Renesas Electronics Corporation

Naoki Kawanabe

Masanao Sato

Bunji Yasumura

Fumio Tsuchiya

Hisanori Ito

Takuji Ide

Hiroshi Ono

Tamaki Wada

Nobuyasu Muto

A technique is provided that can prevent cracking of a protective film in the uppermost layer of a semiconductor device and improve the reliability of the semiconductor device. Bonding pads formed over a principal surface of a semiconductor chip are in a rectangular shape, and an opening is formed in a protective film over each bonding pad in such a manner that an overlapping width of the protective film in a wire bonding region of each bonding pad becomes wider than an overlapping width of the protective film in a probe region of each bonding pad.

Semiconductor device

A method of manufacturing a semiconductor device which improves the reliability of a semiconductor device. The method of manufacturing the semiconductor device includes the step of connecting a ball portion formed at the tip of a wire with a pad (electrode pad) of a semiconductor chip. The pad is comprised of an aluminum-based material and has a trench in its portion to be connected with the ball portion. The ball portion is comprised of a harder material than gold. The step of connecting the ball portion includes the step of applying ultrasonic waves to the ball portion.

Method of manufacturing a semiconductor device including applying ultrasonic waves to a ball portion of the semiconductor device

The degree of freedom of the chip layout in a semiconductor device is improved, and improvement in packaging density is aimed at. Since it becomes possible to form the wire of two directions on the pad of a memory chip by performing the over-bonding of reverse bonding by ball bonding, an effect equivalent to continuation stitch bonding of wedge bonding can be produced by ball bonding. Hereby, the degree of freedom of a chip layout and the degree of freedom of the lead layout of substratecan be improved, and the packaging density on a substrate in a chip lamination type semiconductor device (memory card) can be improved.

Semiconductor device and a manufacturing method of the same

Growing community of inventors

Tokyo, Japan

Naoki Kawanabe