Murata Manufacturing Co., Ltd.

Naobumi Ikegami

Masahiro Wakashima

Yuta Saito

Kohei Shimada

Takashi Degura

A multilayer ceramic capacitor includes a multilayer body including dielectric ceramic layers laminated in the lamination direction, first and second main surfaces opposed in the lamination direction, first and second lateral surfaces opposed in a width direction, first and second end surfaces opposed in a length direction, a pair of external electrodes. The dielectric ceramic layers each include at least one selected from Ca, Zr, and Ti. The pair of external electrodes include first and second external electrodes respectively on the first and second lateral surfaces. A length direction is longer than the lamination direction or the width direction.

Multilayer ceramic capacitor

An electronic component is able to be mounted on a mounting substrate on which a first electronic component and a second electronic component are able to be mounted. When dimensions of the first electronic component and the second electronic component in a width direction is designated as Wand W, respectively, and dimensions of the first electronic component and the second electronic component in a length direction are designated as Land L, respectively, dimensions of the electronic component in the width direction and the length direction are any one of combinations of Wand L, and of Wand L. The electronic component includes a third laminate and a pair of third external electrodes. Each of the pair of third external electrodes includes a fired layer, and a resin layer provided on an external surface of the fired layer.

Electronic component

An electronic component is able to be mounted on a mounting substrate including a pair of first edge portions that faces each other, and a pair of second edge portions that is perpendicular or substantially perpendicular to the pair of first edge portions and faces each other. The mounting substrate has a structure that allows at least any one of the electronic component, a first electronic component, and a second electronic component, to be mounted thereon. When a dimension of the first electronic component in a length direction is designated as L1, a dimension of the first electronic component in a width direction is designated as W1, a dimension of the second electronic component in the length direction is designated as L2, and a dimension of the second electronic component in the width direction is designated as W2, a dimension of the electronic component in the width direction is any one of W1 and W2. A dimension of the electronic component in the length direction is L2 when the dimension of the electronic component in the width direction is W1, and is L1 when the dimension of the electronic component in the width direction is W2.

A mounting substrate on which at least any one of three kinds of electronic components including a first electronic component, a second electronic component, and a third electronic component are able to be mounted includes a pair of first edge portions and a pair of second edge portions. When a dimension of the first electronic component in its length direction is designated as La dimension of the first electronic component in its width direction is designated as Wa dimension of the second electronic component in its length direction is designated as Land a dimension of the second electronic component in its width direction is designated as Wa dimension of the third electronic component in its width direction is any one of Wand Wand a dimension of the third electronic component in its length direction is Lwhen the dimension of the third electronic component in its width direction is Wand is Lwhen the dimension of the third electronic component in its width direction is WAt least one or more of the third electronic components are mounted on the mounting substrate.

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Nagaokakyo, Japan

Naobumi Ikegami