Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Pelnox, Ltd.

Naohiro Takashima

Shogo Nakayama

Masato Hashimoto

Seiji Tsuda

Mituru Harada

Eiji Iwamura

Shoji Hoshitoku

Hirokatsu Itou

Takasi Oobayasi

Ken Kasashima

Takumi Shirai

Yuichi Ishii

Shoji Mori

One chip-shaped electronic componentof the present invention has a substrate, and a termination electrode layerformed on an end face of the substrate. The termination electrode layeris made of a mixed material that contains an electrically-conductive substance (a') (containing carbon (a) as one type of the electrically-conductive substance (a&#x2032;)), whisker-like particles (b) covered with the electrically-conductive substance (a&#x2032;), flake-like particles (c) having electroconductivity, and a tetrafunctional hydroxyphenyl type epoxy resin (d) having a molecular weight of 450 or more and less than 800. In addition, a mass ratio of the flake-like particles (c) is 3/7 or more and 9 or less when the whisker-like particles (b) is assumed to be 1.

Chip-shaped electronic component

A chip-shaped electronic component includes a substrate and an end face electrode layer provided on an end face of the substrate, in which the end face electrode layer contains a mixed material. The mixed material includes as a conductive particle, a carbon powder, a whisker-like inorganic filler coated with a conductive film, and a flake-like conductive powder. Additionally, an epoxy resin has a weight-average molecular weight between 1,000 and 80,000.

A resistor has a low resistance which precisely falls within a prescribed range regardless of the variation in the contact position of the probes. The resistor comprises a substrate, a pair of upper-surface electrode layers having respectively a notched section, provided on both sides of upper surface of the substrate, a resistor layer provided so that it is connected electrically to said upper-surface electrode layers, a protective layer formed to cover at least the resistor layer and side-face electrode layers provided respectively on side faces of said substrate so that the side-face electrode layers are overlapping on part of upper surface of said upper-surface electrode layers for electrical connection. The above construction reduces the dispersion in measuring the resistance even if contact positions of the probes for the resistance measurement vary.

Resistor and method of manufacturing the same

The present invention is to offer a resistor which can be mounted exactly on the terminals disposed on a circuit board regardless the sides of the resistor, and to offer its manufacturing method by forming the surface of the side-electrode layer at a height higher than the surface of protection layer, or by forming the surface of the second surface electrode layer at a height higher than the surface of protection layer. By these, the resistor can be mounted exactly on the terminal of circuit board at a high yield. Furthermore, since the first surface electrode layer and the second upper electrode layer are electrically connected together through a window provided on the protection layer, a higher connection reliability can be obtained.

Resistor and its manufacturing method

Growing community of inventors

Fukui, Japan

Naohiro Takashima