Kao Corporation

Hitachi-high-technologies Corporation

Hitachi, Ltd.

Fuji Jukogyo Kabushiki Kaisha

Hokkaido University

Hitachi-ge Nuclear Energy, Ltd.

Shibaura Institute of Technology

Naoki Hosoya

Toshifumi Honda

Takashi Hiroi

Shin Koike

Eiichi Hoshino

Takeshi Yasumasu

Shinji Yamamoto

Kenji Obara

Hisae Shibuya

Yoshikazu Ogura

Masaki Iwasaki

Yuji Takagi

Masami Shimizu

Atsushi Miyamoto

Takehiro Hirai

Ryo Nakagaki

Minoru Harada

Norihiko Satake

Yuuji Takagi

Takeyuki Yoshida

Tomoko Fukunaga

Tetsuya Abe

Yasufumi Suzuki

Kenji Nakahira

Hirohito Okuda

Yukitaka Tanaka

Yukiteru Sugiyama

Takatoshi Murase

Hitoshi Takaya

Fumihiko Fukunaga

Hideaki Ueoka

Eizo Maruyama

Yoji Kameo

Manabu Sato

Jun Saito

Naoto Kudo

Koichi Hayakawa

Hidetoshi Sekine

Kiyoshi Kataoka

Masaru Sakata

Daisuke Shiiba

Akihiro Onizawa

Katsuyuki Ichinohe

Shinichiro Takashima

Toshikazu Kawahara

Tomohiro Fukita

Minoru Yoshida

Itsuro Kajiwara

Hideo Maeda

Jun Kobori

Yoshihide Azabu

Takao Hibi

Masanori Komikado

Yasumasa Ohki

Hisao Ohmura

Yoshiaki Oyamada

Kojirou Hashizume

Hiroko Uchida

In performing a programmed-point inspection of a circuit pattern using a review SEM, stable inspection can be performed while suppressing the generation of a false report even when a variation in a circuit pattern to be inspected is large. SEM images that are obtained by sequentially imaging a predetermined circuit pattern using the review SEM are stored into a storage unit. Images that meet a set condition are selected from the stored SEM images, and averaged to create an average image (GP image). By performing pattern check by GP comparison using this GP image, an inspection can be performed while suppressing the generation of a false report even when a variation in the circuit patterns is large.

Method and device for testing defect using SEM

Disclosed is a method of inspecting an object to be inspected in a semiconductor manufacturing process, for resolving the problem to increase defect detection sensitivity. An image capture means is used to image capture a designated area of the object to be inspected; a defect is detected in the captured image; a circuit pattern is recognized from the captured image; a characteristic value is computed, relating to an image tone and shape, from the detected defect; a characteristic value is computed, relating to the image tone and shape, from the recognized circuit pattern; either a specified defect or circuit pattern is filtered and extracted from the detected defect and the recognized circuit pattern; a mapping characteristic value is determined from the characteristic value of either the filtered and extracted specified defect or circuit pattern; and the distribution of the determined characteristic values is displayed onscreen in a map format.

Inspection method and device therefor

A method for generating vibration and measuring vibration properties of a structure, such as information equipment, micro-electrco/mechanical systems, and large-equipment, using a non-contact type laser excitation in a non-contact type vibration property measurement system.

Method for measurement of vibration property of structure, and vibration property measurement device

In order to provide a technique for performing global alignment (detecting position shift and rotation of a wafer) stably and automatically using an optical microscope, as a pattern for global alignment, multiple alignment pattern candidates are calculated (), multiple data for matching are created for each alignment pattern (), matching is performed with respect to the data for matching for each alignment pattern in descending order of appropriateness as an alignment pattern with an image () based on an image signal from the optical microscope (), and the amount of position shift and the amount of rotation of the wafer are calculated () on the basis of the results of matching ().

Global alignment using multiple alignment pattern candidates

A conventional pattern inspection, which compares an image to be inspected with a reference image and subjects the resulting difference value to the defect detection using the threshold of defect determination, has difficulty in highly-sensitive inspection. Because defects occur only in specific circuit pattern sections, false reports occur in the conventional pattern inspections which are not based on the position. Disclosed are a defect inspection method and a device thereof which perform a pattern inspection by acquiring a GP image in advance, designating a place to be inspected and a threshold map to the GP image on the GUI, setting the identification reference of the defects, next acquiring the image to be inspected, applying the identification reference to the image to be inspected, and identifying the defects with the identification reference, thereby enabling the highly-sensitive inspection.

Defect inspection method, and device thereof

A fat or oil composition containing the following ingredients (A) and (B):

Fat or oil composition

In order to obtain a quality image without deterioration owing to radiation noise in inspection using the optical video camera in high radiation environment, an inspection apparatus is formed of an image pick-up unit, an image obtaining unit which fetches a video image that contains a signal (noise) that is substantially independent of each frame obtained by the image pick-up unit, a local alignment unit which locally aligns frames with different time phases for forming the image fetched by the image obtaining unit, a frame synthesizing unit which synthesizes the plurality of frames aligned by the local alignment unit for generating a synthesis frame with an SN ratio higher than the SN ratio of the frame before frame synthesis, and an image output unit for displaying or recording the image formed of the synthesis frame generated by the frame synthesizing unit.

Inspection apparatus and method for producing image for inspection

Provided are a preparation process of a purified green-tea extract capable of easily and efficiently removing a turbidity component contained in a green tea extract; a purified green-tea extract prepared by the preparation process; and a packaged beverage containing the purified green-tea extract. The preparation process of a purified green-tea extract containing, in the solid content thereof, from 36 to 99 mass % of non-polymer catechins comprises bringing a green tea extract into contact with a mixed solution containing an organic solvent and water at a mass ratio of from 65/35 to 97/3 and active carbon and/or acid clay or active clay, adjusting the organic solvent/water mass ratio of the resulting solution to from 0/100 to 85/15, and then separating the turbidity component thus separated.

Preparation process of purified green-tea extract

A non-tea-based, packaged beverage with a green tea extract mixed therein contains the following ingredients (A) and (B): (A) 0.06 to 0.5 wt. % of non-polymer catechins, and (B) 9 to 13.5 mM of citric acid or a salt thereof. Its pH is from 3.4 to 4.2. The non-tea-based, packaged beverage contains catechins at a high concentration, is reduced in bitterness and astringency, is suited for long-term drinking, and is excellent in the stability of bitterness and astringency and also in the feeling as it passes down the throat, and moreover, its color tone remains stable over a long term even when packed in a clear package and stored at high temperatures.

Packaged beverages

Provided is an examination technique to detect defects with high sensitivity at an outer-most repetitive portion of a memory mat of a semiconductor device and even in a peripheral circuit having no repetitiveness. A circuit pattern inspection apparatus comprises an image detection unit for acquiring an image of a circuit pattern composed of multiple die having a repetitive pattern, a defect judgment unit which composes, in respect of an acquired detected image, reference images by switching addition objectives depending on regions of repetitive pattern and the other regions and compares a composed reference image with the detected image to detect a defect, and a display unit for displaying the image of the detected defect.

Circuit pattern examining apparatus and circuit pattern examining method

A circuit-pattern inspection apparatus and related method provide a highly sensitive defect inspection of an area including the most circumferential portion of a memory mat of a semiconductor chip formed on a semiconductor wafer. In certain examples, an image of a circuit pattern of a die formed on the semiconductor wafer is acquired to judge whether or not the circuit pattern contains a defect.

Inspection apparatus and an inspection method for inspecting a circuit pattern

The present invention relates to a defect inspection apparatus for inspecting defects in patterns formed on a semiconductor device, on the GUI of which for the confirmation of the inspection results an area is provided for displaying any one of or facing each other the features amount of defects, and the image during inspection or the reacquired image, and on the GUI of which a means is provided for setting the classification class and importance of the defects, and based on the classification class and the importance of the defects information set by this setting means, the classification conditions or the defect judging conditions are automatically or manually set so that the inspection conditions may be set easily.

Method and apparatus for inspecting defects of circuit patterns

To provide a packaged high-catechin beverage in which a low-caffeine green tea extract is added. A packaged beverage containing from 0.03 to 1.0 wt % of non-polymer catechins, in which a low-caffeine green tea extract obtained by a method of brining a green tea extract into contact with a 91/9 to 97/3 by weight mixture of an organic solvent and water, activated carbon, and acid clay or activated clay is added.

Package drink

In order to be able to detect an irradiation position of an electron beam matching a defect position and conduct composition analysis of a defect with high precision and high efficiency, in the present invention, when a composition analysis target defect is selected and irradiation conditions of the electron beam are set for EDX analysis, a low-resolution reference image of low resolution is acquired using the electron beam at a defect corresponding position corresponding to the position of this defect on a chip in the vicinity of a target chip including defects, and a low-resolution defect image of the same low resolution is next acquired at the defect position of the target chip. Then, by comparing these low-resolution images, the defect position is acquired, the electron beam is slanted and irradiated on this defect position to acquire a composition spectrum of the defect.

Method and apparatus for analyzing composition of defects

The invention relates to oil composition comprising 0.1 to 59.8% by weight of a triglyceride, 40 to 99.7% by weight of a diglyceride, 0.1 to 10% by weight of a monoglyceride and at most 5% by weight of a free fatty acid, wherein contents of &#x3c9;3 type unsaturated acyl groups having at least 20 carbon atoms and monoenoic acyl groups in acyl groups constituting the diglyceride are 15 to 89.5% by weight and 10 to 84.5% by weight, respectively; and oral medicinal compositions and foods comprising such an oil composition. The oil composition effectively develops physiological functions derived from &#x3c9;3 type unsaturated fatty acids, such as inhibition of platelet aggregation, and is excellent in effect of facilitating combustion of body fat, oxidation stability, flavor and the like, and also excellent in flowability.

Oil composition

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Tokyo, Japan

Naoki Hosoya