Hitachi Chemical Company, Ltd.

Pacific Industrial Company, Ltd.

Naoki Hara

Atsushi Kuwano

Tomoo Nishiyama

Kazumasa Fukuda

Yoshitaka Takezawa

Hiroyuki Takahashi

Haruaki Sue

Hideyuki Katagi

Shigeo Sase

Shinichi Kosugi

Akira Momose

Toshiaki Shirasaka

Shigemitsu Yoshie

Yasuo Miyazaki

Kensuke Yoshihara

Satoshi Morita

Provided is a phenolic resin composition containing: an epoxy resin curing agent that contains a hydroxybenzene derivative represented by the following Formula (I) and a phenol resin having at least one partial structure selected from the group consisting of the following Formulae (IIa), (IIb), (IIc) and (IId); and an epoxy resin. In these Formulae, each of R, R, R, Rand Rindependently represents a hydroxy group, a hydrogen atom or an alkyl group; at least two of R, R, R, Rand Rare hydroxy groups; each Ar independently represents at least one group selected from the group consisting of the following Formulae (IIIa) and (IIIb); each of Rand Rindependently represents a hydrogen atom or a hydroxy group; and each of Rand Rindependently represents a hydrogen atom or an alkyl group. 

Phenolic resin composition

A resin composition including an epoxy resin monomer, a novolac resin including a compound having a structural unit represented by Formula (I), and a filler; in which the filler has at least 4 peaks in a particle size distribution measured by laser diffractometry, in which four of the peaks are present respectively in ranges of not less than 0.01 &#x3bc;m and less than 1 &#x3bc;m, not less than 1 &#x3bc;m and less than 10 &#x3bc;m, from 10 &#x3bc;m to 50 &#x3bc;m, and from 20 &#x3bc;m to 100 &#x3bc;m, and in which a peak present in a range of from 10 &#x3bc;m to 50 &#x3bc;m includes an aluminum oxide particle, and a peak present in a range of from 20 &#x3bc;m to 100 &#x3bc;m includes a boron nitride particle. In Formula (I) each of R, Rand Rindependently represents a hydrogen atom, an alkyl group, or the like. m represents 0 to 2, and n represents 1 to 7. 

Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and LED device

The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 &#x3bc;m to less than 1 &#x3bc;m, from 1 &#x3bc;m to less than 10 &#x3bc;m, and from 10 &#x3bc;m to 100 &#x3bc;m, and the filler contains boron nitride particles having particle sizes of from 10 &#x3bc;m to 100 &#x3bc;m. In the general Formula (I), Rrepresents an alkyl group, an aryl group, or an aralkyl group. Each of Rand Rindependently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7. 

Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for producing same, semiconductor device and LED device

A tire condition monitor device includes a circuit board mounted on a tire wheel for detecting a pneumatic pressure in an interior of a tire. The circuit board is covered with urethane resin. The urethane resin has finer resin meshes as compared with the conventional silicon resin serving as a board protecting resin. Since sulfur gas and water is hard to permeate through the urethane resin, gas barrier and dampproof properties can be improved. In a method of manufacturing the tire condition monitor device, a prebaking process is carried out before a board protecting process of covering the circuit board with the urethane resin. Since moisture contained in the circuit board is vaporized, the circuit board covered with the urethane resin can reliably be protected from moisture.

Tire condition monitor device and method of manufacturing the same

Growing community of inventors

Ibaraki, Japan

Naoki Hara