Shin-etsu Polymer Co., Ltd.

Naoki Kodama

Akio Nakamura

Ryoichi Sado

Hirofumi Saita

Osami Hayashi

The invention provides a very efficient and reliable method for electrically connecting the electrodes of an electronic device, e.g., IC chips, and the electrodes of, for example, a glass-made circuit board substrate with good repairability. Thus, the electrodes of the IC chip are each first coated with an electroconductive thermally meltable adhesive resinous composition to form a resinous bump, the IC chip is mounted on the substrate with the adhesive-coated electrodes contacting with the respective electrodes of the substrate, and remelting and then solidifying the resinous bumps so that the electrodes are bonded and electrically connected together. As compared with the conventional methods in which an electroconductive thermosetting resinous composition is used for the bumps on the electrodes, the electrical connection can be obtained with a smaller thermal effect and good replaceability of the IC chip found unacceptable with an acceptable one.

Method for electrically connecting IC chips, a resinous bump-forming

The pressure-sensitive resistor comprising an electroconductive elastomer, in which an electroconductive particulate material is dispersed, two electrodes placed on the opposing surfaces of the elastomer, a means for providing a compressive force between the electrodes and a means for adjusting the compressive force, works on a novel principle that the elastomer composite exhibits a positive coefficient in the curve of compression vs. resistance relationship when the compressive force is varied in a region exceeding an inversion point at which the resistance of the elastomer as measured in the direction of compression is minimal. The coefficient in this positive region is smaller than in the ordinary negative region, so that the variable resistance of the resistor can be controlled very delicately together with the decreased contribution of the uncontrollable contact resistance.

Growing community of inventors

Saitama, Japan

Naoki Kodama