Murata Manufacturing Co., Ltd.

Naoaki Ogata

Hiroji Tani

Masahito Ishikawa

Akihiro Tsuru

Taketsugu Ogura

Toru Nakanishi

Toshihiro Suzuki

A method for producing a metal powder that includes a first step of uniformly arranging a metal compound on a metal particle, and a second step of converting the metal compound uniformly arranged on the metal particle into a complex metal compound. In the first step, a solution that contains at least one metal element and at least one group 4 element different from the metal element is prepared, the solution being adjusted to have a pH of 5 or less. The prepared solution is mixed with a reductant solution to coprecipitate the metal and the metal compound, thereby producing a slurry that contains a metal powder containing the metal combined with the metal compound. In the second step, a solution or a powder containing at least one second metal element is added to the slurry to convert the metal compound into the complex metal compound.

Metal powder, method for producing the same, conductive paste including metal powder, and multilayer ceramic electronic component

A conductive paste obtained by adding an organic solvent B to a vehicle containing a Ni powder, a binder resin component, and an organic solvent A. The Ni powder has an average primary particle size of 30 to 400 nm. The binder resin component is cellulose acetate butyrate. Organic solvent A is a solvent having a &#x394; &#x3b4; value of 11.5 or less with the cellulose acetate butyrate. Organic solvent B is a solvent having a &#x394; &#x3b4; value from 11.5 to 25.0 with the cellulose acetate butyrate. A ratio of the organic solvent B relative to a total of the organic solvent A and the organic solvent B is 5.0 to 40.0 wt %.

Conductive paste and ceramic electronic component

An inkjet ink that contains a functional particle having a BET-equivalent particle diameter of 50 to 1000 nm, a rheology-controlling particle having a BET-equivalent particle diameter of 4 to 40 nm, and an organic vehicle. The ink has a viscosity of 1 to 50 mPa&#xb7;s at a shear rate of 1000 s. At a shear rate of 0.1 s, the ink has a viscosity equal to or higher than a viscosity &#x3b7; calculated using the following equation: &#x3b7;=(D)&#xd7;&#x3c1;/10/2+80 [where &#x3b7; is the viscosity (mPa&#xb7;s) at a shear rate of 0.1 s, D is the BET-equivalent particle diameter (nm) of the functional particle, and &#x3c1; is the specific gravity of the functional particle].

Inkjet ink, printing method, and ceramic electronic component

A conductive paste that includes a (meth)acrylic resin serving as a binder resin, an organic solvent, and a metal powder. The (meth)acrylic resin has a glass transition point Tg in the range of &#x2212;60&#xb0; C. to 120&#xb0; C., a hydroxyl group content in the range of 0.01% to 5% by weight per molecule, an acid value in the range of 1 to 50 mgKOH/g, and a weight-average molecular weight in the range of 10,000 to 350,000 Mw.

Conductive paste, multilayer ceramic electronic component, and method for manufacturing same

Copper powder has a coating made of copper phosphate at the outer surface thereof. The coating is formed by chemically reacting the outer surface of the copper powder and covers the entire surface of the copper powder uniformly, thereby obtaining excellent anti-oxidizing properties. It is preferable to set the copper phosphate ratio in term of phosphorus with respect to the total weight of the copper powder within the range of about 0.05 to 0.5 wt %.

Copper powder coated with copper phosphate and copper paste containing

A method of producing copper powder having little variation in its particle size and an excellent monodispersion properties. A copper complex ion solution is prepared from a copper-containing solution and a complexing agent, then a reducing agent is added to the copper complex ion solution to precipitate metallic copper. The copper-containing solution herein contains copper sulfate, copper formate, copper pyrophosphate, copper chloride or copper carbonate and the complexing agent is at least one carboxylate or phosphate.

Production of copper powder

Metal copper powder having excellent dispersibility and small particle diameter deviation is manufactured by adding a reducing agent into a solution containing a copper compound and a dispersion agent to precipitate metal copper powder. The solution may further include ammonia so that copper ammonia complex ions exist in the solution. The dispersion agent is either a phosphate such as pyrophosphate, tripolyphosphate, tetrapolyphosphate, metaphosphate and hexametaphosphate or a water-soluble polymer such as naphthalenesulfonate formaldehyde polycondensate, polyvinyl alcohol, carboxymethylcellulose salts, arabic gum, adipate and polycarboxylate.

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Nagaokakyo, Japan

Naoaki Ogata