The Furukawa Electric Co., Ltd.

Naoaki Mihara

Jirou Sugiyama

Tetsuya Mieda

Noriyuki Kirikae

Kunihiko Ishiguro

Toshimitsu Nakamura

Keiji Saito

Masami Aoyama

Takumi Asanuma

Yasushi Ishizaka

Shunichiro Sato

The electrically conductive adhesive agent composition comprises a metal particle (Q) and a prescribed organophosphorus compound (A), and the metal particle (Q) comprises a first metal particle (Q1) made of a single metal selected from the group of copper, nickel, aluminum and tin or an alloy comprising two or more metals selected from said group.

Electrically conductive adhesive agent composition, and electrically conductive adhesive film and dicing-die-bonding film using the same

The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and at least one of a prescribed organic phosphine (A) and a prescribed sulfide-based compound (B), the resin (M) comprises a thermosetting resin (M1), and has a storage elastic modulus at 1 Hz measured in a state after sintering of 20 GPa or less and a thermal weight loss ratio when heated for 2 hours at 250&#xb0; C. under a nitrogen atmosphere of less than 1%.

Electrically conductive adhesive film and dicing-die bonding film using the same

The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and a prescribed organophosphorus compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (Q) has an average particle size (d50) of 20 &#x3bc;m or less and comprise 10% by mass or more of a first metal particle (Q1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.

The electrically conductive adhesive film comprises a metal particle (P), a resin (M) and a prescribed sulfide compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (P) has an average particle size (d50) of 20 &#x3bc;m or less and comprises 10% by mass or more of a first metal particle (P1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.

The electrically conductive adhesive film comprises a metal particle (P) and a resin (M), the resin (M) comprises a thermosetting resin (M1), and the metal particle (P) has an average particle size (d50) of 20 &#x3bc;m or less and comprises 10% by mass or more of a first metal particle (P1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.

A composition exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. An electrically conductive composition contains at least a sulfide compound represented by R&#x2014;S&#x2014;R' (wherein R is an organic group containing at least carbon; R&#x2032; is an organic group that is the same as or different from R; and R and R&#x2032; may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film each are produced using the electrically conductive composition. A dicing die bonding film is obtained by bonding the conductive bonding film with an adhesive tape.

Electrically conductive composition

A filler material for an organic electroluminescent element, formed of a resin composition being liquid at 25&#xb0; C., and containing a organometallic compound and a hydrocarbon polymer having a number average molecular weight of 300 or more and less than 20,000, and an iodine value less than 40 g/100 g, and having no polar group, wherein a contact angle to silicon nitride is 10 to 40 degrees, and an amount of outgassing other than moisture upon being heated at 85&#xb0; C. for 1 hour is 500 ppm or less in terms of a toluene equivalent, and a method of sealing an organic electroluminescent element using the same.

Filler material for organic electroluminescent element and method of sealing organic electroluminiscent element

Provided are a resin composition for element encapsulation for organic electronic devices which is transparent, has excellent flexibility, water vapor barrier properties, and adhesive force, and can suppress the generation of dark spots, a resin sheet for element encapsulation for organic electronic devices, an organic electroluminescent element, and an image display device. This adhesive resin composition for element encapsulation for organic electronic devices is used to seal an element for organic electronic devices, and is characterized by containing a diene polymer and a softening agent, in which the content of the softening agent is from 5% by mass to 30% by mass of the total mass.

Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display device

A resin composition for sealing an organic electroluminescent element, containing: at least one epoxy compound; at least one polyester resin; and at least one Lewis acid compound or at least one compound which generates a Lewis acid, in which the content of the epoxy compound is from 10 to 200 parts by mass with respect to 100 parts by mass of the polyester resin.

Resin composition for sealing organic electroluminescent element, sealing film for organic electroluminescent element, gas-barrier film for organic electroluminescent element, and organic electroluminescent element using these films

A filler material for an organic electroluminescent element, formed of a resin composition being liquid at 25&#xb0; C., and containing a hydrocarbon polymer having a number average molecular weight of 300 or more and less than 32,000 and an organometallic compound represented by M-L(wherein, M represents a metal atom; L represents an organic group having 9 or more carbon atoms and 1 or more oxygen atoms, and all of L represent the same organic group; and n represents the valence of a metal atom M), wherein a contact angle to silicon nitride is 10 to 40 degrees, and an amount of outgassing other than moisture upon heating at 85&#xb0; C. for 1 hour is 500 ppm or less in terms of a toluene equivalent, and a method of sealing an organic electroluminescent element using the same.

Filler material for organic electroluminescent element and method of sealing organic electroluminescent element

A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y&#x3c;162, 

Transparent resin composition for sealing organic electroluminescence element, resin sheet for sealing organic electroluminescence element, and apparatus for displaying image

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Tokyo, Japan

Naoaki Mihara