Matsushita Electric Industrial Co., Ltd.

Naohiro Nishioka

Koji Tanabe

Yosuke Chikahisa

Kouji Tanabe

Kouichi Santo

Shinji Okuma

Akito Kawasumi

Heiji Ikoma

Futoshi Matsui

Kenji Otomo

Kenji Ootomo

Yoshihito Okazaki

An EL element comprising a light transmitting substrate, a light transmitting electrode formed on the substrate, a light emitting layer containing a positive ion absorber, a dielectric layer and a back electrode. Further, an EL element of the present invention contains a positive ion absorber in the dielectric layer. An EL element in accordance with an embodiment comprises a light emitting layer formed of a resin, a phosphor and a positive ion absorber, the positive ion absorber being 1-400 parts by weight to a 100 parts of the resin in the light emitting layer. An EL element in another embodiment comprises a dielectric layer formed of a resin, a high dielectric constant inorganic filler and a positive ion absorber, the positive ion absorber being 0.5-50 to a 100 parts of a total amounts of the resin and the filler.

EL element

An electroluminescent lamp (EL lamp) is formed by stacking a light-transmitting electrode-layer, an adhesive synthetic resin layer, a luminescent layer formed of the synthetic resin layer with phosphor particles fixed uniformly, a dielectric layer and a back electrode-layer on a transparent substrate sequentially. By this structure, a uniform EL lamp having improved brightness can be produced. A method for manufacturing the EL lamp includes following steps for fixing the phosphor particles in the synthetic resin layer uniformly. (1) sinking the phosphor particles in the synthetic resin layer by heating and pressing, after spraying the phosphor particles. (2) blowing the phosphor particles to the synthetic resin layer with heated air. As a result, the phosphor particles are uniformly fixed in the synthetic resin layer having uniform thickness.

Electroluminescent lamp and method for manufacturing the same

Electroluminescent lamp having luminescent layer with phosphor particles fixed uniformly

An EL element comprising: a light transmitting substrate; a light transmitting electrode layer formed on the substrate; a light emitting layer containing a positive ion exchanger; a dielectric layer; a back electrode layer; and a dielectric insulation layer disposed between the light transmitting electrode layer and the light emitting layer. The dielectric insulation layer is formed of a synthetic resin that is insoluble with a synthetic resin binder forming the light emitting layer. The present invention provides an EL element having an improved illuminating performance, where an occurrence of a dark spot is suppressed, in addition to a suppression of an occurrence of a black spot.

EL element with dielectric insulation layer

A dispersion-type electroluminescence element composed of a plurality of light-transmitting electrode layers A, B and a plurality of luminescence layers A, B of dielectric resin having a high permittivity dispersed with fluorescent powder stacked one layer after the other over the whole region, or in a certain specific region, of one surface of a light-transmitting insulation film ; and a back electrode layer provided on the last layer of the luminescence layers formed by a printing process. The electroluminescence element is capable of producing a multiple number of luminescence colors, yet the cost is low. In other example of carrying out the present invention, a luminescence layer formed of a luminous body of one single luminescence color provided over a whole region of a surface is sandwiched by a back electrode layer and a light-transmitting electrode layer composed of two groups of fine line comb-teeth layer coupled one tooth after the one of the other electrode layer, and a stripe-shaped color conversion layer is provided in a location corresponding to one of the two groups of comb-teeth fine lines. When an AC voltage is applied on the back electrode layer and each of the two respective light-transmitting electrode layers independently, a multiple number of luminescence colors are produced in a homogeneous plane luminescence, without accompanying the stripes outstanding to the eyes.

Dispersion-type electroluminescence element

A set of a transparent electrode layer and a luminescent layer in which phosphor particles are dispersed are formed on a transparent resin film, and this set is formed layer by layer to create more than one luminescent layer. One or more luminescent layers are divided into multiple luminescent color regions. Or, the transparent electrode layer is electrically separated into two or more regions. This configuration enables the display of multiple patterns in multiple luminescent colors using one dispersed EL lamp. Accordingly, the multicolor EL lamp, which is aesthetically appealing as well as good visibility, can be provided for a display unit of a range of electronic equipment and backlight for LCDs.

Dispersed multicolor electroluminescent lamp and electroluminescent lamp unit employing thereof

A flexible printed circuit board is constituted with a first insulation film covering a first insulating resist layer, a second insulation film covering a second insulating resist layer and a printed circuit formed between the first insulating resist layer and the second insulating resist layer, and a terminal of an electronic component is disposed on the printed circuit, and the second insulation film is pressed and heated.

Method for mounting electronic component on a flexible printed circuit

A method for electrically connecting an upper wiring with a lower wiring consists of the steps of arranging the upper wiring mixed with thermo-softening material on an upper insulating sheet, arranging the lower wiring mixed with thermo-softening material on a lower insulating sheet, putting the upper insulating sheet on the lower insulating sheet to bring the upper wiring into contact with the lower wiring, and providing ultrasonic vibration to the upper and lower wirings and the upper insulating sheet while pushing the upper insulating sheet toward the lower insulating sheet. In these steps, the upper and lower wirings and the upper insulating sheet are heated and melted because friction heat is generated by the ultrasonic vibration. Thereafter, the upper insulating sheet is pushed into the upper and lower wirings while pushing these wirings aside and is boded with the lower insulating sheet. Also, the upper wiring is bonded with the lower wiring so that these wirings are electrically connected.

Method for connecting a wiring arranged on a sheet with another wiring

Anisotropic conductive material is employed instead of solder for connecting between the terminal of a component and a printed circuit board. In addition to the printed circuit board, a printed circuit sheet is provided and the terminal of the component is sandwiched between both anisotropic materials on the printed circuit board and beneath the printed circuit sheet. From both outside surfaces of the printed circuit board and the sheet, heat and pressure are simultaneously applied to the terminal part (i.e. thermocompression bonding).

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Hirakata, Japan

Naohiro Nishioka