Fujitsu Corporation

Fujitsu Frontech Limited

Naoki Ishikawa

Hiroshi Kobayashi

Hidehiko Kira

Shunji Baba

Takayoshi Matsumura

Kenji Kobae

Norio Kainuma

Satoshi Emoto

Takatoyo Yamakami

Masumi Katayama

Shigeru Hashimoto

Toshihiro Kusagaya

Yoshiyasu Sugimura

Shunichi Kikuchi

Akira Fujii

Kazuhisa Tsunoi

Tatsuro Tsuneno

Tsuyoshi Niwata

Shuichi Takeuchi

Satoru Nogami

Mimpei Miura

Yasuo Moriya

Syunji Baba

Takayoshi Matumura

An RFID tag is disclosed that includes a first sheet having flexibility and elasticity; an antenna having flexibility and elasticity and configured to be formed on a surface of the first sheet; an IC chip configured to be electrically connected to the antenna; a second sheet having flexibility and elasticity and configured to be attached to the first sheet and to cover the antenna and the IC chip with the first sheet; and a reinforcing member having flexibility and elasticity and configured to cover the IC chip and a connecting portion of the IC chip and the antenna.

RFID tag

In a manufacturing method of a thin and small RFID tag, an antenna metal pattern is formed on a substrate, going once around a dielectric plate, and a recess is formed on the substrate to house an IC chip. A strap on which the IC chip is mounted is connected and fastened to the substrate in the position and orientation in which the IC chip is housed in the recess.

RFID tag manufacturing method with strap and substrate

A method includes a step of preparing a strap having a connecting metal pattern formed on a base, and mounted with the circuit chip, the pattern connecting a circuit chip to a metal antenna pattern. A substrate has a concave section which houses the circuit chip and is formed on a first face. The metal antenna pattern extends over a first face and a second face of the base so as to circle them except for the concave section and to have the both ends positioned across the concave section. The method includes a connection step of positioning and directing the strap and the substrate to house the circuit chip in the concave section and covering the strap and the substrate with a covering material so as to fix the strap and the substrate in a state where the connection metal pattern is connected to the metal antenna pattern.

RFID tag manufacturing methods and RFID tags

A RFID tag includes: an antenna section having a first base and a loop antenna; a strap section having a second base and a first conductive pattern to which a circuit chip is electrically connected; and a protection section having a protection body having relatively high rigidity and a second conductive pattern in which the protection body has a groove formed therein large enough to house the circuit chip, and the second conductive pattern electrically connects the first conductive pattern to the loop antenna.

RFID tag and method for manufacturing the same

A radio-frequency-identification tag antenna includes a film base, a plurality of antenna patterns for transmission and reception, which is formed in parallel on the film base, and a cut line that is formed on the film base between adjacent antenna patterns along the antenna patterns from an inside to an outer edge of the film base. A part of the film base on which the antenna patterns are formed is folded or bent in a predetermined direction using the cut line.

RFID tag, RFID-tag antenna, RFID-tag antenna sheet, and method of manufacturing RFID tag

The present invention provides an IC chip mounting method for mounting two or more IC chips on a base, including: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the wafer having a mounting surface to be attached to the base, and by dividing the wafer into IC chips by dicing while leaving the tape; sequentially pressing the IC chips on the wafer against a first roller to allow the chips to be sucked onto the first roller; subsequently transferring the IC chips sucked onto the first roller to a second roller; and subsequently mounting the IC chips transferred to the second roller on the traveling base.

IC chip mounting method for mounting two or more IC chips by sequentially transferring the IC chips sucked onto a first roller to a second roller and mounting the IC chips transferred to the second roller on a traveling base

A method of assembling a carriage assembly is capable of suppressing deformation of spacer portions when suspensions are attached to carriage arms. The method of assembling a carriage assembly aligns fitting holes provided in front end portions of carriage arms and spacer holes provided in spacer portions of suspensions and places the suspensions onto the carriage arms, and then presses a ball with a diameter equal to or greater than an inner diameter of the spacer holes with a pressure-applying member to pass the ball through the spacer holes, thereby crimping spacer hole edge portions of the spacer portions and attaching the suspensions to the front end portions of the carriage arms. By applying ultrasonic vibration from two axial directions to the pressure-applying member, the pressure-applying member is caused to vibrate on a two-dimensional movement path on a predetermined plane and passes the ball through the spacer holes while causing the ball to rotate.

Method of assembling a carriage assembly

When crimping suspensions to carriage arms using a metal ball by applying ultrasonic vibration to a crimping tool, the suspensions can be crimped to the carriage arms without causing deformation to the suspensions and the like. A method of assembling a carriage assembly aligns attachment holes provided in front ends of carriage arms and crimping portions provided on suspensions to set the suspensions on the carriage arms and then presses a ball through crimping holes provided in the crimping portions while applying ultrasonic vibration to the crimping tool to crimp the suspensions to the carriage arms. When doing so, a ball, such as a ball whose surface has been subjected to a dimpling process, for which a load that acts on the ball when the ball passes through the crimping holes is low compared to a spherical ball is used to crimp the suspensions to the carriage arms.

A method of assembling a carriage assembly is disclosed. The method is are capable of suppressing fluctuation in the crimped (deformed) states of spacer portions when suspensions are attached to carriage arms. The method aligns fitting holesprovided in carriage armswith spacer holesof suspensionsThen the method passes a ballwith a diameter equal to or greater than an inner diameter of the spacer holesthrough the spacer holesto crimp edge portions of the spacer holesin spacer portionsand thereby attach the suspensionsto the carriage arms. While the ballis being pressed and sandwiched from both sides of the spacer holesby two pressure-applying membersan ultrasonic vibration is applied to the two pressure-applying members, the two pressure applying membersare moved so as to pass the ballthrough the spacer holes

The present invention relates to an RFID tag performing exchange of information with an external device without contact, and is to improve the resistance to bending while avoiding an increase in the thickness of the RFID tag. A circuit chip is bonded to a base portion of a base with a thermosetting adhesive. The base is folded, and an ultraviolet curing adhesive is applied on the circuit chip. The fold-back portions of the base are folded back onto the circuit chip, to which portions ultraviolet light is irradiated, as a result, both of the surfaces of the circuit chip are bonded to the base with the adhesives.

An RFID tag including a first part which has a first base and a communication antenna formed on the first base by use of a paste of resin material mixed with metallic filler; and a second part disposed on the first part, which has a second base, a metallic patch disposed on the second base and electrically connected to the antenna on the first part, and a circuit chip connected onto the metallic patch via a bump, the circuit chip performing radio communication via the antenna.

RFID tag, module component, and RFID tag fabrication method

A method of manufacturing an RFID tag includes forming through-holes on a sheet to embed a plurality of electronic components, such as IC chips; forming a substrate by sticking a bottom plate sheet to the sheet, and forming recesses; embedding the electronic components into the recesses; printing antenna patterns on the substrate such that the antenna patterns are connected to electrodes of the electronic components; covering the substrate with a cover sheet; and a slitting step of cutting out individual RFID tags.

RFID tag and method of manufacturing RFID tag

The present invention provides a radio frequency identification (RFID) tag which exchanges information with an external device in a noncontact manner, in which a paste is used as a material for an antenna, and which is designed to avoid the problem due to swelling of the paste caused by a pressing force from bumps of an IC chip. A paste escape recess is provided in which part of the paste provided to form the antenna is caused to flow therein by the pressure received from the bumps when the IC chip with the bumps is connected to the antenna.

Growing community of inventors

Kawasaki, Japan

Naoki Ishikawa