Murata Manufacturing Co., Ltd.

Naoki Gouchi

Kuniaki Yosui

Shingo Ito

Nobuo Ikemoto

Katsumi Taniguchi

Naoto Ikeda

Noboru Kato

Jun Sasaki

Toshiyuki Nakaiso

Kazutaka Muraoka

Takahiro Baba

Kanto Iida

Hirotaka Fujii

Hiroyuki Irikawa

Kengo Onaka

Yuki Wakabayashi

Yuki Ito

Teppei Miura

Wataru Tamura

Isamu Morita

Kosuke Takeuchi

An antenna device includes a plate-shaped radiating element that radiates a radio wave polarized in an X-axis direction, a grounding electrode (GND), and a dielectric substrate that carries the radiating element and the grounding electrode (GND). In the dielectric substrate, dielectric in designated regions, which are included in adjustment regions that are located on the outer side with respect to first boundary planes and on the outer side with respect to second boundary planes, is thinner than dielectric in a non-adjustment region. The first boundary planes are planes extending on end faces of the radiating element on the respective sides in an X-axis direction (polarization direction) and being orthogonal to the X-axis direction. The second boundary planes are planes extending on end faces of the radiating element on the respective sides in a Y-axis direction and being orthogonal to the first boundary planes and to the Y-axis direction.

Antenna device

An antenna module includes an antenna substrate including a feed element, and a radio frequency integrated circuit (RFIC) mounted on a lower surface of the antenna substrate. The antenna substrate includes a mount portion on which the RFIC is mounted and an overhang portion that extends outward from the mount portion. The feed element is disposed in the mount portion and the overhang portion. The antenna module further includes a heat dissipator disposed on the lower surface of the overhang portion.

Antenna module and communication device including the same

An antenna module is to be installed in a communication device. The antenna module includes a dielectric substrate that has a multilayer structure, a ground electrode that is disposed in the dielectric substrate, and a first radiating element that has a flat plate shape. The first radiating element has a first surface (a smooth surface) and a second surface (a rough surface) that has a higher degree of surface roughness than that of the smooth surface. The smooth surface of the first radiating element faces the ground electrode.

Antenna module, communication device in which antenna module is installed, and method of manufacturing antenna module

An antenna module includes a radiating element and a dielectric substrate. The dielectric substrate includes a flat portion on which an external terminal (T) to which a RFIC is connected is disposed, a flat portion in which the radiating element is disposed, a bent portion, a feeder, and a ground electrode (GND). The feeder extends through the flat portions and the bent portion to connect the external terminal (T) and the radiating element to each other. The ground electrode (GND) extends through the flat portions and the bent portion along the feeder. At the bent portion, a thickness of the feeder is greater than a thickness of the ground electrode (GND).

Antenna module

A multilayer substrate includes first and second insulating layers stacked in a stacking direction with the second insulating layer located at a first side of the first insulating layer in the stacking direction, a first coil pattern disposed on a first principal surface of the first insulating layer on the first side of the first insulating layer in the stacking direction, and a second coil pattern disposed on a first principal surface of the second insulating layer on the first side of the second insulating layer in the stacking direction. The first and second coil patterns have spiral shapes. When viewed from the layer stacking direction, at least a portion of a first area in which the first coil pattern is disposed and at least a portion of a second area in which the second coil pattern is disposed overlap each other.

Multilayer substrate and a manufacturing method of the multilayer substrate

A method for manufacturing a multilayer coil includes preparing a first substrate by forming a first conductor pattern on a first insulating base material layer, preparing a second substrate by forming a second conductor pattern on a second insulating base material layer, and joining a surface of the first substrate on which the first conductor pattern is formed and a surface of the second substrate on which the second conductor pattern is formed together with only a joining layer made of a thermoplastic resin interposed therebetween. Amounts of deformation of the first and second insulating base material layers are less than that of the joining layer at a fusion temperature. The first and second conductor patterns are each a coil pattern having a coil axis that extends in a lamination direction in which the first substrate and the second substrate are laminated together.

Multilayer coil and method for manufacturing the same

A multilayer substrate includes a stacked body of insulating base material layers and conductor patterns on the insulating base material layers. A thickness adjustment base material layer includes a frame portion, an opening portion inside the frame portion, and an island shaped portion inside the frame portion, and connection portions to connect the island shaped portion to the frame portion. The conductor patterns, in a stacking direction of the insulating base material layers, are wound around the island shaped portion. A line width of the connection portions is smaller than the width of the island shaped portion connected to the frame portion through the connection portions. An area overlapped with the conductor patterns is larger in the opening portion than in the frame portion and the island shaped portion.

Multilayer substrate and method of manufacturing the same

An actuator includes a coil substrate including a coil, a base substrate including a coil drive circuit, and a magnet to receive a magnetic field generated by the coil. A magnetic sensor is mounted on the coil substrate. The coil substrate on which the magnetic sensor is mounted is connected to the base substrate through a conductive bonding material.

Actuator and method of manufacturing actuator

A multilayer substrate includes a stacked body including a first main surface, and a conductor pattern (including a mounting electrode provided on the first main surface, and a first auxiliary pattern provided on the first main surface). The stacked body includes a plurality of insulating base material layers made of a resin as a main material and stacked on one another. The first auxiliary pattern is located adjacent to or in a vicinity of the mounting electrode. The mounting electrode, in a plan view of the first main surface (when viewed in the Z-axis direction), is interposed between a different conductor pattern (the mounting electrode) and the first auxiliary pattern.

Multilayer substrate, multilayer substrate mounting structure, method of manufacturing multilayer substrate, and method of manufacturing electronic device

A method of manufacturing a multilayer board includes forming conductor patterns on four or more insulating base material layers, forming a multilayer body by stacking the insulating base material layers in a state in which the conductor patterns face each other with prepreg layers therebetween, and heat-pressing the multilayer body. In a state before the step of heat-pressing, among the prepreg layers, a thickness of an outermost prepreg layer is larger than a thickness of a prepreg layer other than the outermost prepreg layer.

Multilayer board and method of manufacturing the same

A multilayer substrate includes a stacked body including first and second flexible insulating base material layers, and an actuator conductor pattern on at least the first insulating base material layer. The stacked body includes a first region including stacked first and second insulating base material layers, and a second region including stacked second insulating base material layers. The first region includes an actuator function portion in a portion thereof, the actuator function portion including the actuator conductor pattern. The thickness of the first insulating base material layer including the actuator conductor pattern is smaller than the thickness of one second insulating base material layer.

Multilayer substrate

A multilayer substrate includes a lamination body including a first resin substrate, a second resin substrate, and a bonding layer that are hot-pressed. A first conductor pattern including a surface defined by a plated film is disposed on a first surface of the first resin substrate. A second conductor pattern including a surface defined by a plated film is disposed on a second surface of the first resin substrate. A third conductor pattern including a surface defined by a plated film is disposed on a third surface of the second resin substrate. A fourth conductor pattern including a surface defined by a plated film is disposed on a fourth surface of the second resin substrate. The first conductor pattern is located closer to one outermost layer than the second conductor pattern is. The second conductor pattern is thinner than the first conductor pattern.

Method for manufacturing multilayer substrate

An electronic component includes an insulating base material including insulating base material layers, a first main surface that is a mounting surface, a coil, mounting electrodes provided on the first main surface, and a projection. The coil includes coil conductors provided on the insulating base material layers and a winding axis in a laminating direction of the insulating base material layers. The projection is provided in an electrode non-forming portion of the first main surface, the electrode non-forming portion including no mounting electrodes therein, and provided along the coil conductors in planar view of the first main surface.

Electronic component, diaphragm, and electronic device

A multilayer substrate includes an element assembly including stacked insulating layers and including at least a first insulating layer with a first principal surface and a second principal surface and a second insulating layer with a third principal surface and a fourth principal surface, a first conductor layer, and a second conductor layer. The second principal surface and the third principal surface are in contact with each other, and no planar or linear conductors are located on the second principal surface and the third principal surface. The first conductor layer is located on the first principal surface, and the second conductor layer is located on the fourth principal surface.

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Nagaokakyo, Japan

Naoki Gouchi