Mitsubishi Gas Chemical Company, Inc.

Naoki Kashima

Eisuke Shiga

Hiroshi Takahashi

Yoshihiro Kato

Katsuya Tomizawa

Keiichi Hasebe

Yoichi Takano

Kentaro Takano

Takaaki Ogashiwa

Yoshinori Mabuchi

Meguru Ito

Seiji Shika

Takenori Takiguchi

Tomoki Hamajima

Nobuyoshi Ohnishi

Shota Koga

The resin composition of the present invention comprises an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C).

Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them

The present invention provides a resin composition containing an allyl group-containing compound (A) and a maleimide compound (B), in which the allyl group-containing compound (A) has a reactive functional group other than an allyl group.

Resin composition, prepreg, metal foil-clad laminate, and printed circuit board

A resin composition used as a material of an insulating layer of a printed wiring board including the insulating layer and a conductor layer formed on a surface of the insulating layer by plating, the resin composition including: an epoxy compound; a cyanate compound; a maleimide compound; an inorganic filler; and an imidazole silane, wherein the maleimide compound includes a predetermined maleimide compound, a content of the maleimide compound is 25% by mass or less based on 100% by mass of a total content of the epoxy compound, the cyanate compound, and the maleimide compound, and the imidazole silane includes a compound represented by the formula (3).

Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same

A resin composition forms a roughened surface with low roughness on an insulating layer regardless of roughening conditions when used as an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also has low thermal expansion coefficient (linear expansion coefficient) and high glass transition temperature and is also excellent in moist heat resistance. The resin composition includes an epoxy compound, a cyanate ester compound and an inorganic filler, wherein the cyanate ester compound is at least selected from a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanate ester compound, a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound; and the content of the epoxy compound is 60 to 75% by weight based on the total amount of the epoxy compound and the cyanate ester compound.

Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil clad laminate, and printed wiring board using same

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Tokyo, Japan

Naoki Kashima