Fujitsu Corporation

Naoaki Nakamura

Takayoshi Matsumura

Norio Kainuma

Hidehiko Kira

Takashi Kubota

Kenji Fukuzono

Shunichi Kikuchi

Yuki Hoshino

Yoshihisa Iwakiri

Takumi Masuyama

Tsuyoshi Yamamoto

Akio Sugama

Makoto Suwada

Yasuhide Kuroda

Rie Takada

Kenichiro Tsubone

Yasuo Kawamura

Harumi Yagi

Sanae Iijima

Hiroshi Onuki

Osamu Higashi

An optical fiber mounting method that mounts a plurality of optical fibers on a substrate includes: bundling the optical fibers together with a bundling member; adjusting a height of the bundling member from a surface of the substrate or an angle of inclination of the bundling member relative to the surface of the substrate; bringing end faces of the optical fibers bundled with the bundling member into contact with end faces of optical waveguides on the substrate, the optical waveguides respectively corresponding to the optical fibers; and bonding the optical fibers to the substrate, in a state where the end faces of the optical fibers are in contact with the end faces of the optical waveguides.

Optical fiber mounting method and optical module

A composite bump includes a plurality of first bumps that is metal-bonded to an electrode pad of a semiconductor chip, and a second bump that is metal-bonded to the plurality of first bumps. A method for forming a composite bump, includes forming a plurality of first bumps to be metal-bonded to an electrode pad of a semiconductor chip, and forming a second bump to be metal-bonded to the plurality of first bumps.

Composite bump, method for forming composite bump, and substrate

An optical module includes a circuit board having, an electronic circuit formed therein and an optical circuit mounted thereon, and coupled to a first end of an inner optical fiber, a connector assembly to which a second end of the inner optical fiber is fixed, and a housing including a first housing including a slid surface on which a sliding surface included in the connector assembly slides so as to position the connector assembly, a second housing including an engaging protrusion engaged with the positioned connector assembly so as to fix the connector assembly, the second housing being bonded to the first housing and the housing being mounted with the circuit board.

Optical module and method of manufacturing the same

An optical module includes: a substrate including a through hole, a first chip including a first heating member and disposed in the through hole, a second chip including a second heating member and bonded to a first upper surface of the substrate and a second upper surface of the first chip via bumps, and a first heat sink adhered to a lower surface of the substrate with a first adhesive and adhered to a lower surface of the first chip with a second adhesive, wherein the substrate includes a slit which is provided on a side of a first portion, to which the second chip is bonded, of the substrate with respect to the through hole, and communicates with the through hole.

Optical module

A cooling plate that includes: a plate that is attached to a heat generating element; feed flow paths and return flow paths for coolant that are alternatingly arranged along a plate face of the plate; and a plurality of coolant flow paths that are formed in a plurality of levels within the plate closer to the heat generating element than the feed flow paths and the return flow paths, the plurality of coolant flow paths placing adjacent paths of the feed flow paths and the return flow paths in parallel communication through each of the levels.

Cooling plate and information processing device

An optical module includes a substrate, a silicon photonics chip disposed in an opening of the substrate, a control chip disposed across the substrate and the silicon photonics chip, a plurality of laser diodes disposed over the silicon photonics chip, and a metallic bar in contact with each of terminals of the plurality of laser diodes and electrically coupling each of the terminals with the silicon photonics chip or the substrate.

An optical module includes a first board that includes a recessed portion and a first conductor layer, a second board accommodated in the recessed portion and includes an optical waveguide and a second conductor layer, a semiconductor element installed across the first board and the second board and coupled to the first conductor layer and the second conductor layer, and a first bonding material disposed between a sidewall and a bottom surface of the recessed portion and the second board so as to bond the first board and the second board to each other.

Optical module and method of manufacturing optical module

An electronic device includes an electronic part including a first substrate having a group of first terminals over a first front surface and having a concavity in a back surface, a filler placed in the concavity, and a flat plate placed over the back surface with the filler therebetween, and further includes a second substrate disposed on the first front surface side of the first substrate and having a group of second terminals bonded to the group of first terminals over a second front surface opposite the first front surface. The filler and flat plate minimize deformation of the first substrate and variation in the distance between the group of first terminals and the group of second terminals caused by the deformation of the first substrate, which thereby reduces the occurrence of a failure in bonding together the group of first terminals and the group of second terminals.

Electronic device, electronic device fabrication method, and electronic apparatus

An optical module includes an optical element having a group of first pads which is formed on a first surface thereof, a substrate having a group of second pads which is formed on a second surface thereof facing the first surface so as to correspond to the group of first pads, respectively, and a group of solders that respectively bonds the group of first pads and the group of second pads to each other, wherein, in a plan view, the corresponding first and second pads partially overlap each other, and a center of gravity of the group of first pads coincides with a center of gravity of the group of second pads.

A cooling device that is thermally connected to a heat source and cools the heat source by means of a heat medium flowing inside the cooling device, includes: a first passage configured such that the heat medium before being heated by the heat source flows through the first passage; a second passage configured such that the heat medium after being heated by the heat source flows through the second passage; a plurality of heat exchanging chambers each configured such that in the heat exchanging chamber, the heat medium is heated by heat generated by the heat source; a first communicating passage provided in each of the plurality of heat exchanging chambers and configured such that through the first communicating passage, the first passage and the heat exchanging chamber communicate with each other; a second communicating passage provided in each of the plurality of heat exchanging chambers.

Cooling device and electronic apparatus

A thermal interface sheet includes a peripheral portion, in a surface direction, configured to have a melting point higher than the melting point of a central portion in the surface direction.

Method for manufacturing thermal interface sheet

A channel distribution type cooling plate where a space between a first coolant storage part for inflow of coolant and a second cooling storage part for outflow of coolant formed at the two ends of an upper space of a main body provided with a lower space for removing heat of a heat generating member is partitioned by a meandering type partition wall to form coolant distribution paths connected to the first coolant storage part and coolant collection paths connected to the second coolant storage part, the bottom of the coolant distribution paths and the coolant collection paths are communicated by a plurality of through holes with the lower space, and side surfaces of the partition wall at the coolant distribution path sides are formed with subchannels for running coolant from the first coolant storage part, in order to improve the cooling efficiency at the coolant outlet side.

Cooling plate and data processing system provided with cooling plates

A semiconductor device includes: a first semiconductor chip having a first antenna that is formed in a first hole provided in the first semiconductor chip, has an inclined surface inclined with respect to a central line of the first hole, and transmits and receives a radio wave; and a second semiconductor chip stacked over the first semiconductor chip, the second semiconductor chip having a second antenna that is formed in a second hole provided in the second semiconductor chip, has an inclined surface inclined with respect to a central line of the second hole, and transmits and receives a radio wave, wherein the first antenna and the second antenna are disposed so that the inclined surface of the first antenna and the inclined surface of the second antenna face each other.

Stacked three dimensional semiconductor device with in-circuit antenna

A method of repairing a semiconductor device includes turning a press member to apply pressure on an electronic component which is mounted on a substrate. A heat sink which is provided on the electronic component via a bonding layer is thus displaced with respect to the electronic component in a transverse direction. The heat sink is removed from the electronic component by shearing the bonding layer with the press member.

Heat sink device and method of repairing semiconductor device

According to an aspect of an embodiment, a high-sensitive resistance measuring device of solder bumps comprises a resistance variation detection unit which detects a differential voltage (&#x394;V=V&#x2212;V), which is obtained by subtracting a second voltage (V) generated in a reference bump connection unit by a constant current (I) from a second constant current source from a first voltage (V) generated in a monitored bump connection unit by the constant current I from a first constant current source, as a resistance variation voltage representing a resistance variation (&#x394;R) of the monitored bump connection unit.

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Kawasaki, Japan

Naoaki Nakamura