General Electric Company

Ge Global Sourcing LLC

Nancy Cecelia Stoffel

Emad Andarawis Andarawis

David Richard Esler

Cheng-Po Chen

Christopher James Kapusta

Paul Alan McConnelee

Arun Virupaksha Gowda

Jeffrey Michael Ashe

Stephen Daley Arthur

Glen William Brooksby

Cynthia Elizabeth Landberg Davis

Risto Ilkka Tuominen

Tzu-Jen Kao

Aghogho Atemu Obi

Guangliang Zhao

Daniel Leroy Olson

Christopher Gushee

Jeffrey Mayton

Wyatt Smith

Liangchun Yu

Radislav Alexandrovich Potyrailo

Mark Bradshaw Kraeling

Glenn Robert Shaffer

Joseph Alfred Iannotti

Christopher Michael Puleo

Robert C Davis

Yizhen Lin

Christopher Fred Keimel

Juha Virtanen

Matthew Jeremiah Misner

Kaustubh Ravindra Nagarkar

Yongjae Lee

Ralf Lenigk

Timo J Toivanen

Richard Vanfleet

Otto Valtteri Pekander

Andrew A Burns

Craig Patrick Galligan

Azar Alizadeh

Jose Luis Virgen

Guohai Chen

Obi Aghogho

Jose Luis R Virgen

Robert Santala

Paul Alan Mcconnelee

Risto Llkka Tuominen

A neuroactivity monitoring system includes a camera configured to acquire image data of a patient positioned on the patient support and a monitoring device in communication with the camera. The monitoring device uses the acquired image data of the camera to identify and track patient landmarks, such as facial and/or posture landmarks, and, based on the tracked movement, characterize patient neuroactivity.

System and method for neuroactivity detection in infants

A semiconductor device is provided. The semiconductor device includes an electric field (E-field) suppression layer formed over a termination region. The E-field suppression layer is patterned with openings over metal contact areas. The E-field suppression layer has a thickness such that an electric field strength above the E-field suppression layer is below a dielectric strength of an adjacent material when the semiconductor device is operating at or below a maximum voltage.

High voltage semiconductor devices having improved electric field suppression

A system for monitoring medical conditions includes a conformable medical monitoring device that includes a first substrate layer, which includes an electronics module, many signal traces, and at least one electrode, such that one or more of the many signal traces electrically couple the at least one electrode to the electronics module. The conformable medical monitoring device includes a second substrate layer positioned over the electronics module, the first substrate layer, or any combination thereof to insulate the electronics module, the first substrate layer, or any combination thereof. The conformable medical monitoring device also includes a third substrate layer positioned over the second substrate layer, such that the third substrate layer reduces electromagnetic interference caused by a voltage pulse and includes an adjustable system coupled to the first substrate layer and that changes a position of the at least one electrode relative to the electronics module.

Systems and methods for shielded and adjustable medical monitoring devices

A sensor assembly includes a die substrate and a metalized layer formed on the die substrate. The metalized layer is formed of a first metal material and includes a bonding pad to facilitate electrically coupling the sensor assembly to a sensor system. A remetalized bump is formed on the bonding pad of a second metal material and is electrically coupled to the metalized layer. An adhesive is applied to the remetalized bump and facilitates mechanically coupling the sensor assembly to the sensor system.

Sensor systems and methods for providing sensor systems

In accordance with the present disclosure, voltage sensing techniques using a voltage sensing device are employed to identify sources of electromagnetic radiation and provide warnings to a user about high levels of electromagnetic radiation. By way of example, the voltage sensing device may be a wearable device and may provide auditory, visual, and tactile alerts to a user.

Systems and methods for wearable voltage sensing devices

An electronics package is disclosed herein that includes a glass substrate having an exterior portion surrounding an interior portion thereof, wherein the interior portion has a first thickness and the exterior portion has a second thickness larger than the first thickness. An adhesive layer is formed on a lower surface of the interior portion of the glass substrate. A semiconductor device having an upper surface is coupled to the adhesive layer, the semiconductor device having at least one contact pad disposed on the upper surface thereof. A first metallization layer is coupled to an upper surface of the glass substrate and extends through a first via formed through the first thickness of the glass substrate to couple with the at least one contact pad of the semiconductor device.

Power electronics package and method of manufacturing thereof

Methods of fabricating a semiconductor device are provided. The method includes providing a plurality of semiconductor devices. The method further includes disposing a dielectric dry film on the plurality of semiconductor devices, wherein the dielectric dry film is patterned such that openings in the patterned dielectric dry film are aligned with conductive pads of each of the plurality of semiconductor devices.

Methods of fabricating high voltage semiconductor devices having improved electric field suppression

A device for detecting proximity to an active alternating current (AC) voltage source is provided. The device includes a housing, at least one antenna configured to generate a signal in response to exposure to electromagnetic radiation, signal processing circuitry configured to process the signal generated by the at least one antenna, a microprocessor configured to determine, from the processed signal, whether the alert device is proximate to the active AC voltage source, a communication device configured to generate a signal in response to a determination that the alert device is proximate the active AC voltage source, and an interference reduction device configured to discharge an accumulated charge on the alert device to reduce electromagnetic interference from sources other than the active AC voltage source.

Mining detection system and method

The present approach relates to the fabrication and use of a probe array having multiple individual probes. In one embodiment, the probes of the probe array may be functionalized such that certain of the probes are suitable for electrical sensing (e.g., recording) or stimulation, non-electrical sensing or stimulation (e.g., chemical sensing and/or release of biomolecules when activated), or a combination of electrical and non-electrical sensing or stimulation.

Multimodal probe array

A voltage detection device for detecting proximity to an active alternating current (AC) voltage source is provided. The device includes a housing, at least one antenna configured to generate a signal in response to exposure to electromagnetic radiation, signal processing circuitry configured to process the signal generated by the at least one antenna, a processing device embedded in the housing and communicatively coupled to the signal processing circuitry, the processing device configured to determine, from the processed signal, whether the voltage detection device is proximate to the active AC voltage source, and an electronic switch embedded in the housing and one of included within the processing device and communicatively coupled to the processing device, the electronic switch configured to reduce an impact of interference on detection of the active AC voltage source.

Systems and methods for wearable voltage detection devices

A passive wireless sensor having a plurality of dielectric layers, an antenna, a diaphragm, and a feeding element is provided. Further, the antenna is disposed in at least a portion of a cavity formed by one or more dielectric layers of the plurality of dielectric layers. Moreover, the diaphragm is disposed on the cavity. Additionally, the feeding element is disposed in at least a portion of the plurality of dielectric layers. Also, the feeding element is operatively coupled to the antenna.

Passive wireless sensors

Growing community of inventors

Schenectady, NY, United States of America

Nancy Cecelia Stoffel