Samsung Electro-mechanics Co., Ltd.

Samsung Led Co., Ltd.

The University of Tokushima

Naoi Yoshiki

Rak Jun Choi

Sakai Shiro

Soo Min Lee

Masayoshi Koike

Disclosed herein is a high-quality group III-nitride semiconductor thin film and group III-nitride semiconductor light emitting device using the same. To obtain the group III-nitride semiconductor thin film, an AlInN buffer layer is formed on a (1-102)-plane (so called r-plane) sapphire substrate by use of a MOCVD apparatus under atmospheric pressure while controlling a temperature of the substrate within a range from 850 to 950 degrees Celsius, and then, GaN-based compound, such as GaN, AlGaN or the like, is epitaxially grown on the buffer layer at a high temperature. The group III-nitride semiconductor light emitting device is fabricated by using the group III-nitride semiconductor thin film as a base layer.

Group III-nitride semiconductor thin film, method for fabricating the same, and group III-nitride semiconductor light emitting device

The invention provides a method of growing a non-polar a-plane gallium nitride. In the method, first, an r-plane substrate is prepared. Then, a low-temperature nitride-based nucleation layer is deposited on the substrate. Finally, the non-polar a-plane gallium nitride is grown on the nucleation layer. In growing the non-polar a-plane gallium nitride, a gallium source is supplied at a flow rate of about 190 to 390 &#x3bc;mol/min and the flow rate of a nitrogen source is set to produce a V/III ratio of about 770 to 2310.

Method of growing non-polar a-plane gallium nitride

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Tokushima, Japan

Naoi Yoshiki