International Business Machines Corporation

Nancy A Wier-Cavalieri

Jawahar P Nayak

Michael E Cropp

John M Wargo

Charles W Hunter, Jr

Benjamin V Fasano

Raschid Jose Bezama

Robert Anthony Rita

Rao Venkateswara Vallabhaneni

Gregory M Johnson

Michael A Cohn

Metal pastes used in the fabrication of multilayer ceramic (MLC) substrates used in semiconductor devices. The pastes reduce substrate defects, such as via bulge and camber. The pastes are comprised of a metal having high conductivity, frit which includes glass, an organic binder, and a solvent, optionally with a surfactant.

Pastes for improved substrate dimensional control

Deformation of vias and shorting between vias during screening of conductive paste onto greensheets wider than 185 mm is avoided by a concentration of thixotropic agent in the conductive paste formulation to a concentration which raises the thixotropic index of the paste to within 5% to 25% of the maximum achievable thixotropic index for the organic vehicle in the paste. For a paste containing molybdenum powder in which the organic vehicle is a mixture of ethyl cellulose, texanol and oleoyl sarcosine, this criterion corresponds to a concentration of glycerl tri(-12-hydroxystearate) in the range of 1.4% to 1.8% by weight.

Conductive paste for large greensheet screening including high

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Highland, NY, United States of America

Nancy A Wier-Cavalieri