The Furukawa Electric Co., Ltd.

Naoki Hayamizu

Yuta Ishige

Toshio Kimura

Etsuji Katayama

Hiroshi Hashimoto

Junji Yoshida

Naoki Tsukiji

Jun Miyokawa

Hideyuki Nasu

Yutaka Ohki

Kiyofumi Muro

Tetsuya Matsuyama

Takashi Koseki

Takeshi Koiso

Kohei Tsunetomo

Hideo Aoyagi

Yuji Yamagata

An optical part includes: an optical fiber having a core portion and a cladding portion that is formed around the core portion; a light absorber placed around the optical fiber; and an adhesive member that adheres the light absorber and the optical fiber to each other. Further, the cladding portion includes: a main portion extending along a longitudinal direction and having a main portion cladding diameter; and an input end portion positioned closer to a light input side with respect to the main portion, and an input end face cladding diameter at an input end face of the input end portion is less than the main portion cladding diameter.

Optical part and semiconductor laser module

A semiconductor laser module includes a package; a plurality of semiconductor laser elements provided in the package; a member having a plurality of mounting surfaces on which the semiconductor laser elements are mounted, the mounting surfaces being separated from a bottom surface of the package by respective distances, the distances being gradually different from each other in a manner that the mounting surfaces as a whole form a step-like form; a plurality of lenses collimating respective laser beams emitted from the semiconductor laser elements; a plurality of reflection mirrors reflecting the respective laser beams; a condenser lens unit condensing the laser beams; an optical fiber where the optical beams condensed by the condenser lenses are optically coupled; and an optical filter disposed on optical lines of the respective laser beams reflected by the reflection mirrors and reflecting light having wavelengths different from the wavelengths of the laser beams.

Semiconductor laser module

An optical module includes a base portion having a top-surface metal layer on a top surface of a base, a semiconductor element on the top-surface metal layer and an optical element optically-coupled to the semiconductor element and bonded to the base with adhesive at a first side surface of the base at a side of the optical element being optically-coupled. A pull-back area is formed on the top surface by disposing a second side surface at the side, of the top-surface metal layer at a retracted position to the first side surface at the side. Between an adhesion area where the base and the optical element are bonded and a mounting portion below an optical-power-outputting surface of the semiconductor element, the top-surface metal layer has an adhesive flow stopping portion formed, by patterning, so as to prevent the adhesive from flowing through the pull-back area to the mounting portion's side.

Optical module

A semiconductor laser module includes a semiconductor laser element outputting a laser light; an optical fiber; an optical component disposed at an outer periphery of the optical fiber and fixing the optical fiber; a first-fixing agent fastening the optical component and the optical fiber; a light-absorbing element disposed at an outer periphery of the optical component and fixing the optical component; a first light-blocking portion disposed between an end into which the laser light is incident of the optical fiber and the optical component; and a housing accommodating therein the semiconductor laser element, an end into which the laser light is incident of the optical fiber and the first light-blocking portion. The optical component has an optical transmittance at a wavelength of the laser light, and the light-absorbing element has an optical absorptivity at a wavelength of the laser light.

A semiconductor laser module includes: a semiconductor laser element emitting a laser light; an optical fiber, into which the laser light emitted from the semiconductor laser element is incident, guiding the laser light; and an optical-fiber-holding unit having a fixing agent and holding the optical fiber, the fixing agent being for fixing the optical fiber. The fixing agent is provided at an area in which a power of a leakage light of the laser light having been incident into the optical fiber and then emitted to outside the optical fiber is low.

A semiconductor laser moduleis mainly composed of a package, a semiconductor laser, lenses, reflecting mirrors, an optical fiber, and the like. The packageis composed of a bottom part and side surfaces. The side surfacesstand erect approximately vertical to the bottom part of the package. In the semiconductor laser module, a plurality of semiconductor laser installation surfacesare formed in a step-like shape. On each semiconductor laser installation surface, a semiconductor laseris installed. A lensis arranged at the anterior (in the emission direction) of the semiconductor laser. Moreover, a lensis arranged further to the anterior. A reflecting mirroris fixed to the side surface, which is provided facing the emission direction of the semiconductor laser.

A laser module includes a semiconductor laser element and a feedback optical component forming an external cavity with the semiconductor laser element. Even if a ratio of a current threshold of the laser module changing according to a polarized state of returned light from the feedback optical component to a current threshold of the semiconductor laser element is in an arbitrary range within a predetermined range, a total value of a relative intensity noise occurring between a first frequency determined according to a cavity length of the external cavity and at least equal to or more than a frequency band of using a laser light and a second frequency calculated by multiplying the first frequency by a predetermined number is equal to or more than &#x2212;40 dB.

Laser module

A package accommodates an LD device for emitting laser light with the center wavelength of which is in a range of 1300 to 1440 nm and airtight seals a light path extending from the LD device to an incident end of an optical fiber. The package is filled with a nitrogen gas at a standard atmospheric pressure with the amount of moisture limited to a value lower than 100000 ppm by volume or less. Therefore, the amount of moisture in the light path for laser light within the package is limited to 100000 ppm by volume or less.

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Tokyo, Japan

Naoki Hayamizu