Ibiden Company Limited

Naohiro Hirose

Takashi Kariya

Kouta Noda

Honjin En

Yoji Mori

Yoshiyuki Iwata

Masanori Kawade

Hajime Yazu

Hitoshi Ito

Motoo Asai

Yasuji Hiramatsu

Kiyotaka Tsukada

Honchin En

Naoto Ishida

Tohru Nakai

Hiroshi Segawa

Kouji Asano

Takeo Oki

Atsushi Shouda

A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the first insulating layer. The conductor layer includes conductor portions, and the conductor portions have notched portions, respectively, facing each other across the wiring pattern.

Printed wiring board with crossing wiring pattern

A package substrate including an outermost interlayer resin insulating layer, a pad structure formed on the outermost interlayer resin insulating layer, a conductive connecting pin for establishing an electrical connection with another substrate, the conductive connecting pin being secured to the pad structure via a solder, and via holes formed through the outermost interlayer resin insulating layer and for electrically connecting the pad structure to one or more conductive circuits formed below the outermost interlayer resin insulating layer, the via holes being positioned directly below the pad structure.

Conductive pin attached to package substrate

An opening is formed in resinby a laser beam so that a via hole is formed. At this time, copper foil, the thickness of which is reduced (to 3 &#x3bc;m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an openingcan be formed in the resinif the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resinwhich forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Multilayered printed circuit board and manufacturing method thereof

A package substrateincorporating a substrate provided with a conductor layer, a conductive connecting pinarranged to establish the electrical connection with a motherboard and secured to the surface of the substrate, wherein a padfor securing the conductive connecting pin is provided for the package substrate. The padis covered with an organic resin insulating layerhaving an openingthrough which the padis partially exposed to the outside. The conductive connecting pinis secured to the pad exposed to the outside through the opening with a conductive adhesive agentso that solution of the conductive connecting pinfrom the substrate occurring, for example when mounting is performed is prevented.

Package substrate with a conductive connecting pin

An object of the present invention is to provide an optical transmission structural body capable of preferably transmitting an optical signal between an optical wiring and an optical waveguide irrespective of a shape of a portion of the optical wiring, the portion being connected to a core part of the optical waveguide. The optical transmission structural body of the present invention is constituted so that at least an optical wiring and an optical waveguide are connected to each other and an optical signal can be transmitted between a core of the optical wiring and a core part of the optical waveguide, wherein a portion of the optical wiring, the portion being connected to the core part of the optical waveguide, is not specially subjected to a planarization processing or has a surface roughness Ra based on JIS B 0601 of 0.1 &#x3bc;m or more.

Optical transmission structural body, optical waveguide, optical waveguide formation method, and optical wiring connection body

The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing. The present invention is related to a process for manufacturing multilayer printed circuit boards which comprises disposing an interlayer resin insulating layer on a substrate formed with a conductor circuit, creating openings for formation of via holes in said interlayer resin insulating layer, forming an electroless plated metal layer on said interlayer resin insulating layer, disposing a resist thereon, performing electroplating, stripping the resist off and etching the electroless plated metal layer to provide a conductor circuit and via holes, wherein the electroplating is performed intermittently using said electroless plated metal layer as cathode and a plating metal as anode at a constant voltage between said anode and said cathode.

Printed wiring board and its manufacturing method

A package substrateincorporating a substrate provided with a conductor layer, a conductive connecting pinarranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a padfor securing the conductive connecting pin is provided for the package substrate. The padis covered with an organic resin insulating layerhaving an openingthrough which the padis partially exposed to the outside. The conductive connecting pinis secured to the pad exposed to the outside through the opening with a conductive adhesive agentso that solution of the conductive connecting pinfrom the substrate occurring, for example when mounting is performed is prevented.

Conductive connecting pin for package substance

Printed wiring board with notched conductive traces

An object of the present invention is to provide an optical transmission structural body capable of preferably transmitting an optical signal between an optical wiring and an optical waveguide irrespective of a sh ape of a portion of the optical wiring, the portion being connected to a core part of the optical waveguide. The optical transmission structural body of the present invention is constituted so that at least an optical wiring and an optical waveguide are connected to each other and an optical signal can be transmitted between a core of the optical wiring and a core part of the optical waveguide, wherein a portion of the optical wiring, the portion being connected to the core part of the optical waveguide, is not specially subjected to a planarization processing or has a surface roughness Ra based on JIS B 0601 of 0.1 &#x3bc;m or more.

Conductive connecting pin and package substrate

Conductive connecting pins for a package substrate

Mesh holesandof upper solid layersand upper solid layersare formed to overlie on one another, so that the insulating properties of interlayer resin insulating layersare not lowered. Here, the diameter of each mesh hole is preferably 75 to 300 &#x3bc;m. The reason is as follows. If the diameter of the mesh hole is less than 75 &#x3bc;m, it is difficult to overlay the upper and lower mesh holes on one another. If the diameter exceeds 300 &#x3bc;m, the insulating properties of the interlayer resin insulating layers deteriorate. In addition, the distance between the mesh holes is preferably 100 to 2000 &#x3bc;m. The reason is as follows. If the distance is less than 100 &#x3bc;m, the solid layer cannot function. If the distance exceeds 2000 &#x3bc;m, the deterioration of the insulating properties of the interlayer resin insulating film occurs.

Multilayer build-up wiring board including a chip mount region

Method of manufacturing a multilayered printed circuit board

An electroplating process of electroplating an electrically conductive substrate is described. The process includes electroplating intermittently to a predetermined plating thickness using the substrate surface as a cathode and a plating metal as an anode at a constant voltage between the anode and the cathode by repeating application of a voltage between a cathode and an anode and interruption of the application alternately. It is described that a voltage time/interruption time ratio is 0.1 to 1.0, a voltage time is not longer than 10 seconds, and an interruption time is not less than 1 x 10seconds.

Electroplating process of electroplating an elecrically conductive sustrate

A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via hole. The interlayer insulating resin layer has a fibrous substrate. The via hole has an electrolytic plated film and an electrolessly plated film and connects the conductor layer of the board and the etched metal film.

Growing community of inventors

Ibi-gun, Japan

Naohiro Hirose