Fujitsu Corporation

Naohisa Matsushita

Toshikazu Furui

Masayuki Imakado

Shigeyuki Maruyama

Naoyuki Watanabe

Motoichi Watanuki

Keisuke Fukuda

Takumi Kumatabara

Hiroshi Nozawa

Susumu Iida

Kyohei Tamaki

A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.

Method of cutting laminate, apparatus for manufacturing laminate, method of manufacturing laminate, and laminate

A scanning mechanism that scans a scanning object with a light beam has light-collecting means for collecting the light beam that is emitted by a light source; driving means for driving the light-collecting means in a direction orthogonal to an optical axis of the light-collecting means; first reflecting means provided near a first side of the scanning object, for reflecting the light beam collected by the light-collecting means to allow the light beam to be incident on the scanning object; and second reflecting means provided near a second side of the scanning object that is opposite to the first side of the scanning object, for reflecting the light beam collected by the light-collecting means to allow the light beam to be incident on the scanning object.

Scanning mechanism, method of machining workpiece, and machine tool

A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate to cut the laminate into elements.

Method of cutting laminate with laser and laminate

A method of fabricating an element having a microstructure such as an MEMS device uses a material whose state changes with a temperature change. A sheet-like member having a microstructure on its surface is fixed to a vacuum chuck by an adhesive sheet and the material whose state changes with a temperature change is applied to the surface of the sheet-like member the material is then cooled to solidify it on the surface of the sheet-like member and the sheet-like member is cutinto a plurality of elements, while the material is in the solidified state, and the separated elements are then removed from the adhesive sheet.

Method of fabricating element having microstructure

An imaging device including a base on which an imaging element is provided, a cylindrically shaped plastic lens member holding a condensing lens at the inside, and a plastic barrel member in which the lens member can move in the axial direction and provided above the imaging element, wherein the barrel member and the lens member are affixed by laser welding, a method of production of the same, and an imaging device holding mechanism used for that production.

Imaging device, method of production of same, and holding mechanism of same

The invention relates to a laser processing device that can change the diameter of a beam spot on an object to be processed, without using a mechanism for changing a distance between a condensing lens and the object. A beam emitted from a laser beam source is condensed by the condensing lens, and is made incident to an optical fiber. The beam emitted from the optical fiber is condensed by a condensing optical system onto an object to be processed. The object is welded using the condensed beam. The laser processing device comprises an adjusting unit that can change the angle of divergence of the beam on the emission surface of the optical fiber. The adjusting unit changes the angle of divergence of the beam, thereby to change the diameter of the beam spot formed on the surface of the object.

Laser processing device

Contact electrodes having a predetermined shape are formed by irradiating a laser beam onto the contact electrodes that are formed of a conductive material. The laser beam can be irradiated, after joining an end of each contact electrode opposite to a contact end to a contact board, so as to deform the contact electrode so that the contact end is located at a predetermined position. The laser beam may be irradiated while heating or cooling a portion of the contact electrode opposite to a portion onto which the laser beam is irradiated.

Contactor having contact electrodes formed by laser processing

A laser beam welding apparatus includes a component holding unit which holds components that are to be welded. A laser irradiation unit performs welding of the components by irradiating a welding laser beam to a welding zone of the components. A stress detection unit detects stress data that indicate a stress condition of the components held by the component holding unit. A stress correction unit controls irradiation of a correcting laser beam to the welding zone, based on a result of comparison between reference stress data, detected when positions of the components are aligned in proper position before the welding, and post-welding stress data, detected after the welding is performed by the laser irradiation unit, so that the post-welding stress data, obtained after the irradiation of the correcting laser beam, matches with the reference stress data.

Apparatus and method for laser beam welding

A work piece can be bent in opposite directions by irradiating a laser beam onto one side of the work piece. A tension anneal is applied to a metal plate. The metal plate is bent by irradiating a defocused laser beam onto a front surface of the tension-annealed metal plate so that the metal plate is bent in a state in which the front surface of the metal plate is convex at a position where the laser beam is scanned.

Laser bending method and apparatus for bending a work piece in normal and reverse directions

A method for correcting an outer surface of a magnetic slider mainly made of ceramic to a desired surface shape, wherein a laser beam is applied to an outer face of a work piece ( ) to partially melt a ceramic base, the melted part ( ) is resolidfied, and the surface shape of the slider is exactly corrected to the desired shape by using shrinkage stress during the resolidification.

Method for correcting surface shape of magnetic head slider and magnetic head slider

Three-dimensional positions on an ABS of a slider of a magnetic head are measured, and an interpolated surface is generated by interpolating all the measured points. A processing center position of the magnetic head is calculated based on the interpolated surface, and a plurality of lines parallel with the processing center position are processed. It is also possible to process, by irradiating energy corresponding to a difference between a final target correction volume and a measured value, without forming an interpolated surface.

ABS shape correction method for slider of magnetic head, and ABS shape correction apparatus for slider of magnetic head

The grinding machine and the method of grinding are capable of grinding a bar member for a magnetic head with higher grinding accuracy. In the grinding machine, a holding frame holds a bar member and heads a first face of the bar member, which is to be ground, downward. A grinding plate grinds the first face of the bar member. An actuator presses a second face of the bar member held by the holding frame so as to press the first face onto the grinding plate. A resistance monitor monitors a resistance value of a sensing part of an ELG element section of the bar member so as to adjust a strip height of a magnetic head section of the bar member.

Growing community of inventors

Kawasaki, Japan

Naohisa Matsushita