amount of the hardener, ##STR2## wherein R.sub.1 -R.sub.8 are the same or different atoms or groups selected from hydrogen, halogens and alkyl groups, R.sub.9 is a group selected from phenyl, naphthyl, anthracenyl and alkyl groups, and n is 1-6, ##STR3## wherein R is a group selected from phenyl, naphthyl, anthracenyl and alkyl groups, and n is 1-6, (C) an inorganic filler, and (D) a hardening accelerator.

Epoxy resin composition

An epoxy resin composition used for sealing of semiconductor devices, comprising as essential components:

An epoxy resin composition for semiconductor sealing which comprises, as essential components,

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Utsunomiya, Japan

Naoki Mogi