Fuji Seiki Machine Works, Ltd.

Other

Kabushiki-kaisha Fuji Seiki Seizo Sho (fuji Seiki Machine Works, Co.

Naokatsu Kojima

Shinichi Makino

Chiaki Shigematsu

Hisashi Kitagawa

Shuji Fukano

Akira Haishima

Hiromichi Fukumoto

An ice blasting apparatus comprises: an ice making device operating a cutting blade to shave off ice freezing on an inner wall of the freezing casing and continuously discharges the shaved ice as flake-shaped ice pellets; an ice mixing tank mixing the ice pellets and water and maintaining the resulting ice slurry at a predetermined concentration with a concentration sensor; and a blast gun blasting the ice slurry. A trimming method is performed on a film insert molding with a film material adhering to a face of a resin molding and extending beyond a periphery edge of the resin molding. A blast gun facing the face with the film adhering to it blasts ice slurry of a required concentration toward the vicinity of the periphery edge of the resin molding to remove the unnecessary portion of the film material extending beyond the periphery edge of the resin molding.

Ice blasting apparatus and trimming method for film insert molding

Ice grains of uniform grain size are produced through the change of state of supercooled water and the ice grains are mixed into cold water for obtaining an ice slurry of proper concentration. The ice slurry is injected from an injection means to the surface of a workpiece. As the ice grains are fine and uniform and they are injected with water in the state of ice slurry of stable concentration, a surface processing of a soft workpiece susceptible to damage can be performed without causing damage, and the cleaning of the processed surface is performed concurrently with the surface processing, eliminating the necessity of after cleaning. The apparatus is compact and the initial cost is low. The energy needed for preparing the ice slurry is small.

Method and apparatus for surface processing using ice slurry

A solder coating apparatus for coating lead sections of a lead frame, including a liquid solder bath and a coating block having a first slit-like passage therethrough for permitting a lead frame to pass through the block and a second passage of enlarged cross section communicating with and extending along the first passage for permitting the lead frame package to pass through the block. A pair of liquid solder supply slits are formed in the block and communicates with the first passage along the length thereof and on opposite sides of the second passage. A pump at least partially immersed in the liquid solder bath provides for positive supply of liquid solder to and through the slits into the first passage to coat the lead sections. A conduit connects between the delivery side of the pump and the liquid solder supply slits.

Solder coating apparatus

A lead frame having thereon a plurality of semiconductor devices is prepared by immersing it in a flux solution to activate the lead frame surface and to remove oxide film. The lead frame is then transferred to a coating block unit, and the lead frame is moved along a lateral passage which extend through the coating block unit. During movement through the passage, the lead sections of the lead frame are coated on both upper and lower surfaces thereof with liquid solder which ascends by capillary action along a slit which projects upwardly from a liquid solder bath and communicates with the passage. The solder in the slit, where it communicates with the passage, is continually replenish by capillary action from the bath as the solder coats the lead sections as the lead frame moves through the passage.

Continuous solder coating apparatus and its method

A pair of solder coating rolls are disposed horizontally adjacent one another for rotation about parallel horizontal axes, and are spaced apart to define a narrow vertically-oriented nip therebetween for accommodating a lead frame therein. Lower parts of the rolls contact a solder bath, and counter rotation of the rolls carries the solder upwardly on the periphery of the rolls to create a small pool of solder at the upper end of the nip. The lead frame is driven vertically upwardly through the nip, which nip has a minimal dimension greater than the lead frame thickness. The lead frame is driven vertically upwardly at a linear speed which is different from, and preferably slower than, the peripheral speed fo the solder coating rolls. This enables preheating of the surface of the lead frame due to its longer exposure to and contact with the hot solder which coats the periphery of the rolls, thereby improving the wetability of the lead frame surface. At the same time, this upward movement of the lead frame through the nip and through the pool of liquid solder permits a solder coating of high quality and uniformity to be applied to the lead frame.

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Sunto, Japan

Naokatsu Kojima