Westinghouse Electric Corporation

Nancy W Carlson

Dean C Westervelt

Luciano C Scala

Howard E Saunders

George D Dixon

Disclosed is a solventless UV dryable B-stageable epoxy adhesive which comprises about 40 to about 70 pbw of a solid thermally curable epoxy having a molecular weight between about 650 and about 4000, a thermal curing agent for the thermally curable epoxy which is stable at room temperature and soluble on the adhesive in an amount of about stoichiometric to about 50% by weight in excess of stoichiometric, up to about 2 pbw of an accelerator for the thermal curing agent which is soluble in the adhesive, about 25 to about 60 pbw of a liquid UV curable resin having a molecular weight of less than about 700 which is either an epoxy, an acrylic, or a mixture thereof and which is a diluent for the thermally curable epoxy, about 1 to about 10 pbw of a UV photoinitiator for the UV curable resin, up to about 20 pbw of a reactive diluent, up to about 5 pbw of a flow control agent, up to about 1 pbw of a surfactant, and up to about 10 pbw of a tri or higher functional epoxy.

Solventless UV dryable B-stageable epoxy adhesive

An imide containing polymeric coating is electrophoretically formed on wire from an emulsion. The emulsion contains a polymer, an organic aprotic solvent for the polymer, an amine, and a polar precipitant in which the polymer is insoluble. The wire is passed through a conductive tube immersed in the solvent while a D.C. current is applied between the tube and the wire. The polymer coating on the wire is then cured.

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Murrysville, PA, United States of America

Nancy W Carlson