Ngk Spark Plug Company, Limited

Naoki Kito

Masami Hasegawa

Satoshi Hirayama

Kenji Suzuki

Satoshi Hirano

Kozo Yamasaki

Osamu Hisada

Shinichiro Haneishi

Norihiko Kawai

Yosuke Imoto

Katsuhiko Hasegawa

Hiroaki Yamamoto

Kazushige Akita

Yoshitaka Yoshida

Takatoshi Tojo

Jun Suzuki

Yutaro Kameyama

Jyun Suzuki

Chizuo Nakashima

A wiring board has a metal-made base having a front surface and a back surface, an insulating frame body bonded to the front surface of the base through a bonding layer made of bonding material, a seating provided in an area that is located at an inner side with respect to the frame body on the front surface of the base, a mounting area where a component is supposed to be mounted on the front surface of the base, and a groove formed on the front surface of the base. The groove is arranged in at least an area between the mounting area and the seating on the front surface in plan view, and extends in a direction crossing an opposing direction of the mounting area and the seating.

Wiring board

A wiring board has a metal-made base having a front surface and a back surface, an insulating frame body bonded to the front surface of the base through a bonding layer made of bonding material, a mounting area where a component is supposed to be mounted on the front surface of the base, and a restriction portion formed by a groove or a protrusion that is provided on the front surface of the base or by a combination of the groove and the protrusion. The restriction portion is arranged in at least a part of an area between the mounting area and the frame body on the front surface in plan view.

A ceramic package includes a package main body which is formed of a ceramic material, which has a front surface and a back surface having a rectangular shape in plan view, and which has a cavity opening toward the front surface; a first metalized layer which has a frame shape in plan view and is formed on the front surface; and a second metalized layer which is formed on the front surface of the first metalized layer so as to assume a frame shape, and which has a width smaller than the width of the first metalized layer, wherein the width of the second metalized layer at each corner portion of the front surface in plan view is smaller than the width of the second metalized layer in a region other than the corner portion in plan view.

Ceramic package

A wiring substrate includes a substrate main body which is formed of a ceramic laminate and has a rectangular shape in plan view, and which has a front surface and a back surface and has four side surfaces, each being located between the front surface and the back surface, and having a groove surface located on a side toward the front surface and a fracture surface located on a side toward the back surface; and a metalized layer which is formed on the front surface of the substrate main body so as to extend along the four side surfaces, and which has a rectangular frame shape in plan view, wherein a horizontal surface of the ceramic laminate of the substrate main body is exposed between the metalized layer and the groove surface of each side surface of the substrate main body.

Wiring substrate, multi-piece wiring substrate, and method for manufacturing same

Provided are a ceramic wiring substrate; a multi-piece ceramic wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the wiring substrate array. The ceramic wiring substrate includes a substrate main body, which has a front surface, a back surface, side surfaces, a groove surface located on a side toward the front surface, and a fracture surface located on a side toward the back surface; and a notch which has a concave shape in plan view, and which is provided on at least one of the side surfaces so as to extend between the front surface and the back surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has curved portions on opposite sides of the notch, the curved portions being convex toward the front surface of the substrate main body in side view.

Ceramic wiring board, multi-piece ceramic wiring board, and method for producing same

A wiring substrate includes a substrate body formed of a plate-like ceramic, having a front surface, a back surface, and a height of 0.8 mm or less; a cavity opening at the front surface and having a rectangular shape as viewed in plane; and side walls having a thickness of 0.3 mm or less between a side surface of the cavity and a side surface of the substrate body. The wiring substrate further includes an electrically conductive layer having the form of a frame and formed on the front surface to surround an opening of the cavity; a ceramic surface having the form of a frame and located adjacently to the electrically conductive layer and along the outer periphery of the front surface; and a via conductor formed in the substrate body along the side surface of the cavity between a bottom surface of the cavity and the front surface.

Wiring substrate and multi-piece wiring substrate

Provided are a ceramic wiring substrate having a side surface which realizes reliable chucking or hooking; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate is formed of a ceramic material, has a square (rectangular) shape in plan view, and which has a front surface, a back surface, and side surfaces each being located between the front surface and the back surface, wherein each side surface has a belt-like uneven surface including a plurality of alternate and parallel convex portions and concave portions which are formed so as to extend along the front surface, and also has a fracture surface located on a side toward the back surface.

Wiring substrate, multi-piece wiring substrate, and method for producing same

Provided are a wiring substrate; a multi-piece wiring substrate array; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate includes a substrate main body, which has first and second main surfaces, side surfaces, a groove surface, and a fracture surface; and a notch which has a concave shape in plan view, and which is provided on a side surface on a side toward the first main surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has first curved portions on opposite sides of the notch, the first curved portions being convex toward the first main surface in side view; and also has a second curved portion on a second-main-surface side of the notch, the second curved portion being convex toward the second main surface of the substrate main body in side view.

Wiring substrate, multi-piece wiring substrate array, and manufacturing method therefor

A multilayer-wiring substrate having a via hole structure and method for fabricating the same. Referring to FIGS. ( ) and ( ), after a via-hole is formed by exposure and development in lithography or by laser-drilling, a bottom portion of the via-hole is subjected to resin-etching so as to expose a surface A of a lower conductor as shown in FIG. ( ). The exposed surface A of the lower conductor is chemically etched so that the conductor is undercut. As a result, undesired material B such as adhered residual resin shown in FIG. ( ) is completely removed. In etching the conductor at the bottom of the via hole , the lower conductor is preferably etched in an amount of 5-30% of the thickness of the lower conductor to form a depression or recess A at a via hole bottom C as shown in FIG. ( ), thereby reliably establishing electrical continuity between the lower conductor and the upper conductor by means of a via-hole conductor as shown in FIG. ( ).

Multilayer-wiring substrate and method for fabricating same

A method of making a printed board is provided. The printed board has a base provided with a plurality of through via conductors having through holes extending completely between upper and lower surfaces of the base and closed by resin fillings and a plurality of blind via conductors having depressions closed by resin fillings. The method comprises the steps of preparing the base provided with the through via conductors having the through holes and the blind via conductors having the depressions, filling the through holes of the through via conductors and the depressions of the blind via conductors with resin paste by printing, while at the same time forming, on an upper surface of the base and at locations around the through holes of the through via conductors and the depressions of the blind via conductors, a plurality of projections made of the above described resin paste by printing, and curing the resin paste, thereby forming the resin fillings in the through holes of the through via conductors and the depressions of the blind via conductors. By this method, the upper surfaces of the resin fillings in the through holes and the depressions are not caused to recede or sink and become lower in level than the upper surface of the base but can be maintained higher in level than the upper surface of the base, thus making it possible to dispense with a manufacturing step for closing receding spaces and manufacture the printed board at lower cost.

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Nagoya, Japan

Naoki Kito