Daishinku Corporation

Naoki Kohda

Hiroki Yoshioka

Syunsuke Satoh

A crystal resonator elementhas excitation electrodesformed on front and back main surfaces of a crystal resonator plate. Each of the excitation electrodes is made of a ternary alloy containing silver as a major component, a first additive, and a second additive. The first additive is a metal element having a lower sputtering yield than silver and being resistant to corrosion in an etching liquid. The second additive is an element for forming a solid solution with silver. Outer peripheries of the excitation electrodes are first additive-rich regionsin which the first additive is rich.

Piezoelectric resonator element, piezoelectric device using the piezoelectric resonator element, method for producing the piezoelectric resonator element, and method for producing the piezoelectric device using the piezoelectric resonator element

A piezoelectric vibration piece has an inverted mesa-type structure, comprising a thinned portion serving as a vibration region at a central part of a piezoelectric plate; and a thickened portion formed all along or partly along perimeter of the thinned portion to reinforce the thinned portion. In the piezoelectric vibration piece, contact metals including a large number of discrete metallic thin films are provided on the whole surfaces of the piezoelectric plate. A piezoelectric vibration device comprises the piezoelectric vibration piece which is housed in a package, wherein extraction electrodes of the piezoelectric vibration piece are connected to internal terminals of the package through a conductive adhesive. These structural and technical advantages prevent undesirable flowage of the conductive adhesive before thermal curing. As a result, the piezoelectric vibration piece and the piezoelectric vibration device comprising the same successfully attain excellent vibration characteristics.

Piezoelectric vibration piece and piezoelectric vibration device using same

The present invention relates to an electronic component package, an electronic component package sealing member, and a method for producing the electronic component package sealing member. A through holeis formed in a baseso as to pass through between both main surfacesandof a base material of the base. An inner side surfaceof the through holeincludes a curved surfacethat expands outward in a width direction of the through hole

Electronic component package, electronic component package sealing member and method for producing the electronic component package sealing member

A manufacturing method for a piezoelectric resonator device includes sequential steps of: (i) laminating a metal film constituted by at least two types of metals on at least one of a substrate of a joining region of a piezoelectric resonator plate, a substrate of a region of an upper lid member, and a substrate of a region of a lower lid member; (ii) promoting metal diffusion inside the metal film by heat processing; and (iii) roughening a surface of the substrate of the at least one of the piezoelectric resonator plate, the upper lid member, and the lower lid member by performing wet etching with an etchant caused to penetrate into the metal film and thereby forming a large number of micropores in the surface of the substrate of the at least one of the piezoelectric resonator plate, the upper lid member, and the lower lid member.

Manufacturing method for piezoelectric resonator device

[Solving means] In a package member assembly, a plurality of package members are integrally formed. The package member assembly includes a plurality of bottomed holes provided on a front main face and a back main face of a wafer made of glass, and external terminals connected to side-face conductors attached to inner wall faces of the bottomed holes on the back main face.

Package member assembly, method for manufacturing the package member assembly, package member, and method for manufacturing piezoelectric resonator device using the package member

A sealing member for an electronic component package includes, on another principal surface of a base material constituting the sealing member for the electronic component package, an external terminal electrode, a wiring pattern, and a resin material. The external terminal electrode is to be electrically coupled to an outside of the electronic component package. The wiring pattern is configured to couple an electronic component element on one principal surface of the base material to the external terminal electrode. The resin material is layered over the other principal surface and the wiring pattern. The external terminal electrode is layered over the wiring pattern and the resin material.

Sealing member for piezoelectric resonator device and pieoelectric resonator device

A method for manufacturing piezoelectric resonator devices according to the present invention includes the following steps: a wafer forming step of preparing a thick-walled waferintegrally formed with multiple lower lid members; a bonding step of bonding crystal resonator platesto one main surfaceof the wafervia a bonding materialand bonding upper lid memberson the crystal resonator plates via a bonding material; a thinning step of thinning the waferfrom the other main surfaceof the wafer; an external terminal forming step of forming external terminals on the other main surface of the thinned wafer; and a dividing step of cutting the wafer between each adjacent pair of crystal resonators so that multiple crystal resonators are obtained.

Method for manufacturing piezoelectric resonator device

An electronic component package has a first sealing member main surface with mounted electronic element, and a second sealing member. An outer circumference portion of a second sealing member is molded into a tapered shape, providing a tapered area in at least part of the outer circumference. A flat area adjacent to the tapered area is provided in at least part of a flat portion inward of the outer circumference portion of the surface of the second sealing member. A first area corresponding to the tapered area and a second area corresponding to the flat area are provided adjacent to each other on a first main surface of the first sealing member with mounted electronic component element. A width Wof the second area is 0.66 to 1.2 times a width Wof the flat area. First and second bonding layers are formed and bonded with each other by heating.

Electronic component package, electronic component, and electronic component package manufacturing method

An electronic component package sealing member that can be used as a first sealing member in an electronic component package in which an electrode of an electronic component element is hermetically sealed with the first sealing member and a second sealing member arranged so as to oppose each other, includes: a through hole that passes through a substrate of the electronic component package sealing member; an internal electrode that is formed on a face of the substrate opposing the second sealing member; an external electrode that is formed on a face of the substrate opposite the opposing face; and a through electrode that is formed on an inner side face of the through hole electrically connecting the internal electrode and the external electrode. In the electronic component package sealing member, at least one open face of the through hole is sealed with a resin material.

Electronic component package sealing member, electronic component package, and method for manufacturing electronic component package sealing member

In a piezoelectric resonator plate, a substrate having a main face formed in a rectangular shape is provided with a vibration portion and a joining portion that are integrated with each other, the vibration portion including a vibration region configured by forming a pair of excitation electrodes, and the joining portion having formed therein a pair of terminal electrodes that is joined to an external portion. The terminal electrodes in the pair each have a conductive bump formed therein and are electrically connected respectively to the excitation electrodes in the pair. Also, the substrate includes a post portion formed convexly at a position where the pair of terminal electrodes is formed.

Piezoelectric resonator plate and manufacturing method for piezoelectric resonator plate

A piezoelectric resonator device is provided with a piezoelectric resonator plate, and first and second sealing members that hermetically seal driving electrodes formed on the piezoelectric resonator plate. The piezoelectric resonator plate and the first sealing member are bonded together with a bonding material, and the piezoelectric resonator plate and the second sealing member are bonded together with a bonding material. Also, a multiple-surface bonding portion and a spread preventing portion are provided in at least either of a bonding area between the piezoelectric resonator plate and the first sealing member and a bonding area between the piezoelectric resonator plate and the second sealing member, the multiple-surface bonding portion allowing a bonding material to be bonded to multiple surfaces of different surface orientations, and the spread preventing portion being located on an outer side of the multiple-surface bonding portion and preventing a bonding region bonded to the bonding material from being enlarged.

Piezoelectric resonator device and method for manufacturing piezoelectric resonator device

A sealing member of a piezoelectric resonator device is configured to hermetically seal a driving electrode formed on a piezoelectric resonator plate. In the sealing member, a through hole is formed so that an electrode pattern formed on both major surfaces of the substrate is brought into conduction; and a conductive member fills in the through hole. The through hole has a smaller diameter at a portion thereof inside the substrate than at both end portions thereof at the major surfaces of the sealing member. Both end faces of the conductive member have a concave shape with respect to the major surfaces of the substrate of the sealing member.

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Kakogawa, Japan

Naoki Kohda