Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Naoaki Sato

Shinichi Imai

The substrate processing apparatus relating to the present invention comprises a polishing section where wafers are sequentially arranged, and that has multiple polishing platens for polishing a metal film on the wafer surface in stages. The wafers are simultaneously conveyed between the polishing platens by a rotating head mechanism. Further, the wafers polished by the polishing platen for the final stage polishing are sequentially conveyed to a cleaning section and are cleaned. The wafers from the polishing section to the cleaning section are conveyed by a load-unload unit, a post-polishing wafer reversal unit and wet robots. Then, the operation of each part is controlled by an apparatus controller to start the cleaning processing of the polished wafers by the polishing platen for the final stage polishing within a predetermined time period from the completion of polishing by the polishing platen for the final stage polishing. With this control, corrosion to wiring containing corrodible metal, such as copper, can be assuredly prevented.

Substrate processing apparatus and substrate processing method

A semiconductor manufacturing apparatus includes: a hot plate that heats an article to be processed; a temperature control section that controls temperature of the hot plate; a main body control section that controls the entirety of the apparatus based on a process recipe; and an elevating mechanism that elevates the article to be processed above the hot plate. The semiconductor manufacturing apparatus further includes: a storage section that stores temperature data of the hot plate; an elevation control section that controls the elevating mechanism and sends elevation timing data to the storage section; a management range calculation section that calculates a management range corresponding to parameter behavior in a transient gradient state based on the temperature data, process recipe data, and the elevation timing data; and an abnormality detection section that detects apparatus abnormality with the use of the management range calculated by the management range calculation section.

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Toyama, Japan

Naoaki Sato