Seiko Epson Corporation

Naohisa Obata

Kunihito Yamanaka

Masayuki Kikushima

Masako Tanaka

Takuya Owaki

Yukihiro Unno

Shinya Aoki

Shiro Murakami

Yusuke Yamamoto

An oscillator includes a resonation element, a first package that houses the resonation element and airtightly sealed, a circuit element that is positioned outside the first package and electrically connected to the resonation element, and a second package that houses the first package and the circuit element and sealed in a depressurized state. In addition, the first package includes a first base having a first recessed portion, and a first lid joined to the first base so as to close an opening of the first recessed portion, and the second package includes a second base having a second recessed portion and a second lid joined to the second base so as to close an opening of the second recessed portion. The circuit element is attached to the first base, and the first base is attached to the second base.

Oscillator, electronic apparatus, and vehicle

An oscillator includes a resonation element, a temperature sensitive element, a first package that houses the resonation element and the temperature sensitive element and is airtightly sealed, and a second package that houses the first package and is airtightly sealed. The first package includes a first base having a first recessed portion that is provided on one main surface side and a first lid that is joined to the first base so as to close an opening of the first recessed portion. The second package includes a second base having a second recessed portion that is provided on one main surface side and a second lid that is joined to the second base so as to close an opening of the second recessed portion.

An oscillator includes a first package that is airtightly sealed, a second package that is housed in the first package and airtightly sealed, a resonation element that is housed in the second package, and a circuit element that is housed in the first package in a state of being positioned outside the second package and electrically connected to the resonation element and has an oscillation circuit and a temperature compensation circuit. In addition, the first package includes a base having two main surfaces and a recessed portion provided on one of the main surfaces, and a lid joined to the base so as to close the opening of the recessed portion. The circuit element is attached to the base, and the second package is attached to the circuit element.

An oscillator includes a vibration element, an oscillation circuit configured to oscillate the vibration element and output an oscillation signal, a temperature sensor, a temperature compensation circuit configured to compensate for a frequency temperature characteristic of the vibration element based on an output signal of the temperature sensor. The vibration element is within a first case having a first atmosphere, and the oscillation circuit, the temperature sensor, and the first case are within a second case having a second atmosphere, whereby the first atmosphere has a higher thermal conductivity than the second atmosphere.

A temperature-compensated oscillator includes a resonator element, an oscillating circuit, and a temperature compensation circuit, and in a case of varying temperature in a temperature range of &#xb1;5&#xb0; C. centered on a reference temperature in intervals of 6 minutes, and assuming observation period as &#x3c4;, a wander performance fulfills a condition that an MTIE value is equal to or shorter than 6 ns in a range of 0 s&#x3c;&#x3c4;&#x2264;0.1 s, the MTIE value is equal to or shorter than 27 ns in a range of 0.1 s&#x3c;&#x3c4;&#x2264;1 s, the MTIE value is equal to or shorter than 250 ns in a range of 1 s&#x3c;&#x3c4;&#x2264;10 s, the MTIE value is equal to or shorter than 100 ns in a range of 10 s&#x3c;&#x3c4;&#x2264;1700 s, and the MTIE value is equal to or shorter than 6332 ns in a range of 100 s&#x3c;&#x3c4;&#x2264;1000 s.

A temperature-compensated oscillator includes a resonator element, an oscillating circuit, and a temperature compensation circuit, and a frequency deviation with respect to a frequency at a time point when power supply starts is within a range of &#xb1;8 ppb at a time point when 10 seconds elapse from when the power supply starts, within a range of &#xb1;10 ppb at a time point when 20 seconds elapse from when the power supply starts, and within a range of &#xb1;10 ppb at a time point when 30 seconds elapse from when the power supply starts.

In a crystal resonator, a resonator element is installed in a package via a first bonding member and a second bonding member, and when viewed from above, a distance between a first bonding center and a second bonding center is set to be L, and a length of a perpendicular line drawn to a virtual line which connects the first bonding center and the second bonding center from the resonation area center is set to be L, a relationship expressed by 0&#x3c;L/L&#x2264;0.97 is satisfied.

Resonation device, oscillator, electronic apparatus, and moving object

A resonator device includes a substrate, a resonator element including a base member having first and second surface, and a pair of excitation electrodes, and first and second bonding member. Defining center of the first and second bonding member as a first and second bonding center, a center of a resonating region as a resonating region center, and defining a distance between the first bonding center and the second bonding center as L1, a length of a perpendicular drawn from the resonating region center to an imaginary line connecting the first bonding center and the second bonding center to each other as L2, a linear expansion coefficient of the first metal layer, the second metal layer, and the base member as &#x3b1;1, &#x3b1;2, &#x3b1;3 respectively, and a length of the resonator element as L3, 0&#x3c;L1/L2&#x2264;0.97, |(&#x3b1;2&#x2212;&#x3b1;1)/&#x3b1;1|&#x2264;0.35, |(&#x3b1;3&#x2212;&#x3b1;1)/&#x3b1;1|&#x2264;0.35, and L3&#x2264;1.5 mm are satisfied.

Resonator device, oscillator, electronic apparatus, and vehicle

An oscillator includes a resonator element; an oscillation circuit which outputs an oscillation signal by oscillating the resonator element; and a temperature compensation circuit as a frequency control circuit which controls an oscillation frequency of the oscillation signal, wherein, if a resonance frequency of the resonator element is referred to as Fr (MHz) and an equivalent series capacitance is referred to as C1 (fF), a relationship of C1&#x2265;0.00279&#xd7;Fr&#x2212;0.05684&#xd7;Fr+2.69481 is satisfied.

Oscillator, electronic apparatus, and moving object

In a crystal resonator, a resonator element is installed in a package via a first bonding member and a second bonding member, and when viewed from above, a distance between a first bonding center and a second bonding center is set to be L1, and a length of a perpendicular line drawn to a virtual line which connects the first bonding center and the second bonding center from the resonation area center is set to be L2, a relationship expressed by 0&#x3c;L1/L2&#x2266;0.97 is satisfied.

A vibration element includes a substrate having first and second principal surfaces, a first excitation electrode on the first principal surface, a second excitation electrode on the second principal surface, and a first extraction electrode on the first principal surface, and connected to the first excitation electrode. The first extraction electrode includes a first electrode section, and a second electrode section extending from the first electrode section in a first direction and connected to the first excitation electrode. The second electrode section is narrower in a second direction than the first electrode section. When an area of the first excitation electrode is S1, and an area of an overlapping part where the second electrode section overlaps the second excitation electrode is S2, (S2/S1)&#x2266;0.1.

Vibration element, vibrator, oscillator, electronic apparatus, and moving object

In a crystal resonator, a resonator element is installed in a package via a first bonding member and a second bonding member, and when viewed from above, a distance between a first bonding center and a second bonding center is set to be L, and a length of a perpendicular line drawn to a virtual line which connects the first bonding center and the second bonding center from the resonation area center is set to be L, a relationship expressed by 0&#x3c;L/L&#x2266;0.97 is satisfied.

A resonator element has a piezoelectric substrate including a vibration section and a thick section having a thickness which is thicker than that of the vibration section, and a pair of excitation electrodes provided on a surface and a back surface of the vibration section. In addition, the thick section has a second thick section provided along a second outer edge of the vibration section. The second thick section has an outer edge section intersecting with both axes of an X axis and a Z' axis in an end portion opposite to the fixing section in a plan view of the resonator element.

Resonator element, resonator, oscillator, electronic apparatus and moving object

A vibration element includes a piezoelectric substrate including a vibrating section and a thick section having a thickness larger than that of the vibrating section. The thick section includes a first thick section provided along a first outer edge of the vibrating section, a second thick section provided along a second outer edge thereof, and a third thick section provided along a third outer edge thereof. When a maximum size of the second thick section in the vibration direction is Lmax and a minimum size thereof is Lmin, an average size expressed by (Lmax+Lmin)/2 is 100 &#x3bc;m or smaller.

A SAW device includes a SAW chip formed of a piezoelectric substrate and an IDT formed thereon, a base substrate that supports the SAW chip, and a fixing member that fixes the SAW chip to the base substrate. The SAW chip that forms a cantilever is supported by the base substrate via the fixing member in a position where the IDT does not overlap with the fixing member in a plan view of the SAW chip. The length W of the SAW chip in a y-axis direction and the length D of the fixing member in the y-axis direction satisfy 1&#x3c;D/W&#x2266;1.6. The fixing member bonds the lower surface and side surfaces of the fixed end of the SAW chip to the base substrate.

Growing community of inventors

Minowa, Japan

Naohisa Obata