Toyohashi University of Technology

Honda Electronics Co., Ltd.

Shiseido Company, Limited

Hamamatsu-Photonics K.k.

Naohiro Hozumi

Kazuto Kobayashi

Yuki Ogura

Sachiko Yoshida

Yusuke Hara

Shigeru Eura

Toru Matsumoto

Takuto Matsui

An ultrasonic testing device having a packaged semiconductor device as a testing target, the device including: an ultrasonic oscillator disposed to face the semiconductor device; a pulse generator generating a driving signal that is used in the generation of an ultrasonic wave to be output from the ultrasonic oscillator; and an analysis unit analyzing an output signal that is output from the semiconductor device in accordance with the irradiation of the ultrasonic wave from the ultrasonic oscillator, in which the pulse generator sets an optimal frequency of the driving signal such that the absorption of the ultrasonic wave in the semiconductor device is maximized.

Ultrasonic testing device and ultrasonic testing method

This invention provides a signal-processing method that makes it possible to acquire, relatively easily and surely, a highly reliable normalized impulse-response signal without relying on the signal-correction processing after normalization. The signal-processing method of this invention includes a low-frequency extraction step, a high-frequency extraction step and a synthesizing step. In the low-frequency extraction step, only the low-frequency component is extracted from the spectrum of the first normalized signal NSobtained by normalizing the target signal Sin the time domain. In the high-frequency extraction step, only the high-frequency component is extracted from the spectrum of the second normalized signal NSobtained by normalizing the target signal Sin the frequency domain using the reference signal S. In the synthesizing step, the low-frequency component, derived from the first normalized signal NS, and the high-frequency component, derived from the second normalized signal NS, are synthesized to obtain a normalized impulse-response signal NS.

Ultrasonic image construction method, apparatus and signal-processing method

A surface property measurement technology by which a surface property of a substance can be evaluated with high accuracy, is provided. A surface property measurement method includes radiating an ultrasonic wave to a measurement target and acquiring a reflected signal from the measurement target; calculating, by a measurement apparatus, a maximum value of a cross-correlation function between the reflected signal from the measurement target and a reference reflected signal from a reference substance acquired in advance; calculating a reflection component at an interface, by using the maximum value of the cross-correlation function; and outputting, as a measurement value, one of an acoustic impedance of the measurement target or an acoustic impedance of the reference substance, according to a result of comparing the reflection component with the reference reflected signal.

Surface property measurement method, surface property measurement apparatus, and recording medium

An ultrasonic measurement method includes irradiating an object to be measured with an ultrasonic wave, acquiring a reflection wave from the object, calculating at a processor an acoustic impedance in a depth direction of the object from the reflection wave, and estimating and outputting a thickness of the object based upon an inflection point determined by second-order differentiation of the acoustic impedance.

Ultrasonic measurement method, ultrasonic measurement apparatus, and program storage device readable by machine

An ultrasonic-image-construction apparatus can construct an ultrasonic-tomographic image of a thin, layer-structured target object to be measured relatively easily and highly accurately in a manner in which such layered structure is easily understood. An ultrasonic transducer of an ultrasonic-image-constructing apparatus transmits ultrasonic waves to the target object. A reference substance makes contact with a base substrate, with such ultrasonic waves being incident on the target object via the base substrate, then receives an impulse response of an ultrasonic waveform. A computing means performs calculation to estimate acoustic-physical-property distribution in consideration of the multiple-reflections influence based on normalized-impulse information obtained from impulse-response information of such ultrasonic waveform incident on the reference substance and from impulse-response information of such ultrasonic waveform incident on the target object. The image-construction means constructs acoustic-physical-property-image data based on acoustic-physical-property distribution in the depth direction obtained by computing means.

Growing community of inventors

Aichi, Japan

Naohiro Hozumi