Sony Semiconductor Solutions Corporation

Naoki Kakoiyama

Shuichi Oka

Takahiro Igarashi

Shusaku Yanagawa

Daisuke Saito

Shun Mitarai

Hiizu Ohtorii

Kiwamu Adachi

Kousuke Seki

Hiroyuki Shigeta

Yuto Tanaka

Provided is a semiconductor device capable of maintaining the flatness of a glass substrate and sufficiently protecting an end portion of the glass substrate. The semiconductor device includes a glass substrate including a first surface, a second surface opposite to the first surface, and a first side surface between the first surface and the second surface. The semiconductor device further includes wirings provided provided on the first and second surfaces, a first insulating film that covers the first surface, a second insulating film that covers the second surface, and a third insulating film that covers the first side surface, the third insulating film being continuous with at least one of the first or second insulating films.

Semiconductor device

Provided is a light reflecting element including a support portion, a hinge portion, and a light reflecting portion, in which the light reflecting portion includes a support layer and a light reflecting layer, the hinge portion includes a torsion bar portion, extending portions extending from side portions of the torsion bar portion, and movable pieces extending from end portions of the extending portions, an end portion of the torsion bar portion is fixed to the support portion, the hinge portion is twistedly deformable around an axis of the torsion bar portion, the support layer is fixed to the movable pieces, and a recessed portion is provided at least at a portion of the support layer facing a space located between the first movable piece and the second movable piece.

Light reflecting element and spatial light modulator

A light reflecting element includes a support part, a hinge part, and a light reflecting part, in which the light reflecting partincludes a support layer and a light reflecting layer, the hinge partincludes a torsion bar portion, extending portionsA andB extending from sides of the torsion bar portion, and movable piecesA andB extending from ends of the extending portionsA andB, an end of the torsion bar portionis fixed to the support part, the hinge partis capable of being twisted and deformed around an axis of the torsion bar portion, the support layer is fixed to the movable piecesA andB, a recessD is provided at least in a portion of the support layer facing a spaceD located between the first movable pieceA and the second movable pieceB, and a stress adjusting layeris provided on the support layer in parallel to the light reflecting layerand separated from the light reflecting layer

To eliminate influence caused by a difference in coefficient of linear expansion between a substrate and another material, and to secure a stable mounting structure of a semiconductor element. A semiconductor device includes a glass substrate and the semiconductor element. The glass substrate includes a through hole that penetrates front and back surfaces. Furthermore, the glass substrate includes a stepped portion on an outer periphery of the through hole. The semiconductor element is joined to the stepped portion of the glass substrate. For example, in a case where an imaging element is used as the semiconductor element, image quality of an image obtained by imaging is improved by preventing defocus of light incident on the imaging element.

An antenna device and a wireless communication apparatus capable of implementing increase in bandwidth and reduction of the manufacturing cost are provided. The antenna device includes a first antenna element and a second antenna element arranged on one face side of the first antenna element. The first antenna element includes a first glass substrate and a first patch antenna provided on the first glass substrate. The second antenna element includes a second glass substrate and a second patch antenna provided on the second glass substrate. At least part of the first patch antenna faces the second patch antenna with an air gap interposed therebetween.

Growing community of inventors

KANAGAWA, Japan

Naoki Kakoiyama