Tokyo Electron Limited

Naoki Fujiwara

Mitsunori Ohata

Takehisa Saito

Takahiro Takeuchi

Yoshihiro Umezawa

Toshiki Nakajima

Daisuke Kurashina

There is provided an antenna for inductively coupled plasma excitation. The antenna comprises a plurality of coil assemblies and a conductive plate connected to the plurality of coil assemblies, the conductive plate having a central opening and at least one plate terminal.

Antenna for inductively coupled plasma excitation, antenna unit for inductively coupled plasma excitation, and plasma processing apparatus

A plasma processing apparatus includes a chamber; a dielectric window, a first antenna for generating plasma within the chamber, and a first power supply for supplying RF power to the first antenna. Power is fed to a first line constituting the first antenna from the first power supply and the vicinity of the midpoint is grounded so that the first antenna resonates at a wavelength that is ½ of a wavelength of the RF power. The first antenna includes a first portion close to a first end with reference to a first position separated from the first end by a first distance toward a central portion of the first line, a second portion close to a second end with reference to a second position separated from the second end by a second distance toward the central portion, and a first intermediate portion between the first and second portions.

Plasma processing apparatus

A plasma processing apparatus includes: a plasma processing apparatus includes: a plasma processing chamber; a substrate support; a source RF generator coupled to the plasma processing chamber, and configured to generate a source RF pulsed signal; a first bias RF generator configured to generate a first bias RF pulsed signal; a second bias RF generator configured to generate a second bias RF pulsed signal; a first separation circuit connected between the first bias RF generator and the substrate support, and configured to suppress a coupling of the second bias RF pulsed signal from the second bias RF generator to the first bias RF generator, and a second separation circuit connected between the second bias RF generator and the substrate support, and configured to suppress a coupling of the first bias RF pulsed signal from the first bias RF generator to the second bias RF generator.

Plasma processing apparatus and plasma processing method

A plasma processing apparatus includes: a source RF generator that generates a source RF pulsed signal of at least three power levels; first and second bias RF generators that generate first and second bias RF pulsed signals of at least two power levels; a synchronization signal generator that generates a synchronization signal; a first matching circuit connected to the source RF generator and an antenna, thereby allowing the source RF pulsed signal to be supplied from the source RF generator to the antenna through the first matching circuit; and a second matching circuit connected to the first and second bias RF generators and a substrate support, thereby allowing the first and second bias RF pulse signals to be supplied from the first and second bias RF generators to the substrate support through the second matching circuit.

Growing community of inventors

Miyagi, Japan

Naoki Fujiwara