The Yokohama Rubber Co., Ltd.

Nao Sato

Kazunori Ishikawa

Tsubasa Okuno

Hiroyuki Hosoda

Atsushi Onozato

A curing accelerator for epoxy resin compositions, which is used in a one-pack type epoxy resin composition having excellent storage stability and rapid curability. The curing accelerator for epoxy resin compositions contains a microcapsule type curing accelerator wherein a compound represented by formula (I) is encapsulated by a thermosetting resin. (In formula (I), Rand Reach represents a hydrogen atom or an alkyl group.) 

Curing accelerator for epoxy resin composition, and one-pack type thermosetting epoxy resin composition

This invention relates to an epoxy resin composition which has better adhesive performance and flexibility at low temperatures (about &#x2212;20&#xb0; C.) to normal temperature as well as elevated temperatures (about 80&#xb0; C.) and is suitable for use as a structural adhesive. The epoxy resin composition includes 100 mass parts epoxy resin, 5 to 100 mass parts core-shell particles, and a curing agent. 1 to 50 mass % of the epoxy resin is a urethane-modified epoxy resin and the core-shell particles include acrylonitrile in the monomer used during the production of the shell layer, and/or comprise a structure having at least three layers of a core layer, an interlayer, and a shell layer.

Composition of epoxy resin, core-shell particles and curing agent

An electroconductive composition including silver oxide (A) and silver salt of a fatty acid (B) containing at least one hydroxy group is provided. The electroconductive composition is capable of forming an electroconductive film at a low temperature and in a short period. The electroconductive composition is capable of adequately forming an electroconductive film on a substrate having a low heat resistance.

Electroconductive composition, method for forming electroconductive film, and electroconductive film

An electroconductive composition including (A) silver oxide; and (B) a secondary aliphatic acid silver salt produced by using a secondary aliphatic acid having a boiling point of not higher than 200&#xb0; C. will be capable of forming an excellent electroconductive film in a short time on a substrate having a low heat resistance. An electroconductive composition including (A) silver oxide; (B') a secondary aliphatic acid silver salt whose secondary aliphatic acid contains up to 7 carbon atoms; (C1) a aliphatic acid containing at least 8 carbon atoms and/or (C2) a aliphatic acid silver salt whose aliphatic acid contains at least 8 carbon atoms; and (D) a solvent and/or a plasticizer has an excellent thixotropy and can be formed into an electroconductive film having a low electric resistance even after having been heated for a short time.

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Hiratsuka, Japan

Nao Sato