Du Pont Toray Company Limited

E.i. Dupont De Nemours and Company

Panasonic Corporation

Naofumi Yasuda

Kenji Uhara

Kouichi Sawasaki

Kazuhiro Nishikawa

Brian C Auman

Naomi Nishiki

John Donald Summers

Hiroki Ishikawa

Noriko Toida

Hirokazu Yokoyama

Provided is a graphite laminated body having excellent properties such as excellent mechanical properties, excellent heat resistance, and excellent thermal conductivity. In particular, provided is a graphite laminated body comprising a graphite film, a non-thermoplastic polyimide film, and an adhesive layer for bonding the graphite film to the non-thermoplastic polyimide film, the adhesive layer being made of a thermoplastic polyimide or a fluororesin.

Graphite laminated body

The purpose of the present invention is to provide a polyimide film with excellent passage characteristic, especially in an automatic optical inspection system (AOI), not to mention running characteristic (easy slip characteristic) and adhesion.

Polyimide film and method of manufacture thereof

The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4'-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate

A polyimide film is manufactured from a random copolymeric, block copolymeric or interpenetrating polymer network-type polyamic acid prepared from pyromellitic dianhydride in combination with 22 to 78 mol % of 4,4&prime;-oxydianiline and 22 to 78 mol % of 3,4&prime;-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

A polyimide film is produced by copolymerizing pyromellitic dianhydride in combination with phenylenediamine, methylenedianiline and 3,4&prime;-oxydianiline in a specific molar ratio. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Growing community of inventors

Tokai, Japan

Naofumi Yasuda