Japan Display Inc.

Naohisa Ando

Takashi Saeki

Toshihiro Sato

Hiroshi Kawanago

Kouhei Takahashi

A display device includes: an insulating substrate having flexibility and including a bent portion that is bent at 90 degrees or more outside a display area provided with an image display function; and a spacer disposed inside the bent portion and including a curved area around which the bent portion is wrapped and a plane area facing the insulating substrate, wherein the insulating substrate includes a flat portion adjacent to the bent portion and provided so as to face the plane area.

Display device

A display device includes a substrate including a peripheral region folded back to face a rear surface of the substrate, and a counter region facing the peripheral region; and a filling member held between the peripheral region and the counter region. The substrate is folded such that the display device includes a first overlapping portion where a part of the peripheral region is bonded with the counter region with an adhesive material being provided therebetween; a second overlapping portion where a part of the peripheral region is in direct contact with the filling member; and a third overlapping portion where a part of the peripheral region is bonded with the filling member with an adhesive material being provided therebetween.

Display device with overlapping substrate

A circuit unit is provided in which it is possible to connect circuit board to a terminal using a simple operation without removing a passivation film from above the terminal. A metal electrode which conducts with a circuit element is formed above a substrate. Multiple column shaped insulation films are each formed at a uniform pitch in two intersecting directions above the surface of the metal electrode. A metal electrode is formed above the metal electrode including the insulation film. A passivation film is formed on a surface of the metal electrode. Conductive beads are stuck between pairs of projection structured bodies formed on a surface of the passivation film, the passivation film on a side surface of the projection structure is scraped whereby the conductive beads conduct simultaneously with the metal electrode and an electrode formed on the circuit board.

Growing community of inventors

Tokyo, Japan

Naohisa Ando